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    • 2. 发明公开
    • PHOTOCURABLE CONDUCTIVE COATING COMPOSITION.
    • PHOTHÄRTBARELEITFÄHIGEÜBERZUGSMASSE。
    • EP0626431A4
    • 1997-10-22
    • EP94901024
    • 1993-12-01
    • SEKISUI CHEMICAL CO LTD
    • SUGIMOTO TOSHIYASUEZAKI MINORUMARUYAMA KOUJI
    • C08F2/44C08F2/48C08F2/50C08F261/12C08F290/00C08F299/02C09D4/00C09D4/06C09D5/00C09D5/24H01B1/20C09D133/04C09D159/00H01B1/22
    • H01B1/20C08F261/12C09D5/24Y10T428/131Y10T428/1317Y10T428/1321C08F220/20
    • A photocurable conductive coating composition which is useful as an antistatic material for articles for which static-charge buildup must be strictly avoided, such as semiconductor wafer packages, electronic and electric members, and flooring and wall-covering materials of semiconductor manufacturing plants, and which can be readily applied by general coating techniques and readily cured by ultraviolet or visible light to give a coating film excellent in antistatic property, transparency, hardness and marring resistance. The composition comprises: (a) 100 parts by weight of powdery tin oxide having a particle diameter of 0.01-0.4 νm and containing antimony oxide, (b) 10-100 parts by weight of a (meth)acrylate compound having at least two (meth)acryloyl groups in its molecule, (c) 10-100 parts by weight of a polyacetal resin having a residual hydroxyl content of 20-80 mole %, (d) 0.1-10 parts by weight of a photopolymerization initiator, and (e) 100-1,000 parts by weight of an organic solvent.
    • 必须严格防止半导体晶片封装,电子电气构件,半导体制造工厂的地板和墙壁覆盖材料等必须严格防止静电累积的物品作为防静电材料有用的光固化性导电涂料组合物, 可以通过一般的涂布技术容易地涂布,并且通过紫外线或可见光容易地固化,从而得到抗静电性,透明性,硬度和抗划伤性优异的涂膜。 该组合物包含:(a)100重量份粒径为0.01-0.4νm且含有氧化锑的粉状氧化锡,(b)10-100重量份具有至少两个(甲基)丙烯酸酯基的(甲基) (c)10-100重量份残余羟基含量为20-80摩尔%的聚缩醛树脂,(d)0.1-10重量份光聚合引发剂,和(e) )100-1,000重量份的有机溶剂。
    • 3. 发明公开
    • PHOTOCURABLE CONDUCTIVE COATING COMPOSITION
    • 可光固化导电涂料组合物
    • EP0626431A1
    • 1994-11-30
    • EP94901024.3
    • 1993-12-01
    • SEKISUI CHEMICAL CO., LTD.
    • SUGIMOTO, ToshiyaSUEZAKI, MinoruMARUYAMA, Kouji
    • C09D5/24C09D133/04C09D159/00H01B1/22
    • H01B1/20C08F261/12C09D5/24Y10T428/131Y10T428/1317Y10T428/1321C08F220/20
    • A photocurable conductive coating composition which is useful as an antistatic material for articles for which static-charge buildup must be strictly avoided, such as semiconductor wafer packages, electronic and electric members, and flooring and wall-covering materials of semiconductor manufacturing plants, and which can be readily applied by general coating techniques and readily cured by ultraviolet or visible light to give a coating film excellent in antistatic property, transparency, hardness and marring resistance. The composition comprises: (a) 100 parts by weight of powdery tin oxide having a particle diameter of 0.01-0.4 µm and containing antimony oxide, (b) 10-100 parts by weight of a (meth)acrylate compound having at least two (meth)acryloyl groups in its molecule, (c) 10-100 parts by weight of a polyacetal resin having a residual hydroxyl content of 20-80 mole %, (d) 0.1-10 parts by weight of a photopolymerization initiator, and (e) 100-1,000 parts by weight of an organic solvent.
    • 必须严格防止半导体晶片封装,电子电气构件,半导体制造工厂的地板和墙壁覆盖材料等必须严格防止静电累积的物品作为防静电材料有用的光固化性导电涂料组合物, 可以通过一般的涂布技术容易地涂布,并且通过紫外线或可见光容易地固化,从而得到抗静电性,透明性,硬度和抗划伤性优异的涂膜。 该组合物包含:(a)100重量份粒径为0.01-0.4μm且含有氧化锑的粉末状氧化锡,(b)10-100重量份具有至少两个(甲基)丙烯酸酯基的(甲基) (c)10-100重量份残余羟基含量为20-80摩尔%的聚缩醛树脂,(d)0.1-10重量份光聚合引发剂,和(e) )100-1,000重量份的有机溶剂。
    • 5. 发明公开
    • POLYVINYL ACETAL-BASED RESIN COMPOSITION
    • 聚乙烯乙缩醛树脂组合物
    • EP2902439A1
    • 2015-08-05
    • EP13842039.3
    • 2013-09-20
    • Sekisui Chemical Co., Ltd.
    • NAGAI YasuharuMIKAYAMA Kaoru
    • C08L29/14C08F2/44C08F261/12C08L33/04
    • C08L33/14C08F261/12C08L29/14C08L2205/22C08L33/06C08L51/003C08L33/068C08F220/18
    • The present invention provides a polyvinyl acetal resin composition exerting excellent mechanical strength over a wide temperature range from low temperatures to high temperatures. The present invention provides a polyvinyl acetal resin composition containing a polyvinyl acetal resin and a resin having a crosslinked structure, the polyvinyl acetal resin composition having a structure in which the resin having a crosslinked structure is dispersed as a dispersed phase in the polyvinyl acetal resin as a continuous phase, the polyvinyl acetal resin composition having a maximum value of a loss tangent derived from the polyvinyl acetal resin at 40°C or higher and a maximum value of a loss tangent derived from the resin having a crosslinked structure at 10°C or lower in measurement of a dynamic viscoelasticity spectrum at a frequency of 10 Hz.
    • 本发明提供在从低温到高温的广泛的温度范围内发挥优异的机械强度的聚乙烯醇缩醛树脂组合物。 本发明提供一种含有聚乙烯醇缩醛树脂和具有交联结构的树脂为聚乙烯醇缩醛树脂组合物,具有在其中具有交联结构的树脂被分散于聚乙烯醇缩醛树脂作为分散相结构的聚乙烯醇缩醛树脂组合物 连续相,在40℃或更高的具有从上述聚乙烯醇缩醛树脂衍生的损耗角正切的最高值的聚乙烯醇缩醛树脂组合物,并在10℃或具有交联结构的树脂得到的损耗角正切的最高值 在10Hz的频率下测量动态粘弹性谱时较低。
    • 7. 发明公开
    • Reactive plastisol dispersion
    • 反应性塑料溶胶分散体
    • EP0124808A1
    • 1984-11-14
    • EP84104356.5
    • 1984-04-17
    • W.R. Grace & Co.-Conn.
    • Shiow, Cing Lin
    • C08L29/14C09J3/14
    • C08F283/10C08F261/12
    • This invention reiates to a reactive plastisol dispersion composition comprising

