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1. 发明公开

EP3401311A1 OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT 审中-公开
公开(公告)号：EP3401311A1
公开(公告)日：2018-11-14
申请号：EP16875279.8
申请日：2016-11-08
申请人： DIC Corporation
发明人： OTSU Masato , SHIMONO Tomohiro , ARITA Kazuo , YAMAGUCHI Junji
IPC分类号： C07D265/16 , B32B27/42 , C08G14/073 , C08L61/34 , H01L23/14 , H01L23/29 , H01L23/31
CPC分类号： B32B27/42 , B32B2457/08 , C07D265/16 , C08K7/02 , C08L39/00 , C08L61/34 , H01L23/14 , H01L23/29 , H01L23/31 , H05K1/0373
摘要： The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.

2. 发明公开

EP3339023A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
公开(公告)号：EP3339023A1
公开(公告)日：2018-06-27
申请号：EP17756590.0
申请日：2017-02-23
申请人： FUJI-FILM Corporation
发明人： IWAI, Yu , KAWABATA, Takeshi , SHIBUYA, Akinori
IPC分类号： B32B27/34 , B32B7/02 , B32B27/00 , G03F7/027 , G03F7/40 , H01L23/12 , H01L23/14
CPC分类号： B32B27/08 , B32B3/263 , B32B7/05 , B32B15/08 , B32B15/20 , B32B27/16 , B32B27/281 , B32B2250/44 , B32B2307/206 , B32B2307/54 , B32B2379/08 , B32B2457/08 , B32B2457/14 , G03F7/027 , G03F7/0387 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , H01L23/12 , H01L23/14 , H01L23/49822 , H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541
摘要： Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young' s modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.

3. 发明公开

EP3070137A4 SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE 审中-公开
标题翻译： SILIKONHAFTZUSAMMENSETZUNG UNDRÖHRENLOSEBILDGEBUNGSVORRICHTUNG
公开(公告)号：EP3070137A4
公开(公告)日：2017-06-28
申请号：EP14862587
申请日：2014-11-10
申请人： SHIN-ETSU CHEMICAL CO LTD
发明人： YASUDA HIROYUKI , SOGA KYOKO , SUGO MICHIHIRO
IPC分类号： C09J183/05 , C08G77/20 , C08G77/50 , C09J183/07 , H01L27/146
CPC分类号： C09J183/04 , C08G77/04 , C08G77/08 , C08G77/12 , C08G77/20 , C08K5/56 , C08L83/00 , H01L23/14 , H01L27/14618 , H01L27/1462 , H01L2224/0519 , H01L2224/05599 , H01L2224/2919
摘要： The purpose of the present invention is to provide an adhesive composition using a silicone polymer compound, which does not require exposure, baking and development processes for the production, thereby making the production cost low and making the productivity high, which has good characteristics such as good adhesiveness, good hermetic sealing properties after thermal curing and low moisture absorption that are required for adhesives, which provides a cured film having high reliabilities such as high heat resistance and high light resistance, and which is capable of suppressing warping of a bonded substrate after back grinding that is necessary in the three-dimensional mounting production. A silicone adhesive composition which contains: (A) an organopolysiloxane containing a non-aromatic saturated monovalent hydrocarbon group and an alkenyl group; (B) an organohydrogenpolysiloxane containing two or more SiH groups in each molecule in such an amount that the molar ratio of the SiH groups in the component (B) is 0.5-10 relative to the alkenyl groups in the component (A); and (C) an effective amount of a platinum-based catalyst.
摘要翻译：本发明的目的是提供一种使用硅酮聚合物化合物的粘合剂组合物，其不需要曝光，烘焙和显影工艺用于生产，由此使生产成本低并且使生产率高，其具有良好的特性，例如良好的粘合性，热固化后的密封性和粘合剂所需的低吸湿性，这提供了具有高可靠性如高耐热性和高耐光性的固化膜，并且能够抑制粘合基材之后的翘曲背面磨削是三维安装生产所必需的。一种有机硅粘合剂组合物，其含有：（A）含有非芳香族饱和一价烃基和链烯基的有机聚硅氧烷; （B）每个分子中含有两个或更多个SiH基团的有机氢聚硅氧烷，其量使得组分（B）中SiH基团相对于组分（A）中的烯基的摩尔比为0.5-10; 和（C）有效量的铂基催化剂。

