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1. 发明公开

EP3381052A1 ELEKTRISCHES BAUELEMENT MIT DÜNNER LOT-STOPP-SCHICHT UND VERFAHREN ZU SEINER HERSTELLUNG 审中-实审
公开(公告)号：EP3381052A1
公开(公告)日：2018-10-03
申请号：EP16762778.5
申请日：2016-09-06
申请人： SnapTrack, Inc.
发明人： SCHMAJEW, Alexander
IPC分类号： H01L23/498 , H01L23/485 , H01L21/60 , H01L21/56 , B81C3/00
CPC分类号： H01L24/16 , B81C3/00 , H01L21/4846 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3121 , H01L23/49811 , H01L23/49838 , H01L23/49894 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/02375 , H01L2224/0239 , H01L2224/0401 , H01L2224/10145 , H01L2224/10175 , H01L2224/1132 , H01L2224/1148 , H01L2224/11849 , H01L2224/131 , H01L2224/13294 , H01L2224/133 , H01L2224/16058 , H01L2224/16059 , H01L2224/16145 , H01L2224/16227 , H01L2224/16238 , H01L2224/81192 , H01L2224/81815 , H01L2924/181 , H01L2924/3841 , H01L2924/014 , H01L2924/00014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01079 , H01L2924/01047 , H01L2924/00012
摘要： The invention relates to an electrical module (EB) and to a method for producing an electrical module (EB). The module (EB) has a substrate (TR) with an upper layer (O) and a metal contact surface (MK) arranged thereon, as well as a solder resist layer (LSS) that covers part of the upper side (O), but not the contact surface (MK). The module (EB) also comprises an electrical component (EK) with a contact surface (KF) on the lower side and a solder bump connection (BU) that connects the two contact surfaces (MK, KF). The solder resist layer (O) has a maximum thickness of 200 nm and thereby simplifies subsequent method steps for the encapsulation of the module (EB) with a mould mass (MM).

2. 发明公开

EP0948408A1 MICROFABRICATED SLEEVE DEVICES FOR CHEMICAL REACTIONS 失效
标题翻译：微型化学反应器
公开(公告)号：EP0948408A1
公开(公告)日：1999-10-13
申请号：EP97954135.0
申请日：1997-12-03
申请人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
发明人： NORTHRUP, M., Allen
IPC分类号： C12N15 , B01J19 , B01L3 , B01L7 , C12M1 , C12Q1 , G01N21 , B01L9 , B81B1 , B81C3
CPC分类号： B01L7/52 , B01J19/0046 , B01J19/0093 , B01J2219/00783 , B01J2219/00822 , B01J2219/00824 , B01J2219/00828 , B01J2219/00853 , B01J2219/00873 , B01J2219/00889 , B01J2219/00891 , B01J2219/00912 , B01J2219/00936 , B01J2219/00945 , B01J2219/00952 , B01L3/5027 , B01L3/502707 , B01L9/527 , B01L2200/027 , B01L2200/028 , B01L2200/10 , B01L2200/12 , B01L2300/0645 , B01L2300/0654 , B01L2300/0867 , B01L2300/087 , B01L2300/1822 , B01L2300/1827 , B01L2400/0415 , B01L2400/0421 , B01L2400/0439 , B01L2400/0487 , B81C3/00 , G01N21/0332 , G01N21/05 , G01N21/69 , G01N21/76 , G01N2021/0346
摘要： A silicon-based sleeve type chemical reaction chamber (50) that combines doped silicon heating elements (57) and bulk silicon convective cooling elements (51, 52). A critical ratio of silicon and non-silicon based materials provides the thermal properties desired. The reaction chamber may be used for any chemical reaction, especially synthetic, thermal-cycling-based reactions such as the polymerase chain reaction (PCR) or ligase chain reaction.

