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2. 发明公开

EP2801862A2 TRANSPARENT SUBSTRATE INCLUDING FINE METAL LINE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：透明质酸酯麻醉药物METERLINIE UND VERFAHREN ZUR HERSTELLUNG DAVON
公开(公告)号：EP2801862A2
公开(公告)日：2014-11-12
申请号：EP14733955.0
申请日：2014-03-07
申请人： LG Chem, Ltd.
发明人： BAE, Sung-Hak , HAN, Sang-Choll , KIM, Byong-Mook
IPC分类号： G03F7/00
CPC分类号： H05K1/0296 , G03F7/00 , H05B3/12 , H05B3/84 , H05B2203/017 , H05K1/0274 , H05K1/0313 , H05K1/09 , H05K3/0023 , H05K3/0044 , H05K3/04 , H05K3/045 , H05K3/146 , H05K3/38 , H05K2201/0108 , H05K2201/0129 , H05K2201/0317 , H05K2201/09036 , H05K2203/0108
摘要： The present disclosure relates to a transparent substrate including: a resin pattern layer including a plurality of grooves respectively including side surfaces and a bottom surface; and, a conductive layer formed within the grooves, wherein a line width of the conductive layer is 0.1µm to 3µm and an average height of the conductive layer is 5% to 50% of a maximum depth of each of the grooves, and a manufacturing method thereof, such that simplicity in a manufacturing process and a consecutive process are enabled, manufacturing costs are inexpensive, and a transparent substrate having superior electrical conductivity and transparency characteristics is manufactured.
摘要翻译：本公开涉及一种透明基板，包括：树脂图案层，包括分别包括侧表面和底表面的多个凹槽; 以及形成在所述槽内的导电层，其中，所述导电层的线宽为0.1μm〜3μm，所述导电层的平均高度为所述槽的最大深度的5〜50％，制造方法，使得制造过程和连续工艺的简单性得以实现，制造成本便宜，并且制造具有优异的导电性和透明度特性的透明基板。

3. 发明公开

EP2235741A1 PROCESSING OF ELECTRIC AND/OR ELECTRONIC ELEMENTS ON CELLULOSIC MATERIAL SUBSTRATES 有权
标题翻译：电气和/或电子元件的纤维素有基板制造
公开(公告)号：EP2235741A1
公开(公告)日：2010-10-06
申请号：EP09705170.0
申请日：2009-01-30
申请人： Ydreams - Informática, S.a. , Faculdade De Ciências E Tecnologia Da Unl
发明人： FORTUNATO, Elvira Maria Correia , MARTINS, Rodrigo Ferrão de Paiva , CÂMARA, António da Nóbrega de Sousa da
IPC分类号： H01L21/283
CPC分类号： H01L21/283 , H01L51/0097 , H05K1/0313 , H05K1/0386 , H05K3/146 , H05K3/381 , H05K2201/0284 , H05K2203/095 , Y02E10/549 , Y02P70/521
摘要： The present invention consists of the direct deposition over paper of electric and electronic elements, single or integrated, including at nano-scale. The deposition, by virtue of the materials and scale utilized, is furthermore transparent, which allows the application of the present invention in the domain of graphic arts. The deposition is executed at close-to-ambient temperatures, an in a less controlled environment than that of traditional deposition processes. Furthermore, the low cost of printing obtained allows for the application of electronic paper to large surfaces.

