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1. 发明公开

EP3198050A1 METHOD FOR SELECTIVE ALUMINIDE DIFFUSION COATING REMOVAL 有权转让
标题翻译：一种选择性铝合金扩散涂层去除方法
公开(公告)号：EP3198050A1
公开(公告)日：2017-08-02
申请号：EP14902582.7
申请日：2014-09-25
申请人： General Electric Company
发明人： ZHANG, Liming , JOHNSON, Jere A. , ZHOU, Ying
IPC分类号： C23C10/60 , C23C10/00
CPC分类号： F01D25/145 , B24C1/086 , C23C10/28 , C23C10/60 , C23F1/02 , C23F1/20 , C23F4/02 , C23F4/04 , F01D25/005 , F05D2230/90
摘要： A method for selective aluminide diffusion coating removal. The method includes diffusing aluminum into a substrate surface of a component to form a diffusion coating. The diffusion coating includes an aluminum-infused additive layer and an interdiffusion zone. The diffusion coating is solution heat treated at a temperature and for a time sufficient to dissolve at least a portion of the interdiffusion zone. Thereafter the aluminum-infused additive layer is selectively removed. An aluminide diffusion coated turbine component is also disclosed.
摘要翻译：选择性铝化物扩散涂层去除方法。该方法包括将铝扩散到部件的基板表面以形成扩散涂层。扩散涂层包括铝注入的添加剂层和相互扩散区。扩散涂层在一定温度下进行固溶热处理并且持续足以溶解至少一部分相互扩散区的时间。此后，选择性地移除铝注入的添加剂层。还公开了一种铝化物扩散涂层的涡轮机部件。

2. 发明公开

EP2071907A4 FLEX-RIGID PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEX-RIGID PRINTED CIRCUIT BOARD 有权
标题翻译： FLEX刚性PCB和用于生产FLEX刚性PCB的方法
公开(公告)号：EP2071907A4
公开(公告)日：2009-12-09
申请号：EP06798183
申请日：2006-09-21
申请人： DAISHO DENSHI CO LTD , UNIV TOHOKU
发明人： SATO AKIHIRO , SASAKI MASAHIRO , OHMI TADAHIRO , MORIMOTO AKIHIRO
IPC分类号： H05K1/02
CPC分类号： H05K3/4691 , C23F1/02 , C23F1/18 , C23F4/00 , C23F4/04 , H05K3/064 , H05K3/243 , H05K3/4652 , H05K2201/09736 , H05K2203/0369 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165 , Y10T156/10
摘要： A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness "tf" of the conductor layer on the base film formed in the flexible region and the average thickness "tR" of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf

3. 发明授权

EP0158536B1 Methods of and apparatus for forming conductive patterns on a substrate 失效
标题翻译：在基板上形成导电图案的方法和装置
公开(公告)号：EP0158536B1
公开(公告)日：1991-10-23
申请号：EP85302477.6
申请日：1985-04-09
申请人： Moran, Peter Leslie
发明人： Moran, Peter Leslie
IPC分类号： H05K3/10 , C23C28/02 , C23F4/04
CPC分类号： C23F4/04 , C23C2/02 , H05K3/067 , H05K3/108 , H05K3/3468 , H05K2201/0305 , H05K2203/044 , H05K2203/0723 , Y10S428/901 , Y10T29/49155 , Y10T428/12396 , Y10T428/12493

