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    • 5. 发明公开
    • STRESS MEASURING METHOD AND STRESS MEASURING DEVICE
    • BELASTUNGSMESSVERFAHREN
    • EP1484589A1
    • 2004-12-08
    • EP03710349.6
    • 2003-03-13
    • Horiba, Ltd
    • PEZZOTTI, Giuseppe
    • G01L1/24G01N21/62
    • G01N21/1717G01N21/62G01N21/66G01N2021/1729G01N2021/1731
    • The stress measuring method of the present claimed invention includes an external force impressing process that applies an external force to a specimen, an electron beam irradiating process that irradiates an electron beam to the specimen, a spectroscopy process that conducts spectroscopy on light generated from the specimen by the above-mentioned electron beam irradiating process so as to obtain a spectrum, and a stress calculating process that obtains a stress based on a spectrum shift between a specimen spectrum obtained by irradiating the electron beam on the above-mentioned specimen and a stress impressed spectrum obtained by irradiating the electron beam on the specimen in a state that a stress exists due to the above-mentioned external impressing process.
    • 本发明的应力测量方法包括对试样施加外力的外力施加工序,向试样照射电子束的电子束照射工序,对由试样产生的光进行光谱分析的光谱法 通过上述电子束照射处理获得光谱,以及应力计算处理,其获得基于通过照射上述样品上的电子束而获得的样本光谱与印痕的应力之间的光谱偏移的应力 在通过上述外部印刷处理存在应力的状态下,通过在试样上照射电子束而获得的光谱。