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    • 3. 发明公开
    • MULTIPROCESSOR SYSTEM, EXECUTION CONTROL METHOD, EXECUTION CONTROL PROGRAM
    • 多功能体系,澳大利亚卫生组织,澳大利亚卫生组织
    • EP2579164A1
    • 2013-04-10
    • EP11786619.4
    • 2011-05-24
    • NEC Corporation
    • TAKEUCHI, ToshikiIGURA, Hiroyuki
    • G06F15/167G06F13/12G06F13/362
    • G06F15/17337
    • The multiprocessor system includes one or a plurality of main processors and a plurality of sub-processors, and an execution control circuit which conducts execution control of each the sub-processors, wherein the execution control circuit includes an execution control processor for execution control processing of each the sub-processors, a control bus output unit for activation of a command to each the sub-processors, a status bus input unit for status notification from each the sub-processors, a determination circuit which determiners whether or not the status notification has one-to-one dependency with a processing command to be issued next on an operation sequence and is to be processed at a high speed, a status accelerator which issues a corresponding processing activation command when the status notification is to be processed at a high speed, and a status FIFO control unit which processes the status notification by using the execution control processor.
    • 多处理器系统包括一个或多个主处理器和多个子处理器,以及执行每个子处理器的执行控制的执行控制电路,其中执行控制电路包括用于执行控制处理的执行控制处理器 每个子处理器,用于激活每个子处理器的命令的控制总线输出单元,用于来自每个子处理器的状态通知的状态总线输入单元,确定状态通知是否具有的确定电路 一个一对一的依赖关系,下一个要在操作序列上发出的处理命令的依赖关系,并且要高速处理的状态加速器,当状态通知要高速处理时发出相应的处理激活命令 以及通过使用执行控制处理器来处理状态通知的状态FIFO控制单元。
    • 5. 发明公开
    • Multiprocessor chip having bidirectional ring interconnect
    • Mehrrechnerchip mit einer Bidirektionellen Ringverbindung
    • EP1615138A2
    • 2006-01-11
    • EP05253224.9
    • 2005-05-25
    • INTEL CORPORATION
    • Chrysos, GeorgeMattina, MatthewFelix, Stephen
    • G06F15/173H04L12/42
    • G06F15/8015G06F15/17337
    • Embodiments of the present invention are related in general to on-chip integration of multiple components on a single die and in particular to on-chip integration of multiple processors via a bidirectional ring interconnect. An embodiment of a semiconductor chip includes a plurality of processors, an address space shared between the processors, and a bidirectional ring interconnect to couple the processors and the address space. An embodiment of a method includes calculating distances between a packet source and destination on multiple ring interconnects, determining on which interconnect to transport the packet, and then transporting the packet on the determined interconnect. Embodiments provide improved latency and bandwidth in a multiprocessor chip. Exemplary applications include chip multiprocessing.
    • 本发明的实施例一般涉及单个管芯上的多个部件的片上集成,特别是通过双向环形互连进行多个处理器的片上集成。 半导体芯片的实施例包括多个处理器,处理器之间共享的地址空间以及耦合处理器和地址空间的双向环形互连。 一种方法的实施例包括计算多个环互连上的分组源和目的地之间的距离,确定传输分组的哪个互连,然后在确定的互连上传输分组。 实施例在多处理器芯片中提供改进的等待时间和带宽。 示例性应用包括芯片多处理。
    • 6. 发明公开
    • Efficient messaging in a parallel processing system
    • Eeiziente Benachrichtung in einem parallelen Verarbeitungsystem
    • EP1408417A1
    • 2004-04-14
    • EP02017329.0
    • 2002-08-01
    • Fujitsu Siemens Computers, LLC
    • Myers, Mark S.
    • G06F15/173
    • G06F15/17337
    • The present invention, generally speaking, provides an efficient method of sending a long message from a first compute node to a second compute node across an interconnection network. In the first compute node, a message header field is set to a predetermined value and the message is sent. In the second compute node, the message header is received and processed, and a memory location is read in accordance with the contents of a base address register and an index register. Using Direct Memory Access, the message is then stored in memory at a storage address determined in accordance with the contents of the memory location. Preferably, the storage address is aligned on a memory page boundary.
    • 该方法涉及第一计算节点将消息头字段设置为预定值并发送消息,并且第二计算节点接收和处理消息头,以及根据基地址寄存器和索引的内容读取存储器位置 寄存器。 第二计算节点还使用直接存储器访问在存储器中以根据存储器位置的内容确定的存储地址存储该消息。
    • 7. 发明公开
    • Compute node to mesh interface for highly scalable parallel processing system
    • Rechnerknoten zur Maschenschnittstellefürhoch skalierbares paralleles Verarbeitungsystem
    • EP1367499A1
    • 2003-12-03
    • EP02011858.4
    • 2002-05-28
    • Fujitsu Siemens Computers, LLC
    • Myers, Mark S.
    • G06F15/173
    • G06F15/17337
    • An interface circuit for interfacing one or more compute nodes to a mesh is capable of serving a wide range of MPP systems. The interface circuit includes a first bus interface for interfacing with a first bus, a second bus interface for interfacing with a second bus, and a mesh interface. Control logic is coupled to the first bus interface, the second bus interface and the mesh interface. The control logic includes circuitry for placing the interface circuit in a first mode in which a computc node resides on the first bus and a second mode in which the compute node resides on the second bus. The first bus may be a split-envelope bus such as the MIPS Avalanche bus. The second bus may be a single-envelope bus such as the PCI bus.
    • 用于将一个或多个计算节点连接到网格的接口电路能够服务于广泛的MPP系统。 接口电路包括用于与第一总线接口的第一总线接口,用于与第二总线接口的第二总线接口和网格接口。 控制逻辑耦合到第一总线接口,第二总线接口和网状接口。 控制逻辑包括用于将接口电路放置在第一模式中的电路,其中计算节点驻留在第一总线上,以及计算节点驻留在第二总线上的第二模式。 第一个总线可能是分裂信封的总线,如MIPS雪崩总线。 第二总线可以是诸如PCI总线的单信封总线。