4. 发明公开

EP2856479A1 SYNTHESIS OF THREE-DIMENSIONAL GRAPHENE FOAM: USE AS SUPERCAPACITORS 无效转让
标题翻译：合成的三维图FOAM：使用超级电容器
公开(公告)号：EP2856479A1
公开(公告)日：2015-04-08
申请号：EP13796748.5
申请日：2013-06-03
申请人： National University of Singapore
发明人： LEE, Jonghak , ÖZYILMAZ, Barbaros , KAHYA, Orhan
IPC分类号： H01G11/36 , C01B31/04 , C01B31/02
CPC分类号： H01L31/0224 , B29C43/003 , B29K2105/04 , B29L2031/00 , C01B32/182 , C23F4/04 , H01G11/28 , H01G11/36 , H01G11/38 , H01G11/48 , H01G11/68 , H01G11/70 , H01G11/86 , Y02E60/13 , Y10T29/43 , Y10T428/24997
摘要： The invention relates to three-dimensional crystalline foams with high surface areas, high lithium capacity, and high conductivity for use as electrode materials and methods for their fabrication. In additional embodiments, the invention also relates to the use of three-dimensional crystalline foams as supercapacitors for improved charge and energy storage.

5. 发明授权

EP2071907B1 FLEX-RIGID PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEX-RIGID PRINTED CIRCUIT BOARD 有权
标题翻译：刚挠性印刷电路板及其制造方法刚挠性印刷电路板
公开(公告)号：EP2071907B1
公开(公告)日：2014-01-22
申请号：EP06798183.7
申请日：2006-09-21
申请人： Daisho Denshi Co., Ltd. , Tohoku University
发明人： SATO, Akihiro , SASAKI, Masahiro , OHMI, Tadahiro , MORIMOTO, Akihiro
IPC分类号： H05K1/02 , H05K3/24 , H05K3/46
CPC分类号： H05K3/4691 , C23F1/02 , C23F1/18 , C23F4/00 , C23F4/04 , H05K3/064 , H05K3/243 , H05K3/4652 , H05K2201/09736 , H05K2203/0369 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165 , Y10T156/10
摘要： A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness "tf" of the conductor layer on the base film formed in the flexible region and the average thickness "tR" of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf

6. 发明公开

EP2071907A1 FLEX-RIGID PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEX-RIGID PRINTED CIRCUIT BOARD 有权
标题翻译： FLEX-RIGID-LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG DER FLEX-RIGID-LEITERPLATTE
公开(公告)号：EP2071907A1
公开(公告)日：2009-06-17
申请号：EP06798183.7
申请日：2006-09-21
申请人： Daisho Denshi Co. Ltd. , Tohoku University
发明人： SATO, Akihiro , SASAKI, Masahiro , OHMI, Tadahiro , MORIMOTO, Akihiro
IPC分类号： H05K1/02
CPC分类号： H05K3/4691 , C23F1/02 , C23F1/18 , C23F4/00 , C23F4/04 , H05K3/064 , H05K3/243 , H05K3/4652 , H05K2201/09736 , H05K2203/0369 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165 , Y10T156/10
摘要： A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board.
The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness "tf" of the conductor layer on the base film formed in the flexible region and the average thickness "tR" of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf
摘要翻译：提供柔性刚性印刷布线板，其可以保持柔性部分的柔性，同时增加柔性部分的折叠的耐久性，并且可以确保刚性部分中的导电性，以及制造印刷线路板的方法。柔性刚性印刷电路板包括设置在基膜的至少一个面上的导体层，所述布线板的一个区域包含基膜为刚性区域，另一区域包含基膜为柔性区域。形成在柔性区域的基底膜上的导体层的平均厚度“tf”和形成在刚性区域中的基底膜上的导体层的平均厚度“tR”满足tf