      (1) at least one polyvinyl acetal thermoplast in powder form, which is insoluble in the plasticizer at room temperature and plasticizable at a temperature at or above fluxing temperature, and which thermoplast has a flow temperature at 1,000 psi of between 100° and 200°C;
      (2) a liquid plasticizer comprising an epoxide resin having on average more than one epoxide group in the molecule or a mixture of said epoxide resins in combination with a member of the group consisting of

      (a) at least one ethylenically unsaturated monomer, oligomer or prepolymer of the formula:
      wherein R is H or CH 3 , R, is an organic moiety and n is 1 or more,
      (b) at least one unsaturated polyester containing the group:
      wherein R 2 and R 3 are organic moieties, x is 0-20 and y is 1-20 and y is 1-20, and
      (c) a mixture of (a) and (b);

      (3) an effective amount of a latent curing agent for said epoxide resin, which is inactive in the epoxide resin at room temperature and which is selected from the group consisting of dicyandiamide, melamine,guanamine, polycarboxylic acid polyhydrazides, carboxylic acid imides, imidazole derivatives, BF 3 adducts and diaryliodonium salts;

      and, optionally,

      (4) a curing agent for the plasticizer group member comprising a free radical thermal initiator.

      The plastisol dispersion after fluxing can form a thermoset sealant, coating or adhesive on exposure to heat.
    • 本发明涉及一种反应性增塑溶胶分散体组合物,其包含(1)至少一种粉末形式的聚乙烯醇缩醛热塑性塑料,其在室温下不溶于增塑剂并且在熔融温度或以上的温度下可塑化,并且该热塑性塑料的流动温度 在100°和200°C之间的1,000psi下; (2)液体增塑剂,其包含分子中平均具有多于一个环氧基团的环氧树脂或所述环氧树脂的混合物与(a)至少一种烯键式不饱和单体,低聚物或 下式的预聚物:其中R是H或CH 3,R 1是有机部分,n是1或更大,(b)至少一种含有以下基团的不饱和聚酯:其中R 2和R 3是有机部分,x是0-20 (c)(a)和(b)的混合物;和(c)(a)和(b)的混合物。 (3)用于所述环氧树脂的潜在固化剂的有效量,所述固化剂在室温下在环氧树脂中是惰性的并且选自双氰胺,三聚氰胺,胍胺,聚羧酸多酰肼,羧酸酰亚胺,咪唑 衍生物,BF 3加合物和二芳基碘鎓盐; 以及任选地(4)用于包含自由基热引发剂的增塑剂组成员的固化剂。 助熔后的增塑溶胶分散体在暴露于热时可形成热固性密封剂,涂料或粘合剂。