3. 发明公开

EP4379394A1 MICROFLUIDIC CHIP AND METHOD FOR MANUFACTURING MICROFLUIDIC MICROCHIP 审中-公开
公开(公告)号：EP4379394A1
公开(公告)日：2024-06-05
申请号：EP22849459.7
申请日：2022-07-26
申请人： TOPPAN INC.
发明人： HAKII, Hidemitsu , FUKUGAMI, Norihito
IPC分类号： G01N35/08 , B01D19/00 , B01J19/00 , B05D3/06 , B81B1/00 , B81C1/00 , B81C3/00 , G01N37/00 , G03F7/40
CPC分类号： B01D19/00 , B01J19/00 , B05D3/06 , B81B1/00 , B81C1/00 , B81C3/00 , G01N35/08 , G01N37/00 , G03F7/40
摘要： There is provided a microfluidic chip and a method of producing the microfluidic chip, which can suppress poor bonding between a resin layer forming a channel and a lid component, and can suppress deformation of the channel. A microfluidic chip (1) includes a substrate (10), a partition layer (11) configured by a resin material and provided on the substrate (10) to form a channel, and a cover layer (12) provided on the surface of the partition layer (11) facing away from the substrate (10), wherein the partition layer (11) has an elastic modulus in the range of 1 MPa or more and 10 GPa or less.

4. 发明公开

EP3279934A1 PACKAGE PRODUCTION METHOD AND PACKAGE PRODUCED BY SAME METHOD 审中-公开
标题翻译：包装生产方法和由相同方法生产的包装
公开(公告)号：EP3279934A1
公开(公告)日：2018-02-07
申请号：EP15887704.3
申请日：2015-08-18
申请人： Tanaka Kikinzoku Kogyo K.K.
发明人： OGASHIWA, Toshinori , SASAKI, Yuya , MIYAIRI, Masayuki
IPC分类号： H01L23/02 , B81C3/00
CPC分类号： B81C1/00269 , B81C3/00 , B81C2203/0118 , B81C2203/019 , B81C2203/036 , H01L23/02
摘要： The present invention relates to a package production method includes the step of superposing a pair of substrates on each other, and bonding the substrates to each other to hermetically seal the inside of a sealing region surrounded by a sealing material, which is formed on any of the substrates. The sealing material is formed of a sintered body obtained by sintering a metal powder of at least one selected from gold, silver, palladium and platinum, the metal powder having a purity of 99.9% by weight or more and an average particle size of 0.005 µm to 1.0 µm, at least one core material having a width smaller than the width of the sealing material in a cross-sectional shape, and protruding from the periphery is formed on the substrate, and the core material compresses the sealing material to exhibit a sealing effect when the pair of substrates are bonded to each other. Accordingly, a sufficient sealing effect can be exhibited while a pressuring force to the substrate is reduced.
摘要翻译：本发明涉及一种封装件的制造方法，其包括：将一对基板重叠并将各基板彼此贴合，以气密密封由密封材料包围的密封区域的内部的步骤，所述密封材料形成于基材。密封材料由通过烧结选自金，银，钯和铂中的至少一种金属粉末而获得的烧结体形成，所述金属粉末具有99.9重量％以上的纯度和0.005μm的平均粒径在所述基板上形成至少一个宽度小于所述密封材料的横截面形状的宽度且从所述周边突出的芯材，并且所述芯材压缩所述密封材料以显示密封当一对衬底相互结合时的效果。因此，能够在对基板的按压力降低的同时发挥充分的密封效果。

5. 发明公开

EP2373060A3 Silicon condenser microphone and manufacturing method 审中-公开
标题翻译： Siliciumkondensatormikrofon und Herstellungsverfahrendafür
公开(公告)号：EP2373060A3
公开(公告)日：2014-05-28
申请号：EP11167778.7
申请日：2005-06-15
申请人： Knowles Electronics, LLC
发明人： Minervini, Anthony D
IPC分类号： H04R19/04 , B81B7/00 , H04R19/00 , H04R19/01 , H04R31/00
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit if formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
摘要翻译：公开了一种硅电容麦克风封装。硅电容麦克风封装包括换能器单元，基板和盖。基板包括其中形成有凹部的上表面。换能器单元附接到基板的上表面并且与凹部的至少一部分重叠，其中如果形成在换能器单元和基板之间，则换能器单元的后部体积。盖子放置在换能器单元上方并包括孔。

