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    • 10. 发明公开
    • Improved protected conductive foil assemblage and procedure for preparing same using static electrical forces
    • 防护导电箔层的结构和工艺,使用静电力其生产。
    • EP0535868A1
    • 1993-04-07
    • EP92308723.3
    • 1992-09-24
    • GOULD ELECTRONICS INC.
    • Chamberlain, Jamie H.Callahan, John P.Savage, Rolland D.Burgess, David P.
    • H05K3/02B32B7/06B32B31/08
    • B32B37/00B32B2037/1063B32B2310/021H05K3/022H05K3/025H05K2201/0355
    • A conductive copper foil (20) for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering at least one side of the foil (20) with a sheet of plastic film (24). The film (24) is removably joined with the foil (20) as a result of the essential absence of gaseous material between the film (24) and the foil (20). Thus, the film (24) conforms intimately to the contours and shape of the foil surface and clings tightly thereto to permit movement and further processing of the foil (20) with the film (24) adhering tightly thereto. The absence of air between the film and the foil is produced by oppositely statically electrically charging the film (24) and the foil (20) such that they are forced together sufficiently to squeeze the air out from therebetween. The film (24) is selected to be sufficiently resistant to laminating temperature and pressure conditions so as to remain in its covering, protecting relationship to the foil and avoid sticking to the laminating press plate and retain its removability from the foil (20) after lamination.
    • 的导电铜箔(20),用于制备印刷电路板是从损伤贮存,运输和进一步加工期间通过用塑料薄膜 - (24)的片材覆盖所述箔(20)的至少一侧的保护。 膜(24)可移除地与箔片(20)作为薄膜(24)和所述箔(20)之间的基本上无气体材料的结果连接。 因此,该膜(24)紧密地符合该箔表面的轮廓和形状,并紧密地紧贴于其上足以允许箔片(20)与所述膜(24)的移动和进一步加工此紧密附着。 在膜和箔之间没有空气通过相对静态带电的膜(24)和GDP是可以被压在一起,足以从其间挤空气从检查的箔(20)产生的。 所述膜(24)被选择为在层压温度和压力条件有足够的耐以便保持在其覆盖,保护所述箔片的关系,避免粘附到层压压机板上并从层叠后的箔片(20)保持其可去除性 ,