专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP3056343A4 FLUORINE RESIN BASE MATERIAL, PRINTED WIRING BOARD, AND CIRCUIT MODULE 有权
标题翻译： FLUORHARZBASISMATATIALIAL，LEITERPLATTE UND SCHALTUNGSMODUL
公开(公告)号：EP3056343A4
公开(公告)日：2017-09-27
申请号：EP14852835
申请日：2014-10-08
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS INC , SUMITOMO ELECTRIC INDUSTRIES
发明人： KIYA SATOSHI , UEHARA SUMITO , MIURA KOUSUKE , NAKABAYASHI MAKOTO
IPC分类号： B32B27/30 , B32B7/12 , B32B27/32 , C08J7/12 , H05K1/02 , H05K1/03 , H05K3/00 , H05K3/06 , H05K3/28 , H05K3/38 , H05K13/00
CPC分类号： B32B27/322 , B32B7/12 , B32B27/30 , B32B2457/08 , H05K1/024 , H05K1/0274 , H05K1/034 , H05K1/0366 , H05K3/007 , H05K3/067 , H05K3/20 , H05K3/281 , H05K3/285 , H05K3/386 , H05K3/389 , H05K2201/0108 , H05K2201/015 , H05K2201/0158 , H05K2201/0191 , H05K2201/0195 , H05K2201/0326 , H05K2201/09781 , H05K2201/2009 , H05K2203/0264 , H05K2203/0278 , H05K2203/0376 , H05K2203/0769 , H05K2203/1173
摘要： A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.
摘要翻译：含有氟树脂作为主要组分的氟树脂基材包括在其表面的至少部分区域上的改性层，改性层包含硅氧烷键和亲水性有机官能团，并且改性层的表面具有接触角与纯水的90°或更小。

2. 发明公开

EP3056343A1 FLUORINE RESIN BASE MATERIAL, PRINTED WIRING BOARD, AND CIRCUIT MODULE 有权
标题翻译：氟氯化碳，LEITERPLATTE UND SCHALTUNGSMODUL
公开(公告)号：EP3056343A1
公开(公告)日：2016-08-17
申请号：EP14852835.9
申请日：2014-10-08
申请人： Sumitomo Electric Printed Circuits, Inc. , Sumitomo Electric Industries, Ltd.
发明人： KIYA, Satoshi , UEHARA, Sumito , MIURA, Kousuke , NAKABAYASHI, Makoto
IPC分类号： B32B27/30 , C08J7/12 , H05K1/03
摘要： A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.
摘要翻译：含氟树脂作为主要成分的氟树脂基材在其表面的至少部分区域上具有改性层，所述改性层含有硅氧烷键和亲水性有机官能团，所述改性层的表面具有接触角与纯水相差90°以下。

3. 发明公开

EP2453726A1 Connection method, connection structure, and electronic device 审中-公开
标题翻译： Verbindungsverfahren，Verbindungsstruktur und elektronische Vorrichtung
公开(公告)号：EP2453726A1
公开(公告)日：2012-05-16
申请号：EP11192441.1
申请日：2010-05-18
申请人： Sumitomo Electric Industries, Ltd. , Sumitomo Electric Printed Circuits, Inc.
发明人： Yamamoto, Masamichi , Nakatsugi, Kyouichirou , Yamaguchi, Takashi , Kawakami, Shigeki , Kimura, Michihiro
IPC分类号： H05K3/32 , H05K3/36 , H05K3/34 , H05K3/28
CPC分类号： H05K3/361 , C23F11/149 , H01L2924/0002 , H05K3/282 , H05K3/305 , H05K3/323 , H05K3/3431 , H05K3/4007 , H05K2201/0248 , H05K2201/0373 , H05K2201/094 , H05K2201/10977 , H05K2201/10992 , H05K2203/308 , Y10T156/10 , H01L2924/00
摘要： [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
[Solution] A connection method according to the present invention includes a step (a2) of preparing a base material including an electrode (22) for connection using an adhesive (30) and an electrode (26) for connection using solder (50); a step (b2) of covering only the electrode (26) for connection using solder with an organic film (15) formed by OSP treatment or a noble metal plating film, the electrode for connection using solder being arranged on the base material; a step (c2) of joining the electrode (26) for connection using solder to a connection conductor (42) using solder by solder reflow treatment in a non-oxidizing atmosphere; and after the step (c2), a step (d2) of bonding the electrode (22) for connection using an adhesive to a connection conductor (12) with an adhesive (30) mainly containing a thermosetting resin to establish electrical connection.
摘要翻译：提供了一种连接方法和电子设备，其中可以简化制造过程，并且可以以低成本生产使用粘合剂的连接结构。 [解决方案]根据本发明的连接方法包括制备包括用于使用粘合剂（30）连接的电极（22）和用于使用焊料（50）连接的电极（26）的基材的步骤（a2）。仅使用焊料与OSP处理形成的有机膜（15）或贵金属电镀膜覆盖用于连接的电极（26）的工序（b2），使用焊料的连接用电极配置在基材上; 在非氧化气氛中通过焊料回流处理使用焊料将用于使用焊料连接的电极（26）连接到连接导体（42）的步骤（c2）在步骤（c2）之后，用主要包含热固性树脂的粘合剂（30）将用粘合剂连接的电极（22）与连接导体（12）接合以建立电连接的步骤（d2）。