6. 发明公开

EP0871545A1 SILICON-BASED SLEEVE DEVICES FOR CHEMICAL REACTIONS 失效
标题翻译： ON硅基COAT器件进行化学反应
公开(公告)号：EP0871545A1
公开(公告)日：1998-10-21
申请号：EP96921649.0
申请日：1996-06-17
申请人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
发明人： NORTHRUP, M., Allen , MARIELLA, Raymond, P. , CARRANO, Anthony, V. , BALCH, Joseph, W.
IPC分类号： C12N15 , B01J19 , B01L7 , C12M1 , C12Q1 , G01N21 , B81B1 , B81C3
CPC分类号： G01N21/69 , B01J19/0046 , B01J19/0093 , B01J2219/00828 , B01J2219/00853 , B01J2219/00873 , B01J2219/00889 , B01J2219/00891 , B01J2219/00912 , B01J2219/00936 , B01J2219/00945 , B01J2219/00952 , B01L7/52 , B81C3/00 , G01N21/0332 , G01N21/05 , G01N21/76 , G01N2021/0346
摘要： A silicon-based sleeve type chemical reaction chamber (41) that combines heaters, such as doped polysilicon for heating, and bulk silicon for convection cooling. The reaction chamber combines a critical ratio of silicon and silicon nitride to the volume of material to be heated (e.g., a liquid) in order to provide uniform heating, yet low power requirements. The reaction chamber will also allow the introduction of a secondary tube (45) (e.g., plastic) into the reaction sleeve that contains the reaction mixture thereby alleviating any potential materials incompatibility issues. The reaction chamber may be utilized in any chemical reaction system for synthesis or processing of organic, inorganic, or biochemical reactions, such as the polymerase chain reaction (PCR) and/or other DNA reactions, such as the ligase chain reaction, which are examples of a synthetic, thermal-cycling-based reaction. The reaction chamber may be used in synthesis instruments, particularly those for DNA amplification and synthesis.

7. 发明公开

EP3163352A4 MIRROR DRIVE DEVICE AND METHOD FOR PRODUCING SAME 有权
公开(公告)号：EP3163352A4
公开(公告)日：2018-02-14
申请号：EP15814142
申请日：2015-06-10
申请人： HAMAMATSU PHOTONICS KK
发明人： TAKIMOTO SADAHARU , IWASHINA SHINYA , KIMOTO MASAKUNI , MORINAGA YUKI
IPC分类号： G02B26/08 , B81B3/00 , B81C3/00 , G02B26/10
CPC分类号： B81B3/00 , B81C3/00 , G02B26/085 , G02B26/101
摘要： In a case where a drive coil is disposed in a surface of a movable part, the surface being opposite to a mirror, a reduction in size is achieved while a magnetic field exerted on the drive coil is secured. A mirror drive device 1 includes a support part 20, a movable part 22, a permanent magnet 10 which forms a magnetic field in the periphery of the movable part 22, and a circuit board 12 which is disposed between the support part 20 and the permanent magnet 10 in a facing direction of a pair of principal surfaces of the movable part 22 so as to cause the movable part 22 to be positioned at an inside of the circuit board 12 when viewed in the facing direction. The movable part 22 includes a mirror disposition portion 36, a mirror 48 disposed at a principal surface 36b side, and a drive coil 46 disposed at the principal surface 36a side so as to face the permanent magnet 10. The support part 20 includes a base portion 24 connected to a connection member 38 and a reinforcing portion 26 which extends from the base portion 24 toward a side away from the permanent magnet 10 and the circuit board 12. The drive coil 46 is connected to electrodes 56a to 56d by lead-out conductors 42a to 42d.

8. 发明公开

EP3032315A2 BIAXIAL OPTICAL DEFLECTOR INCLUDING MULTIPLE MIRROR UNITS, RADAR SYSTEM AND ITS MANUFACTURING METHOD 审中-公开
标题翻译：双轴光学偏转器，包括多个反射镜单元，雷达系统及其制造方法
公开(公告)号：EP3032315A2
公开(公告)日：2016-06-15
申请号：EP15198702.1
申请日：2015-12-09
申请人： Stanley Electric Co., Ltd.
发明人： YASUDA, Yoshiaki
IPC分类号： G02B26/08 , G02B5/124
CPC分类号： G02B26/0858 , B81C3/00 , G01S7/4817 , G02B26/12
摘要： In a biaxial optical deflector, multiple mirror units (13S) are arranged in an array. Each of the mirror units (13S) includes one mirror (13a) and one mirror driver (13b) coupled to said mirror (13a) for rocking the mirror (13a).
摘要翻译：在双轴光学偏转器中，多个镜单元（13S）排列成阵列。每个反射镜单元（13S）包括耦合到所述反射镜（13a）的一个反射镜（13a）和一个反射镜驱动器（13b），用于摇动反射镜（13a）。