4. 发明授权

EP1518145B1 CELLULE D AFFICHAGE, NOTAMMENT A CRISTAL LIQUIDE, OU CELLULE PHOTOVOLTAIQUE COMPRENANT DES MOYENS POUR SA CONNEXION A UN CIRCUIT ELECTRONIQUE DE COMMANDE 有权
标题翻译： CELLULE D AFFICHAGE，NOTAMMENT A CRISTAL LIQUIDE，OU CELLULE PHOTOVOLTAIQUE COMPRANANT DES MOYENS POUR SA CONNEXION A UN CIRCUIT ELECTRONIQUE DE COMMANDE
公开(公告)号：EP1518145B1
公开(公告)日：2005-12-14
申请号：EP03740263.3
申请日：2003-06-17
申请人： ASULAB S.A.
发明人： GRUPP, Joachim , KLAPPERT, Rolf
IPC分类号： G02F1/1345 , G02F1/13
CPC分类号： C23C14/225 , G02F1/13452 , H05K3/146 , H05K3/403
摘要： The invention concerns an electro-optical display cell (1; 18), in particular a liquid crystal, or an electrochemical photovoltaic cell comprising at least: one transparent front substrate (2; 20) whereof the upper surface constitutes the front surface (14) of the cell (1; 18); at least one rear substrate (8; 22) likewise transparent or not whereof the lower surface (12; 31) constitutes the rear surface of said cell (1; 18); a sealing frame (36) assembling the front (20) and rear (22) substrates and delimiting a volume (38) for sealed confinement of an electric-optically or photo-electrically active medium; said front (20) and rear (22) substrates comprising on the opposite surfaces at least one electrode (24, 26) each, said electrodes (24, 26) being designed to be connected through strip conductors (16; 30, 34) to an electric power or control circuit (10; 56) and urged to define the lateral electric contact zones (28, 32). Said cell is characterized in that the strip conductors (30, 34) consist each of a first portion (30a, 34a) in contact with the electrodes at the lateral electric contact zones (28, 32), and a second portion (30b, 34b) extending on the rear surface (31) of the cell (18), contact means continuously or discontinuously arranged on the edge (27) and/or on the rear (12; 31) of said cell (1; 18) ensuring electric junction between the first (30a, 34a) and the second (30b, 34b) portions of the strip conductors (30, 34).
摘要翻译：本发明涉及一种电光显示器单元（1; 18），特别是液晶或电化学光伏电池，其至少包括：一个透明前基板（2; 20），其上表面构成前表面（14）（1; 18）; 至少一个后基片（8; 22）同样是透明的或者不是下表面（12; 31）构成所述电池（1; 18）的后表面; 组装前基板和后基板并限定用于密封限制电光或光电活性介质的容积的密封框架; 所述前基板和所述后基板在相对的表面上包括至少一个电极，所述电极分别被设计为通过带状导体连接到所述电极，一个电力或控制电路（10; 56）并被推动以限定横向电接触区域（28,32）。所述单元的特征在于，所述带状导体（30,34）包括在所述横向电接触区域（28,32）处与所述电极接触的第一部分（30a，34a）和第二部分（30b，34b））在电池（18）的后表面（31）上延伸，接触装置连续或不连续地布置在所述电池（1; 18）的边缘（27）和/或后部（12; 31）上，在所述带状导体（30,34）的所述第一部分（30a，34a）和所述第二部分（30b，34b）之间。

5. 发明公开

EP1191555A3 Formation of an embedded capacitor plane using a thin polyimide dielectric 审中-公开
标题翻译：嵌入式电容器的制造在一个平面具有薄的聚酰亚胺电介质
公开(公告)号：EP1191555A3
公开(公告)日：2004-12-29
申请号：EP01120000.3
申请日：2001-08-18
申请人： Oak-Mitsui, Inc.
发明人： Andresakis, John A. , Skorupski, Edward C. , Zimmerman, Scott , Smith, Gordon
IPC分类号： H05K1/16 , H01G4/20
CPC分类号： H05K1/162 , H05K3/146 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309
摘要： A capacitor, which is comprised of a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.
摘要翻译：它由一对导电的的电容器，所有箔每一个具有在其表面上的介电层，worin介电层被附接至彼此。在用于其生产一种方法中，一个电容器是由到第一导电箔的一个表面上施加一个第一介电层形成的; 施加第二电介质层到第二导电箔的表面上; 然后将第一和第二介电层连接到彼此。所得电容器表现出优异的耐空隙。

