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    • 9. 发明公开
    • INSULATING REFLECTIVE SUBSTRATE AND METHOD FOR PRODUCING SAME
    • 免责声明
    • EP2730684A1
    • 2014-05-14
    • EP12807272.5
    • 2012-07-02
    • Fujifilm Corporation
    • HATANAKA YusukeUESUGI Akio
    • C25D11/16C25F3/04H01L33/60
    • F21V7/22C25D5/022C25D11/005C25D11/08C25D11/12C25D11/16C25D11/20F21K9/64H01L33/502H01L33/60H01L2224/48091H01L2924/1301H01L2924/181H05K1/0274H01L2924/00014H01L2924/00H01L2924/00012
    • The purpose of the present invention is to provide an insulating reflective substrate which is capable of providing a light emitting element that has excellent insulating properties and excellent diffuse reflectance. An insulating reflective substrate of the present invention comprises an aluminum layer and an aluminum oxide layer that is provided on the surface of the aluminum layer. The aluminum oxide layer has a thickness from 80 µm to 300 µm (inclusive), and the aluminum oxide layer has large pits each having an opening in the surface of the aluminum oxide layer. The large pits have an average opening diameter of more than 1 µm but 30 µm or less and an average depth of 80 µm or more but less than the thickness of the aluminum oxide layer. The average distance between two large pits is 10 µm or more but less than the thickness of the aluminum oxide layer. The ratio of the total area of the openings of the large pits to the surface area of the aluminum oxide layer is from 10% to 40% (inclusive). Each large pit has small pits each having an opening in the inner surface of the large pit, and the small pits have an average opening diameter of 5-1,000 nm.
    • 本发明的目的是提供一种绝缘反射基板,其能够提供具有优异的绝缘性能和优异的漫反射率的发光元件。 本发明的绝缘反射基板包括设置在铝层的表面上的铝层和氧化铝层。 氧化铝层的厚度为80μm以上且300μm以下,氧化铝层在氧化铝层的表面具有大的开口部。 大凹坑的平均开口直径大于1μm,但为30μm以下,平均深度为80μm以上,但小于氧化铝层的厚度。 两个大凹坑之间的平均距离为10μm以上但小于氧化铝层的厚度。 大坑的开口总面积与氧化铝层的表面积的比率为10%〜40%(含)以上。 每个大坑具有在大坑的内表面上具有开口的小凹坑,并且小凹坑的平均开口直径为5-1,000nm。