7. 发明公开

EP1640109A2 Verfahren zur Laserbearbeitung beschichteter Bleche 审中-公开
公开(公告)号：EP1640109A2
公开(公告)日：2006-03-29
申请号：EP05028329.0
申请日：2003-09-03
申请人： DaimlerChrysler AG
发明人： Becker, Wolfgang, Dr. , Goth, Klaus , Pälmer, Mike , Reiniger, Claus-Dieter , Zauner, Daniel
IPC分类号： B23K26/32 , B23K26/42 , B23K26/10
CPC分类号： C23F4/04 , B23K26/082 , B23K26/32 , B23K33/008 , B23K2201/18 , B23K2201/34 , B23K2203/08 , B23K2203/50
摘要： Bei vielen beschichteten Bleche, insbesondere bei Zink-beschichteten Blechen wie sie in der Automobilindustrie Verwendung finden, weist das Beschichtungsmaterial einen deutlich niedrigeren Siedepunkt auf als das Material des Bleches. Dadurch kommt es beim Zusammenschweissen derartiger Bleche zu explosionsartigen Verdampfungen von Beschichtungsmaterial, welche die Qualität der Verbindung stark beeinträchtigen. Zur Verbesserung der Verbindungsqualität wurde bereits vorgeschlagen mittels Abstandhaltern enge Spalten zwischen den Blechen zu erzeugen, in die das verdampfende Beschichtungsmaterial entweichen kann. Die Abstandhalter sollen z.B. durch Laserbeschuß der Bleche erzeugt werden. Nachteilig dabei ist vor allem die erforderliche relativ lange Bearbeitungszeit, welche insbesondere in der Serienproduktion erhebliche Kosten verursacht.
Die Aufgabe der vorliegenden Erfindung besteht daher darin, die erforderliche Bearbeitungszeit der Bleche zu senken und dabei die Bearbeitungsqualität mindestens beizubehalten, vorzugsweise zu verbessern.
Die Aufgabe wird gelöst, durch ein Verfahren, bei dem der Laserstrahl mittels einer Scanner-Einrichtung auf die Oberfläche gelenkt wird. Eine Scanner-Einrichtung ist eine besonders schnelle und flexible Stahlablenk-Einrichtung. Dies ermöglicht eine Verringerung der Bearbeitungszeit um den Faktor 10 ohne die Bearbeitungsqualität zu vermindern
摘要翻译：该方法包括在激光器的至少一个片材的至少一侧上产生从表面突出的至少一个拓扑变化。激光束通过扫描装置扫过片材的表面。激光束不聚焦在片材的表面上。激光束通过熔化通过片材产生至少一个形貌变化。

8. 发明公开

EP0411061A4 FE-MN-AL-C ALLOYS AND THEIR TREATMENT 失效
标题翻译： FE-MN-AL-C合金及其处理
公开(公告)号：EP0411061A4
公开(公告)日：1992-08-19
申请号：EP89908909
申请日：1989-07-06
申请人： FAMCY STEEL CORPORATION
发明人： WAN, CHI-MEEN
IPC分类号： C21C7/00 , C21C7/072 , C21D1/09 , C22C30/00 , C22C33/04 , C22C38/00 , C22C38/04 , C22C38/06 , C22C38/38 , C23F1/30 , C23F4/04 , C23G1/08 , C25F3/00 , C25F3/14 , B23K7/00 , C22B9/20 , C23C22/00 , C25F1/06
CPC分类号： C25F3/00 , C21D1/09 , C22C38/04 , C22C38/06 , C23F4/04 , C23G1/08 , Y10S148/901 , Y10T428/12458
摘要： This invention describes a series of Fe-Mn-Al-C based corrosion resistance alloys. It also describes how to obtain such alloys which have good corrosion resistance in many environments as compared to conventional stainless steel such as 304 and 430. The correlation of chemical composition among the manganese, aluminum, carbon and other minor elements is discussed. According to more advanced understanding the Fe-Mn-Al-C based alloys have to be surface treated and/or pickled, passivated by the methods included described. After the surface treatment, the final product will have a depleted manganese and/or higher chromium content on the alloy surface and will have better corrosion resistance than the conventional Fe-Mn-Al-C and Fe-Mn-Al-C-Cr based alloys. In addition, the manufacture and fabrication processes for the present designed Fe-Mn-Al-C based alloys also include melting, mixing, ingot casting, hot working, cold working, heat treatment and surface treatment.