6. 发明公开

EP1190111A2 METHOD OF COATING CERAMICS USING CCVD 有权
标题翻译：方法为陶瓷的CCVD涂层
公开(公告)号：EP1190111A2
公开(公告)日：2002-03-27
申请号：EP00943355.8
申请日：2000-06-29
申请人： MicroCoating Technologies, Inc.
发明人： HUNT, Andrew, Tye , MCENTYRE, John, Eric , NEUMAN, George, Andrew , VINSON, Matthew, Scott
IPC分类号： C23C16/453 , C23C16/513 , C23C16/46
CPC分类号： C03B29/08 , C03C17/002 , C03C17/245 , C03C17/2453 , C03C2217/211 , C03C2217/216 , C03C2217/228 , C03C2217/231 , C03C2217/241 , C03C2218/152 , C23C16/453 , C23C16/46 , C23C16/54 , H05K3/12 , H05K3/146
摘要： Methods for producing coatings on a glass substrate using combined chemical vapor deposition or other heat concentrated deposition (CHD) techniques. The term 'glass' in this context is defined as those materials that crack, break or are otherwise damaged prior to plastic deformation of the material. In combustion chemical vapor deposition CCVD, a reagent and a carrier solution are mixed together to form a reagent mixture. The reagent mixture is then ignited to create a flame (14, 16), or alternatively, the reagent mixture may be fed to a plasma torch or other heat source. The combustion source may vaporize at least part of the reagent, the vapor phase of the reagent contacting the surface of the substrate (A) to be coated. In this manner, a film or coating is formed on the glass substrate (A). In some of the disclosed methods, the glass substrate (A) may be preheated, to avoid differential heating of the glass by the combustion source. Various methods of reducing the differential heating are disclosed. This differential heating may cause thermal shock or breakage of the glass substrate (A).

7. 发明公开

EP0446112A1 Connecteur élastomérique pour circuits intégrés ou analogues, et son procédé de fabrication 失效
标题翻译：用于集成电路或类似安排及其制造方法的弹性体连接。
公开(公告)号：EP0446112A1
公开(公告)日：1991-09-11
申请号：EP91400573.1
申请日：1991-03-01
申请人： FRANCE TELECOM
发明人： Schiltz, André , Bouzid, Marie-Jeanne
IPC分类号： H01L23/538 , H01L23/498 , H01L21/48
CPC分类号： H05K3/107 , H01L21/4846 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H05K3/0041 , H05K3/048 , H05K3/146 , H05K3/16 , H05K3/467 , H05K2201/0376 , H05K2201/09036 , Y10S428/901 , Y10T29/49204 , Y10T428/24917 , H01L2924/00
摘要： Connecteur élastomérique pour circuits intégrés ou analogues, comprenant un support (10) de matière élastomère sur une face (12) duquel est formé un réseau dense de lignes électro-conductrices (14). Des techniques de photogravure et de dépôt de métal sur une couche de matière décollable utilisées pour la fabrication des circuits intégrés, permettent de donner une très faible largeur et une conductivité très élevée aux lignes (14).
L'invention s'applique notamment à la connexion et aux tests des circuits intégrés et des circuits hybrides.
摘要翻译：用于集成电路或类似物上的所有一个面（12），其上形成的导电线（14）的致密的网络，其包括弹性体材料制成的支承件（10）弹性连接器。光刻和可拆卸的材料，其被用于集成电路的制造中的一个层上沉积金属的技术，使非常小的宽度和非常高的导电性被赋予所述线（14）。 ... 在本发明中特别适用于集成电路的混合电路的连接和测试。 ... ...

8. 发明公开

EP0298345A3 Method for preparing substrates for subsequent electroless metallization 失效
标题翻译：用于制备用于后续电镀金属化的基板的方法
公开(公告)号：EP0298345A3
公开(公告)日：1990-04-11
申请号：EP88110292.5
申请日：1988-06-28
申请人： International Business Machines Corporation
发明人： Clarke, Thomas Carl , Kovac, Caroline Ann , Jung, Dae Young , Park, Jae Myung , Thomas, Richard Ronald
IPC分类号： C23C16/18 , C23C16/04 , H01L21/02
CPC分类号： C23C18/2033 , C23C16/04 , C23C16/18 , C23C18/1605 , C23C18/1608 , C23C18/1865 , C23C18/1893 , C23C18/2006 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/42 , H05K3/146 , H05K3/181 , H05K3/184
摘要： A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer.