4. 发明公开

EP3148301A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
标题翻译： LEERRPLATTE UND VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE
公开(公告)号：EP3148301A1
公开(公告)日：2017-03-29
申请号：EP15795735.8
申请日：2015-05-12
申请人： Sumitomo Electric Printed Circuits, Inc.
发明人： MIURA, Kousuke , KIYA, Satoshi , UEHARA, Sumito
IPC分类号： H05K3/42 , H05K3/38
CPC分类号： H05K1/115 , H05K1/0313 , H05K1/034 , H05K1/09 , H05K3/381 , H05K3/4084 , H05K3/423 , H05K3/429 , H05K3/4611 , H05K3/4661 , H05K2201/09509 , H05K2203/072
摘要： An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.
摘要翻译：本发明的目的是提供一种印刷电路板，其中形成在基层的形成有以氟树脂为主要成分的两个表面上的导电层通过通孔彼此可靠地连接。根据本发明实施例的印刷电路板包括以氟树脂为主要成分的基层，层叠在基层的一个表面上的第一导电层，层叠在基层的另一个表面上的第二导电层以及沿厚度方向穿过基底层和第一导电层和第二导电层中的至少一个的连接孔形成的通孔，并且将第一导电层和第二导电层电连接到每个其他。连接孔中的基底层的内周面的至少一部分具有氧原子或氮原子的含有比例为0.2原子％以上的预处理表面。

5. 发明公开

EP2445322A1 Connection method, connection structure, and electronic device 有权
标题翻译： Verbindungsverfahren
公开(公告)号：EP2445322A1
公开(公告)日：2012-04-25
申请号：EP11192444.5
申请日：2010-05-18
申请人： Sumitomo Electric Industries, Ltd. , Sumitomo Electric Printed Circuits, Inc.
发明人： Yamamoto, Masamichi , Nakatsugi, Kyouichirou , Yamaguchi, Takashi , Kawakami, Shigeki , Kimura, Michihiro
IPC分类号： H05K3/32 , H05K3/36 , H05K3/34 , H05K3/28
CPC分类号： H05K3/361 , C23F11/149 , H01L2924/0002 , H05K3/282 , H05K3/305 , H05K3/323 , H05K3/3431 , H05K3/4007 , H05K2201/0248 , H05K2201/0373 , H05K2201/094 , H05K2201/10977 , H05K2201/10992 , H05K2203/308 , Y10T156/10 , H01L2924/00
摘要： [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
[Solution] A connection method according to the present invention includes a step (a3) of preparing a base material (321) including an electrode (322) for connection using an adhesive and an electrode (326) for connection using solder; a step (b3) of covering the electrode for connection using an adhesive and the electrode for connection using solder with oxidation preventing films (325); after the step (b3), a step (c3) of bonding the electrode (322) for connection using an adhesive to a connection conductor (312) with an adhesive (330) containing a thermosetting resin to establish electrical connection; and after the step (c3), a step (d3) of joining the electrode (326) for connection using solder to a connection conductor (342) using solder (350) by solder reflow treatment in a non-oxidizing atmosphere, wherein an increase in connection resistance between the electrode for connection using an adhesive and the connection conductor before and after the step (d3) is within a predetermined range.
摘要翻译：提供了一种连接方法和电子设备，其中可以简化制造过程，并且可以以低成本生产使用粘合剂的连接结构。 [解决方案]根据本发明的连接方法包括制备包括用于使用粘合剂连接的电极（322）和用于使用焊料进行连接的电极（326）的基材（321）的步骤（a3）使用粘合剂覆盖用于连接的电极的步骤（b3）和使用具有防氧化膜的焊料的连接用电极（325）; 在步骤（b3）之后，使用粘合剂（330）将用粘合剂连接的电极（322）与含有热固性树脂的连接导体（312）接合以建立电连接的步骤（c3）在步骤（c3）之后，在非氧化性气氛中通过焊锡回流处理使用焊料（350）将用于使用焊料进行连接的电极（326）连接到连接导体（342）的步骤（d3），其中增加在步骤（d3）之前和之后，使用粘合剂连接的电极与连接导体之间的连接电阻在预定范围内。

