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1. 发明公开

EP3081674A4 DEVICE FOR ELECTROPLATING STEEL PIPE 有权转让
标题翻译： VORRICHTUNG ZUR ELEKTROPLATTIERUNG EINES STAHLROHRS
公开(公告)号：EP3081674A4
公开(公告)日：2017-08-02
申请号：EP14869821
申请日：2014-12-11
申请人： NIPPON STEEL & SUMITOMO METAL CORP , VALLOUREC OIL & GAS FRANCE
发明人： KIMOTO MASANARI , ISHII KAZUYA , OSHIMA MASAHIRO , YAMAMOTO TATSUYA
IPC分类号： C25D7/04 , C25D5/02 , C25D5/08 , C25D17/00 , C25D17/02 , C25D17/12 , C25D21/00
CPC分类号： C25D5/026 , C25D5/08 , C25D7/04 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus (1) applies an electroplated coating to a female thread (20b) formed on a pipe end portion (20a) of a steel pipe (20). The electroplating apparatus (1) includes an inner seal member (2), a capsule (3), a discharge outlet (3c), an opening (3b), a cylindrical insoluble anode (4), a plating solution supply tube (5a), and a plurality of nozzles (5b). The inner seal member (2) divides the interior of the steel pipe (20) at a location longitudinally inward of a region on which the female thread is formed (20b). The capsule (3) is attached to the pipe end portion (20a). The discharge outlet (3c) is designed to discharge a plating solution inside the capsule (3) therefrom. The opening (3b) facilitates discharge of the plating solution inside the capsule (3). The anode (4) is disposed in the inside of the pipe end portion (20a). The supply tube (5a) projects from a leading end of the anode (4). The nozzles (5b) eject a plating solution between the outer peripheral surface of the anode (4) and the inner peripheral surface of the pipe end portion (20a). The anode (4) has a configuration that does not allow ingress of the plating solution thereto.
摘要翻译：电镀装置（1）在形成于钢管（20）的管端部（20a）的阴螺纹（20b）上涂覆电镀涂层。该电镀装置1包括内密封部件2，胶囊3，排出口3c，开口部3b，圆筒状的不溶性阳极4，电镀液供给管5a，和多个喷嘴（5b）。内密封部件（2）将钢管（20）的内部分隔在形成有内螺纹（20b）的区域的长度方向内侧的位置。胶囊（3）连接到管端部分（20a）。排出口（3c）被设计成从中排出胶囊（3）内的电镀液。开口（3b）便于胶囊（3）内的电镀液的排出。阳极（4）配置在管端部（20a）的内部。供应管（5a）从阳极（4）的前端突出。喷嘴（5b）在阳极（4）的外周表面和管端部（20a）的内周表面之间喷射电镀液。阳极（4）具有不允许电镀液进入其中的构造。

2. 发明公开

EP2716796A4 ELECTRICAL CONTACT COMPONENT 审中-公开
标题翻译：电接触部件
公开(公告)号：EP2716796A4
公开(公告)日：2015-09-09
申请号：EP12793192
申请日：2012-03-08
申请人： PANASONIC CORP
发明人： SEKI NAOKI , YAMADA KATSUNOBU , UCHIDA YUICHI , ARAI SUSUMU
IPC分类号： C23C18/52 , C23C18/16 , C25D5/02 , C25D5/12 , C25D7/00 , C25D15/00 , H01R13/03
CPC分类号： H01R13/02 , C23C18/1603 , C23C18/1651 , C23C18/1662 , C25D3/12 , C25D3/62 , C25D5/02 , C25D5/026 , C25D5/12 , C25D15/00 , H01R12/716 , H01R13/03