9. 发明公开

EP1346947A3 Electrostatically operated optical switching or attenuating devices 审中-公开
标题翻译：静电操作的光开关或衰减器件
公开(公告)号：EP1346947A3
公开(公告)日：2004-04-14
申请号：EP03006169.1
申请日：2003-03-19
申请人： JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
发明人： Norimatsu, Toshihide, Japan Electronics Indust.Ltd
IPC分类号： G02B6/35
CPC分类号： G02B6/357 , B81C3/00 , G02B6/266 , G02B6/3514 , G02B6/3518 , G02B6/355 , G02B6/3552 , G02B6/3584 , G02B6/3594 , G02B26/0841
摘要： In an electrostatically operated device in which on the bottom surface side and the top surface side of a movable plate-like electrode are disposed a stationary electrode substrate (8) and a second stationary plate-like electrode (40) substantially in parallel with the movable plate-like electrode (2), the movable plate-like electrode is maintained at a position that is away by a first predetermined distance from the stationary electrode substrate and by a second predetermined distance from the second stationary plate-like electrode when any drive voltage is not applied to the second stationary plate-like electrode and to the stationary electrode substrate. In operation, a drive voltage more than or less than the pull-in voltage is applied to the second stationary plate-like electrode or the stationary electrode substrate, thereby to drive electrostatically the movable plate-like electrode toward the second stationary plate-like electrode or the stationary electrode substrate.
摘要翻译：在静电驱动装置中，在可动板状电极的底面侧和顶面侧设置有与固定电极基板（8）大致平行的固定电极基板（8）和第二固定板状电极（40）所述可动板状电极被保持在从所述固定电极基板离开第一规定距离的位置和从所述第二固定板状电极离开第二规定距离时的任意驱动电压不施加到第二固定板状电极和固定电极基板。在操作中，将大于或小于引入电压的驱动电压施加到第二固定板状电极或固定电极基板，从而将可移动板状电极静电驱动到第二固定板状电极或固定电极基板。

10. 发明公开

EP1346947A2 Electrostatically operated optical switching or attenuating devices 审中-公开
标题翻译： Elektrostatisch betriebene optische Schalter-oderDämpfungsbauelemente
公开(公告)号：EP1346947A2
公开(公告)日：2003-09-24
申请号：EP03006169.1
申请日：2003-03-19
申请人： JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
发明人： Norimatsu, Toshihide, Japan Electronics Indust.Ltd
IPC分类号： B81B3/00 , B81B7/02 , G02B6/35 , G02B6/26 , G02B26/08 , H01G5/00
CPC分类号： G02B6/357 , B81C3/00 , G02B6/266 , G02B6/3514 , G02B6/3518 , G02B6/355 , G02B6/3552 , G02B6/3584 , G02B6/3594 , G02B26/0841
摘要： In an electrostatically operated device in which on the bottom surface side and the top surface side of a movable plate-like electrode are disposed a stationary electrode substrate (8) and a second stationary plate-like electrode (40) substantially in parallel with the movable plate-like electrode (2), the movable plate-like electrode is maintained at a position that is away by a first predetermined distance from the stationary electrode substrate and by a second predetermined distance from the second stationary plate-like electrode when any drive voltage is not applied to the second stationary plate-like electrode and to the stationary electrode substrate. In operation, a drive voltage more than or less than the pull-in voltage is applied to the second stationary plate-like electrode or the stationary electrode substrate, thereby to drive electrostatically the movable plate-like electrode toward the second stationary plate-like electrode or the stationary electrode substrate.
摘要翻译：在静电操作装置中，在可动板状电极的底表面侧和顶表面侧设置有固定电极基板（8）和与可动板状基本平行的第二固定板状电极（40）板状电极（2）中，当任何驱动电压（2），可移动板状电极保持在离开固定电极基板离开第一预定距离并且距离第二固定板状电极第二预定距离的位置不施加到第二固定板状电极和固定电极基板。在操作中，将大于或小于引入电压的驱动电压施加到第二固定板状电极或固定电极基板，从而将可动板状电极静电驱动到第二固定板状电极或固定电极基板。

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