6. 发明公开

EP1928218A1 FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：柔软的GEDRUCKTE LEITERPLATTE UND VERFAHREN ZU DESSEN HERSTELLUNG
公开(公告)号：EP1928218A1
公开(公告)日：2008-06-04
申请号：EP06798130.8
申请日：2006-09-20
申请人： Sumitomo Electric Industries, Ltd. , Sumitomo Electric Printed Circuits, Inc.
发明人： KASHIHARA, Hideki , KOYAMA, Keiji , NAKAYAMA, Shuichi
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K3/361 , H05K3/281 , H05K3/323 , H05K2201/058
摘要： A flexible printed circuit board 1 includes a first flexible printed circuit board 2, which has a first conductor trace 6 on one side of a base material 4, and a second flexible printed circuit board 3, which has second conductor traces 14, 15 on both sides of a base material 11, respectively. The first flexible printed circuit board 2 is provided with a first connecting portion 8 and the second flexible printed circuit board 3 is provided with a second connecting portion 18. The first and second connecting portions 8, 18 are connected to an adhesive layer 5 formed of an anisotropic conductive adhesive. The first connecting portion 8 is provided at substantially the same height as the first conductor trace 6 and the second connecting portion 18 is provided at substantially the same height as the second conductor trace 14.
摘要翻译：柔性印刷电路板1包括第一柔性印刷电路板2，第一柔性印刷电路板2在基材4的一侧具有第一导体迹线6和第二柔性印刷电路板3，其在两者上具有第二导体迹线14,15 分别为基材11的两侧。第一柔性印刷电路板2设置有第一连接部分8，第二柔性印刷电路板3设置有第二连接部分18.第一和第二连接部分8,18连接到由各向异性导电胶。第一连接部分8设置在与第一导体迹线6基本相同的高度处，并且第二连接部分18设置在与第二导体迹线14基本相同的高度处。

7. 发明公开

EP3340755A1 PRINTED-WIRING BOARD SUBSTRATE, PRINTED-WIRING BOARD, AND METHOD FOR PRODUCING PRINTED-WIRING BOARD SUBSTRATE 有权
公开(公告)号：EP3340755A1
公开(公告)日：2018-06-27
申请号：EP16839060.7
申请日：2016-08-06
申请人： Sumitomo Electric Industries, Ltd. , Sumitomo Electric Printed Circuits, Inc. , Sumitomo Electric Fine Polymer, Inc.
发明人： YAMANAKA, Yuichiro , OKA, Yoshio , KIYA, Satoshi , UCHITA, Yoshifumi , NAKABAYASHI, Makoto
IPC分类号： H05K3/38
CPC分类号： H05K1/0346 , B32B15/08 , B32B15/088 , H05K3/381 , H05K3/389 , H05K2201/0154 , H05K2201/0355
摘要： A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a Nls spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic% or more and 10 atomic% or less.