3. 发明公开

EP2545596A2 PHOTOVOLTAIC CELL WITH POROUS SEMICONDUCTOR REGIONS FOR ANCHORING CONTACT TERMINALS, ELECTROLITIC AND ETCHING MODULES, AND RELATED PRODUCTION LINE 有权
标题翻译：程序对电解处理和蚀刻
公开(公告)号：EP2545596A2
公开(公告)日：2013-01-16
申请号：EP11713203.5
申请日：2011-03-11
申请人： Rise Technology S.r.l.
发明人： BALUCANI, Marco
IPC分类号： H01L31/18 , H01L31/0224 , H01L21/285 , C25D7/12 , C25F7/00 , H01L21/67
CPC分类号： H01L21/67173 , C23C18/1642 , C23C18/165 , C23C18/1692 , C23C18/32 , C25D3/38 , C25D5/022 , C25D5/026 , C25D5/04 , C25D7/12 , C25D11/02 , C25D11/32 , C25D17/00 , C25D17/001 , H01L21/6708 , H01L21/6723 , H01L21/67236 , H01L31/02008 , H01L31/022425 , H01L31/0352 , H01L31/1804 , Y02E10/50
摘要： A photovoltaic cell is proposed. The photovoltaic cell includes a substrate of semiconductor material, and a plurality of contact terminals each one arranged on a corresponding contact area of the substrate for collecting electric charges being generated in the substrate by the light. For at least one of the contact areas, the substrate includes at least one porous semiconductor region extending from the contact area into the substrate for anchoring the whole corresponding contact terminal on the substrate. In the solution according to an embodiment of the invention, each porous semiconductor region has a porosity decreasing moving away from the contact area inwards the substrate. An etching module and an electrolytic module for processing photovoltaic cells, a production line for producing photovoltaic cells, and a process for producing photovoltaic cells are also proposed.

4. 发明公开

EP1639156A1 APPARATUS AND METHOD FOR DEPOSITING AND PLANARIZING THIN FILMS OF SEMICONDUCTOR WAFERS 审中-公开
标题翻译： DEVICE AND METHOD FOR半导体圆盘的分离和平面化薄膜层
公开(公告)号：EP1639156A1
公开(公告)日：2006-03-29
申请号：EP04753246.0
申请日：2004-05-24
申请人： LAM RESEARCH CORPORATION
发明人： RAVKIN, Mike , BOYD, John , DORDI, Yezdi, N. , REDEKER, Fred, C. , DE LARIOS, John, M.
IPC分类号： C25D7/12 , C25D5/22 , C25D5/02 , H01L21/288
CPC分类号： C25D17/10 , C25D5/026 , C25D5/22 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67028 , H01L21/67034 , H01L21/67051
摘要： An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.

5. 发明授权

EP0370651B1 Apparatus for selectively plating interior surfaces of electrical terminals 失效
标题翻译：用于选择电镀端子的内部表面的装置
公开(公告)号：EP0370651B1
公开(公告)日：1993-08-04
申请号：EP89311414.0
申请日：1989-11-03
申请人： THE WHITAKER CORPORATION
发明人： Wagner, Richard Maxwell
IPC分类号： C25D5/02
CPC分类号： C25D5/026