9. 发明授权

EP2966193B1 CHROMIUM-FREE SILICATE-BASED AQUEOUS SLURRY COMPOSITIONS 有权转让
公开(公告)号：EP2966193B1
公开(公告)日：2018-09-26
申请号：EP15171067.0
申请日：2013-11-07
申请人： Praxair S.T. Technology, Inc.
发明人： Belov, Irina , Copeland, Daryl G.
IPC分类号： C23C24/08 , C23C30/00 , C23C24/00
CPC分类号： C23C28/04 , B05D3/007 , B05D2350/60 , C09D5/08 , C23C24/08 , C23C30/00 , C23F4/04
摘要： A composition based on a certain chromium-free silicate-based binder is described. The one-part slurry composition is an aqueous solution of lithium-doped potassium silicate in combination with an aluminum or aluminum alloy powder. The one-part slurry composition produces a corresponding coating exhibiting improved performance at a reduced coating thickness.

10. 发明公开

EP3127647A1 METHOD FOR PRODUCING METAL LAMINATE MATERIAL 有权转让
标题翻译： VERFAHREN ZUR HERSTELLUNG VON金属材料
公开(公告)号：EP3127647A1
公开(公告)日：2017-02-08
申请号：EP15772918.7
申请日：2015-03-27
申请人： Toyo Kohan Co., Ltd.
发明人： NANBU Kouji , KUROKAWA Teppei , KOSHIRO Takashi , OKAYAMA Hironao
IPC分类号： B23K20/00 , B32B15/01
CPC分类号： B23K20/2275 , B23K20/002 , B23K20/023 , B23K20/04 , B23K20/16 , B23K20/24 , B23K35/0238 , B23K2103/02 , B23K2103/05 , B23K2103/08 , B23K2103/10 , B23K2103/14 , B23K2103/15 , B23K2103/166 , B23K2103/18 , B23K2103/20 , B23K2103/26 , B32B15/01 , B32B15/012 , B32B15/043 , B32B15/18 , B32B15/20 , C23F4/04 , H01J37/34
摘要： An object of the present invention is to provide a method for producing a metal laminate material that maintains sufficient bonding strength and has superior production efficiency. A method for producing a metal laminate material by bonding two sheets, one sheet composed of a material M1 and the other sheet composed of a material M2, wherein each of M1 and M2 is a metal or alloy comprising any one or more selected from the group consisting of Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Pd, Ag, In, Sn, Hf, Ta, W, Pb, and Bi, comprises the steps of: subjecting the faces of the two sheets to be bonded to sputtering treatment with inert gas ions under vacuum such that oxide layers on surface layers remain; temporarily bonding the two sheets by roll pressure bonding; and conducting a thermal treatment to thereby bond the two sheets, and, when Tm1 > Tm2 where Tm1(K) is the melting point of M1 and Tm2(K) is the melting point of M2, the temperature of the thermal treatment is 0.45Tm2 or more and less than 0.45Tm1, provided that the temperature is not more than Tm2.
摘要翻译：本发明的目的在于提供一种能够保持充分的接合强度并且生产效率优异的金属层压材料的制造方法。一种金属层叠材料的制造方法，其特征在于，通过将两片材料接合而成的金属层叠体的制造方法，由材料M1构成的一片和由所述材料M2构成的另一片材，其中，所述M1和M2各自为金属或合金，由Mg，Al，Ti，Cr，Mn，Fe，Co，Ni，Cu，Zn，Nb，Mo，Pd，Ag，In，Sn，Hf，Ta，W，Pb和Bi组成，包括以下步骤：在惰性气体离子的真空下对两片的表面进行接合以进行溅射处理，使得保留表面层上的氧化物层; 通过辊压粘合暂时粘接两片; 进行热处理，从而使两片结合，Tm1> Tm2，Tm1（K）为M1的熔点，Tm2（K）为M2的熔点，热处理温度为0.45Tm 2 或更多且小于0.45Tm1，条件是温度不大于Tm2。

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