8. 发明公开

EP3148301A4 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
标题翻译： LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE
公开(公告)号：EP3148301A4
公开(公告)日：2017-09-27
申请号：EP15795735
申请日：2015-05-12
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS INC
发明人： MIURA KOUSUKE , KIYA SATOSHI , UEHARA SUMITO
IPC分类号： H05K3/38 , H05K1/03 , H05K3/42 , H05K3/46
CPC分类号： H05K1/115 , H05K1/0313 , H05K1/034 , H05K1/09 , H05K3/381 , H05K3/4084 , H05K3/423 , H05K3/429 , H05K3/4611 , H05K3/4661 , H05K2201/09509 , H05K2203/072
摘要： An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.
摘要翻译：本发明的一个目的是提供一种印刷线路板，其中在包含氟树脂作为主要成分的基层的两个表面上形成的导电层通过通孔彼此可靠地连接。根据本发明实施例的印刷线路板包括：含有氟树脂作为主要组分的基层，堆叠在基层的一个表面上的第一导电层，堆叠在基层的另一个表面上的第二导电层以及通孔，其沿着贯通所述基底层以及所述第一导电层和所述第二导电层中的至少一个的厚度方向的连接孔形成，并且将所述第一导电层和所述第二导电层分别电连接到其他。连接孔内的基底层的内周面的至少一部分具有氧原子或氮原子的含有比例为0.2原子％以上的预处理面。

9. 发明授权

EP2440024B1 CONNECTION METHOD 有权转让
标题翻译： VERBINDUNGSVERFAHREN
公开(公告)号：EP2440024B1
公开(公告)日：2014-03-12
申请号：EP10783253.7
申请日：2010-05-18
申请人： Sumitomo Electric Industries, Ltd. , Sumitomo Electric Printed Circuits, Inc.
发明人： Yamamoto, Masamichi , Nakatsugi, Kyouichirou , Yamaguchi, Takashi , Kawakami, Shigeki , Kimura, Michihiro
IPC分类号： H05K3/32 , H05K3/36 , H05K3/28 , H05K3/30 , H05K3/34
CPC分类号： H05K3/361 , C23F11/149 , H01L2924/0002 , H05K3/282 , H05K3/305 , H05K3/323 , H05K3/3431 , H05K3/4007 , H05K2201/0248 , H05K2201/0373 , H05K2201/094 , H05K2201/10977 , H05K2201/10992 , H05K2203/308 , Y10T156/10 , H01L2924/00

10. 发明公开

EP2440024A1 CONNECTION METHOD, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE 有权转让
标题翻译：相关程序
公开(公告)号：EP2440024A1
公开(公告)日：2012-04-11
申请号：EP10783253.7
申请日：2010-05-18
申请人： Sumitomo Electric Industries, Ltd. , Sumitomo Electric Printed Circuits, Inc.
发明人： Yamamoto, Masamichi , Nakatsugi, Kyouichirou , Yamaguchi, Takashi , Kawakami, Shigeki , Kimura, Michihiro
IPC分类号： H05K3/36 , H05K1/14 , H05K3/34
CPC分类号： H05K3/361 , C23F11/149 , H01L2924/0002 , H05K3/282 , H05K3/305 , H05K3/323 , H05K3/3431 , H05K3/4007 , H05K2201/0248 , H05K2201/0373 , H05K2201/094 , H05K2201/10977 , H05K2201/10992 , H05K2203/308 , Y10T156/10 , H01L2924/00
摘要： [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
[Solution] A connection method according to the present invention includes a step (a1) of preparing base materials 10 and 21 each including an electrode for connection using an adhesive, a step (b1) of covering electrodes 12 and 22 for connection using an adhesive with organic films 15 configured to prevent oxidation, the electrodes 12 and 22 being located on the base materials, a step (c1) of removing or thinning the organic films, and after the step (c1), a step (d1) of bonding the electrodes for connection using an adhesive to each other with an adhesive 30 mainly containing a thermosetting resin to establish electrical connection.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式