5. 发明授权

EP2822366B1 Semiconductor device 有权
公开(公告)号：EP2822366B1
公开(公告)日：2016-05-11
申请号：EP14175162.8
申请日：2014-07-01
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Yamashita, Kenya
IPC分类号： H05K1/02 , H05K1/14 , H02M7/00 , H01L23/14 , H01L23/498 , H01L23/373
CPC分类号： H02M7/003 , H01L23/14 , H01L23/3735 , H01L23/49861 , H01L2224/0603 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H05K1/0203 , H05K1/0216 , H05K1/025 , H05K1/144 , H05K2201/042 , H05K2201/10166

6. 发明公开

EP2991105A1 COMPOSITE LAMINATE AND ELECTRONIC DEVICE 有权转让
标题翻译： VERBUNDLAMINAT UND ELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP2991105A1
公开(公告)日：2016-03-02
申请号：EP14787718.7
申请日：2014-04-28
申请人： Kyocera Corporation
发明人： NIINO,Noritaka
IPC分类号： H01L23/14 , B32B15/01 , H01L23/13 , H05K1/09
CPC分类号： B32B15/018 , B23K35/3006 , B32B3/26 , B32B7/02 , B32B7/12 , B32B9/005 , B32B9/041 , B32B15/01 , B32B15/04 , B32B15/043 , B32B15/20 , B32B18/00 , B32B2250/04 , B32B2250/05 , B32B2255/06 , B32B2255/205 , B32B2307/202 , B32B2307/302 , B32B2307/546 , B32B2307/732 , B32B2307/748 , B32B2457/14 , C04B37/026 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/126 , C04B2237/127 , C04B2237/341 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/60 , C04B2237/706 , C04B2237/708 , C04B2237/72 , H01L23/13 , H01L23/14 , H01L23/15 , H01L23/3735 , H01L23/3736 , H01L23/49822 , H01L23/49866 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K1/0306 , H05K1/09 , H05K3/388 , H05K2201/0338 , H05K2203/049 , H01L2924/00014 , H01L2924/00
摘要： Problem: To provide a metal plate, a composite laminate and the like, each of which has excellent long-term reliability.
Resolution means: A composite laminate (12) includes a first metal layer (1), a second metal layer (2), a third metal layer (3), and a fourth layer (4). The first metal layer (1) contains copper. The second metal layer (2) is arranged on the lower surface of the first metal layer (1). The third metal layer (3) is arranged on the lower surface of the second metal layer (2), and contains silver, at least one metal selected from a first group made up of Sn, Al, and Ga, and at least one metal selected from a second group made up of In and Sb. The fourth layer (4) is arranged on the lower surface of the third metal layer (3). The third metal layer (3) has a metal portion (2A) that partially penetrates the second metal layer (2) from the third metal layer (3).
摘要翻译：问题：提供具有优异的长期可靠性的金属板，复合层叠体等。分辨装置：复合层压板（12）包括第一金属层（1），第二金属层（2），第三金属层（3）和第四层（4）。第一金属层（1）含有铜。第二金属层（2）布置在第一金属层（1）的下表面上。第三金属层（3）布置在第二金属层（2）的下表面上，并且包含银，选自由Sn，Al和Ga构成的第一组中的至少一种金属和至少一种金属从由In和Sb组成的第二组中选择。第四层（4）布置在第三金属层（3）的下表面上。第三金属层（3）具有从第三金属层（3）部分地贯穿第二金属层（2）的金属部分（2A）。