6. 发明授权

EP0294426B1 IMPROVED SELECTIVE PLATING APPARATUS AND ANODE ASSEMBLY THEREFOR 失效转让
标题翻译：改进的选择性涂层装置和阳极装置
公开(公告)号：EP0294426B1
公开(公告)日：1992-05-06
申请号：EP88900318.2
申请日：1987-12-04
申请人： AMP INCORPORATED
发明人： SMITH, Mark, Loring , WAGNER, Richard, Maxwell
IPC分类号： C25D5/02
CPC分类号： C25D5/02 , C25D5/026
摘要： An apparatus (10) for plating interior surfaces of electrical terminals (172) that are attached to a carrier strip comprises a mandrel having first and second portions (11, 119), the first portion (11) being comprised of dielectric members which are mounted for rotation on a shaft (52) as strip-fed terminals are continuously fed to the first portion (11), wrapped against it and exited therefrom, and a second conductive portion (119) mounted in a stationary position on the same shaft (52). First dielectric portion (11) includes a plurality of nozzles distributed about its axis ofrotation. A plurality of anode assembly members (240) are mounted within the nozzles, the anode members (240) being movable into and out of interiors of terminals (172) that are wrapped against the dielectric portion (11). A conduit supplies plating solution under pressure through electrolyte passageways (131) to the nozzles and upon anode means (256). A source of electrical potential supplies electrical current flow from anode members (240) through plating solution and into interiors of terminals (172) thus forming a plurality of plating cells about the dielectric portion (11). The apparatus (10) includes means for assuring electrical engagement between the anode assembly members (256) and the conductive portion (119) so that an essentially uniform current is supplied to each plating cell. The apparatus (10) further includes camming means which cooperates with a camming engagement member (272) on each anode assembly (240) to ensure retraction of each assembly from its corresponding terminal. In the preferred embodiment, each anode assembly member (240) is comprised of a conductive body member (242) having an anode means (256) extending forwardly fom a body section (248), and a dielectric shroud (276) having a profiled passageway (284) extending axially therethrough, the dielectric shroud (276) being removable mounted to said body section (248) such that said shroud (276) extends coaxially around said anode means (256). The profiled passageway (284) of the shroud includes a terminal receiving section (278) wich is disposed around the anode means (256), extends fordwardly thereof, and has an inner diameter selected to be just greater than the outside diameter of a terminal (172) to be plated. The terminal receiving section (278) further includes lead-in means (288) whereby a terminal member is relatively received into the terminal receiving section and locatable concentrically about the anode means (256).

7. 发明公开

EP0335909A1 APPARATUS FOR SELECTIVELY PLATING ELECTRICAL TERMINALS 失效转让
标题翻译： DEVICE FOR触针的选择性电镀。
公开(公告)号：EP0335909A1
公开(公告)日：1989-10-11
申请号：EP88900614.0
申请日：1987-10-13
申请人： AMP INCORPORATED (a New Jersey corporation)
发明人： SMITH, Mark, Loring
IPC分类号： C25D5
CPC分类号： C25D5/026
摘要： L'appareil décrit permet le placage de surfaces intérieures de bornes électriques essentiellement plates qui sont espacées entre elles et rattachées à une bande porteuse. L'appareil comrend des moyens d'alimentation de la bande qui amènent la bande (120) de bornes (122) à un mandrin rotatif (10), lequel guide les bornes (122) au travers d'une zone de placage où elles reçoivent un placage, une source d'une solution de placage électrolytique, et une source de potentiel électrique pour appliquer un courant électrique d'une anode (42) au travers de la solution vers une cathode. Le mandrin (10) possède une pluralité d'ajutages (62) placé autour de son axe de rotation, et une pluralité d'extensions d'anodes (64), chaque extension d'anode (64) étant montée dans un ajutage associé (62) de sorte qu'une extrémité de l'extension d'anode (64) fait saillie vers l'extérieur depuis l'extrémité de l'ajutage (62). La bande (120) de bornes est amenée au mandrin (10) de sorte que la zone de contact intérieur (128) des bornes (122) est alignée avec l'extrémité saillante des extensions d'anodes correspondantes (64) et est montée sur ladite extrémité saillante. Un conduit (56) permet l'alimentation de solution électrolytique sous pression au travers des ajutages (62) et dans les bornes (122) dans lesquelles les extensions d'anodes associées (64) ont été reçues. Les bornes (122) sont extraites des extensions d'anodes (64) au fur et à mesure que la bande (120) sort du mandrin (10).