9. 发明公开

EP0291444A1 Herstellung von Polymer-Metallverbindungen durch Abscheidung in Glimmentladungszonen 失效
标题翻译： Herstellung von Polymer-Metallverbindungen durch Abscheidung in Glimmentladungszonen。
公开(公告)号：EP0291444A1
公开(公告)日：1988-11-17
申请号：EP88730112.5
申请日：1988-05-10
申请人： SCHERING AKTIENGESELLSCHAFT
发明人： Suhr, Harald, Prof. Dr. rer. nat. , Etspüler, Angelika, Dipl.-Chem. , Feurer, Ernst, Dipl.-Chem. , Oehr, Christian, Dipl.-Chem.
IPC分类号： C23C16/18 , C04B41/49
CPC分类号： H05K3/146 , C03C17/3417 , C04B41/49 , C04B41/5188 , C23C16/18
摘要： Die Erfindung betrifft ein Verfahren zum Herstellen von elektrisch leitfähigen Polymer-Metallverbindungen auf anorganischen oder organischen Substraten, dadurch gekennzeichnet, daß das Substrat in einer Glimmentladungszone der Einwirkung einer gasförmigen metallorganischen Verbindung und einer gasförmigen organischen Verbindung ausgesetzt wird.
摘要翻译：在无机或有机衬底上的导电聚合物 - 金属化合物是通过使辉光放电区中的衬底经受气态金属 - 有机化合物和气体有机化合物的作用来制备的。

10. 发明公开

EP0282285A2 A method of metallization for a nitride ceramic member 失效
标题翻译： Verfahren zur Metallisierung eines nitrid-keramischen Gegenstandes。
公开(公告)号：EP0282285A2
公开(公告)日：1988-09-14
申请号：EP88302049.7
申请日：1988-03-09
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Takeda, Hiromitsu c/o Patent Division , Nakahashi, Masako c/o Patent Division , Shirokane, Makoto c/o Patent Division , Yamazaki, Tatsuo c/o Patent Division
IPC分类号： C04B41/88 , C04B41/87
CPC分类号： C04B41/009 , C04B41/5062 , C04B41/5127 , C04B41/5144 , C04B41/52 , C04B41/87 , C04B41/88 , C04B41/89 , H01L21/4846 , H05K1/0306 , H05K3/146 , H05K3/388 , C04B41/4515 , C04B41/4572 , C04B41/51 , C04B41/5111 , C04B35/58
摘要： A nitride ceramic member (14) is maintained at a vacuum of 1 x 10⁻⁴ Torr or less at a temperature of 1,100°C or more, and a metal vapor is brought into contact with the surface of the nitride ceramic member. A nitride is reacted with the metal in the surface portion of the ceramic member (14), and a metallized layer is formed on the surface of the member. If AℓN is used as a nitride ceramic material (14), the AℓN member is maintained at the vacuum at the high temperature and a Ti vapor is brought into contact with the surface of the AℓN member to form a TiN coating layer on the surface of the AℓN member. A BN or graphite mask is formed on the surface of the nitride ceramic member and the above method is practiced to selectively form a metallized layer on the non-masked member surface. By selectively forming a metallized layer by using AℓN, a highly thermal-conductivity substrate (20) having a conductive layer (22) formed on the AℓN base can be prepared.
摘要翻译：氮化物陶瓷构件（14）在1100℃或更高的温度下保持在1×10 -4乇或更小的真空，并使金属蒸气与氮化物陶瓷的表面接触会员。氮化物与陶瓷构件（14）的表面部分中的金属反应，并且在构件的表面上形成金属化层。如果使用Al N作为氮化物陶瓷材料（14），则将Al N成员在高温下保持在真空状态，并使Ti蒸气与AlN成员的表面接触以形成TiN 涂层表面上的Al N成员。在氮化物陶瓷构件的表面上形成BN或石墨掩模，并且实施上述方法以在非掩模构件表面上选择性地形成金属化层。通过使用A l N选择性地形成金属化层，可以制备在A11N基上形成有导电层（22）的高导热性衬底（20）。

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