8. 发明公开

EP1976004A1 SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE, SEMICONDUCTOR DEVICE USING THE SAME, AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE 有权
标题翻译：半导体元件搭载用基板，半导体器件及其制造方法的半导体元件安装用基板
公开(公告)号：EP1976004A1
公开(公告)日：2008-10-01
申请号：EP06843018.0
申请日：2006-12-21
申请人： A.L.M.T. CORP.
发明人： TAKASHIMA, Kouichi , MORIGAMI, Hideaki , NARITA, Masashi
IPC分类号： H01L23/36 , H01L23/14
CPC分类号： H01L24/27 , H01L23/14 , H01L23/3732 , H01L24/29 , H01L24/31 , H01L24/83 , H01L2224/2908 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/83801 , H01L2224/83805 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01S5/0213 , H01S5/02484 , H01L2924/01014 , H01L2924/00 , H01L2924/3512 , H01L2224/29144 , H01L2924/00012 , H01L2924/00014
摘要： The invention provides a semiconductor element mounting substrate that, by virtue of an improvement in thermal conduction efficiency between the substrate and another member, can reliably prevent, for example, a light emitting element such as a semiconductor laser from causing a defective operation by heat generation of itself, by taking full advantage of high thermal conductivity of a diamond composite material. In the semiconductor element mounting substrate, a connecting surface to be connected with the light emitting element or the like is finished such that the number, per unit area, of at least either recesses or protrusions having a depth or height of 10µm to 40µm and a surface-direction diametrical size of 10µm to 3mm is 50/cm 2 or less, and on the connecting surface, a coating layer, which is formed of a solder or a brazing material, has a thickness of 1µm to 30µm, an arithmetic mean roughness R a of a roughness curve showing a surface roughness of R a ≤2µm, and a maximum height roughness R z of R z ≤15µm, and fills and covers the recesses or protrusions, is formed.

9. 发明公开

EP4362614A1 CIRCUIT BOARD MANUFACTURING METHOD 审中-公开
公开(公告)号：EP4362614A1
公开(公告)日：2024-05-01
申请号：EP22828287.7
申请日：2022-06-15
申请人： Mitsui Mining & Smelting Co., Ltd.
发明人： KITABATAKE Yukiko , NAKAMURA Toshimi , MATSUURA Yoshinori
IPC分类号： H05K3/46 , H01L23/12 , H01L23/14 , H01L23/15 , H05K3/00
CPC分类号： H05K3/46 , H05K3/00 , H01L23/12 , H01L23/15 , H01L23/14
摘要： Provided is a method for manufacturing a wiring substrate that can easily and reliably release a carrier. The method includes: providing a laminated sheet that includes a release layer and a metal layer in order on a carrier; forming a cut from a surface of the laminated sheet opposite to the carrier so that the cut passes through the inside of an outer edge portion of the laminated sheet and so that the cut penetrates the metal layer and the release layer, and dividing the metal layer and the release layer into a central portion and a peripheral portion with the cut as a boundary; and inserting a thin piece from the cut toward the central portion side of the metal layer or the release layer to form a gap between the metal layer and the carrier in which an insertion angle of the thin piece is greater than 0°.

10. 发明公开

EP3413346A1 METAL MEMBER WITH Ag UNDERLAYER, INSULATED CIRCUIT BOARD WITH Ag UNDERLAYER, SEMICONDUCTOR DEVICE, INSULATED CIRCUIT BOARD WITH HEATSINK, AND METHOD OF MANUFACTURING METAL MEMBER WITH Ag UNDERLAYER 审中-公开
公开(公告)号：EP3413346A1
公开(公告)日：2018-12-12
申请号：EP17747297.4
申请日：2017-01-26
申请人： Mitsubishi Materials Corporation
发明人： NISHIMOTO Shuji , NAGATOMO Yoshiyuki
IPC分类号： H01L23/40 , H01L23/12 , H01L23/14 , H01L23/36
CPC分类号： H01L23/12 , H01L23/14 , H01L23/36 , H01L23/40 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： An Ag underlayer-attached metallic member includes a metallic member (12) joined with a body to be joined (3) and an Ag underlayer (30) formed on a joining surface of the metallic member (12) with the body to be joined (3), the Ag underlayer (30) includes a glass layer (31) formed on a metallic member (12) side and an Ag layer (32) laminated on the glass layer (31), and an area proportion of voids in an Ag layer (32) surface of the Ag underlayer (30) is 25% or less.

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