8. 发明公开

EP0330316A1 Selective plating apparatus for zone plating 失效
标题翻译： Vorrichtung zum selektiven Metallisieren。
公开(公告)号：EP0330316A1
公开(公告)日：1989-08-30
申请号：EP89300920.9
申请日：1989-01-31
申请人： THE WHITAKER CORPORATION
发明人： Smith, Mark Loring
IPC分类号： C25D5/02
CPC分类号： C25D5/026
摘要： A selective plating apparatus (20) for zone plating is comprised of a contained supply (22) of plating solution having an elongated avenue of escape or nozzle (32) and anode means (42) mounted along the length of the avenue of escape (32) at a spaced location therefrom such that the plating solution leaving the supply (22) is charged by the anode means (42). The apparatus (20) further includes means (86, 100) for guiding a workpiece (120) having a zone (128) to be selectively plated through the apparatus (20) such that the zone (128) is proximate the avenue of escape (32), the workpiece (120) comprising a cathode means. The apparatus (20) includes means for maintaining a desired rate of plating solution through the avenue of escape (32) whereby the solution wets the selected zone (128) of the workpiece (120) and deposits a layer of plating in the desired zone (128) on the surface of the workpiece as it passes through the apparatus (20). The apparatus (20) is preferably comprised of two such contained supplies (22, 52) of plating solution having the respective avenues of escape (32, 68) on opposite sides of the workpiece (120) thus depositing plating on the selected zone (128) on both sides of the workpiece simultaneously.
摘要翻译：用于区域镀覆的选择性电镀装置（20）包括具有延伸的逸出通道或喷嘴（32）的电镀液的容纳供应源（22）和沿着逃生通道的长度安装的阳极装置（32）），使得离开电源（22）的电镀溶液由阳极装置（42）充电。装置（20）还包括用于引导具有区域（128）的工件（120）的装置（86,100），以通过装置（20）选择性地电镀，使得区域（128）靠近逃生通道 32），所述工件（120）包括阴极装置。所述设备（20）包括用于通过所述通道（32）保持所需电镀溶液速率的装置，由此所述溶液润湿所述工件（120）的所选择的区域（128）并且将所述电镀层沉积在期望的区域 128）在工件穿过设备（20）时在工件的表面上。装置（20）优选地包括两个这样的包含电镀液的电镀液（22,52），该电镀溶液在工件（120）的相对侧上具有各自的通路（32,68），从而在所选择的区域（128）上沉积电镀）同时在工件的两面。

9. 发明公开

EP0128401A3 Additive or subtractive chemical process 有权
标题翻译：添加剂或助剂化学工艺
公开(公告)号：EP0128401A3
公开(公告)日：1985-05-15
申请号：EP84105749
申请日：1984-05-21
申请人： International Business Machines Corporation
发明人： Gelchinski, Mordechai Hirsh , Romankiw, Lubomyr Taras , Vigliotti, Donald Richard , Von Gutfeld, Robert Jacob
IPC分类号： C25D05/02 , C25D05/08 , C23C03/02 , C25F03/14 , C23F01/02
CPC分类号： C23F1/00 , C25D5/024 , C25D5/026 , C25F3/14 , H05K3/068 , H05K3/241
摘要： An intense laser beam is focused at a jet nozzle through which an electrolyte is directed towards a substrate, so that the laser beam travels with the jet to the substrate. The laser beam heats the site of the substrate on which it falls, and thereby enhances the etching or plating process being carried out in the substrate.

10. 发明公开

EP0114216A3 Method for selective electroplating 失效
标题翻译：选择性电镀方法
公开(公告)号：EP0114216A3
公开(公告)日：1985-05-15
申请号：EP83111139
申请日：1983-11-08
申请人： International Business Machines Corporation
发明人： Dibble, Eric Paul , Lynch, Thomas Edmund
IPC分类号： C25D05/02 , C25D05/08
CPC分类号： C25D5/022 , C25D5/026 , C25D5/08
摘要： A low conductivity fluid mask in a predetermined fluid state is used as a mask in an electroplating jet system. Preferred is a deionized water mask. A first nozzle (18) applies to the workpiece (W) to be electroplated a masking fluid layer (29) covering selected regions or the complete workpiece. A second nozzle (1) applies the electroplating solution to the desired workpiece regions (M). If the complete workpiece was covered, the second jet pierces the masking layer (29) to plate the underlying exposed portions of said surface.

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