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1. 发明授权

EP2023007B1 DAMPER FOR AUTOMOBILES FOR REDUCING VIBRATION OF AUTOMOBILE BODY 有权
标题翻译：汽车减振器减少汽车车身振动
公开(公告)号：EP2023007B1
公开(公告)日：2017-07-26
申请号：EP07742685.6
申请日：2007-04-27
申请人： Shinko Electric Co., Ltd
发明人： MURAGISHI, Yasushi , MORIYA, Hideaki , SATO, Yushi , FUKUNAGA, Takashi , NAKANO, Katsuyoshi , NAKAGAWA, Hiroshi , FUJII, Takayoshi , ONOUE, Takashi , NARIHISA, Masaaki
IPC分类号： F16F15/02 , B60G13/16 , B60G17/015 , B60K5/12 , B60R16/02 , B62D27/04 , G05D19/02 , G10K11/178 , H04R3/00 , F16F7/10
CPC分类号： F16F7/1005 , B60G17/018 , F16F15/002 , G05D19/02 , G06F7/76

2. 发明公开

EP2006983A9 MAGNET BRUSHLESS GENERATOR AND MAGNET BRUSHLESS STARTER 审中-公开
标题翻译：磁无刷发电机及磁性无刷STARTER
公开(公告)号：EP2006983A9
公开(公告)日：2009-07-29
申请号：EP07740432.5
申请日：2007-03-29
申请人： Shinko Electric Co., Ltd
发明人： NAKANISHI, Kazumasa, c/o Shinko Electric Co., Ltd., , SETA, Manabu, c/o Shinko Electric Co., Ltd., , WAKITA, Masaya, c/o Shinko Electric Co., Ltd.,
IPC分类号： H02K29/08 , H02K1/27 , H02K16/02 , H02K21/16
CPC分类号： H02K16/02 , H02K7/116 , H02K21/029
摘要： There is provided a magnet type brushless generator capable of particularly controlling an output voltage to be uniform even in a driving operation at a variable rpm from a low-speed rotation to a high-speed rotation.
The magnet type brushless generator includes a stator 20 having a plurality of stator magnetic poles around which winding wires for generating a rotation magnetic field are wound; a rotor 30 having a first field magnet 32 and a second field magnet 34 disposed coaxially with the first field magnet 32 in an opposed manner so as to be rotatable relative to the first field magnet; and a planetary gear mechanism 40 configured to control a relative rotation position of the first field magnet 32 and the second field magnet 34.

3. 发明公开

EP2023007A4 DAMPER FOR AUTOMOBILES FOR REDUCING VIBRATION OF AUTOMOBILE BODY 有权
标题翻译： DÄMPFERFÜRKRAFTFAHRZEUGE ZUR VERRINGERUNG VON SCHWINGUNGEN DER AUTOKAROSSERIE
公开(公告)号：EP2023007A4
公开(公告)日：2009-06-24
申请号：EP07742685
申请日：2007-04-27
申请人： SHINKO ELECTRIC CO LTD
发明人： MURAGISHI YASUSHI , MORIYA HIDEAKI , SATO YUSHI , FUKUNAGA TAKASHI , NAKANO KATSUYOSHI , NAKAGAWA HIROSHI , FUJII TAKAYOSHI , ONOUE TAKASHI , NARIHISA MASAAKI
IPC分类号： F16F15/02 , B60G13/16 , B60G17/015 , B60K5/12 , B60R16/02 , B62D27/04 , F16F7/10 , G05D19/02 , G10K11/178 , H04R3/00
CPC分类号： F16F7/1005 , B60G17/018 , F16F15/002 , G05D19/02 , G06F7/76
摘要： A damper for automobiles capable of producing good damping effect with a simple structure while ensuring high reliability. The damper is used for reducing the vibration of an automobile body and attached to the automobile body. The damper comprises an actuator for driving an auxiliary mass, a current detector for detecting the current flowing through an armature of the actuator, means for detecting the terminal voltage applied to the actuator, a computing circuit for computing the induced voltage of the actuator from the current detected by the current detector and the terminal voltage and computing at least one of the relative speed of the actuator, the relative shift thereof, and the relative acceleration thereof, and a control circuit for driving/controlling the actuator according to at least one of the relative speed, relative shift, and relative acceleration of the actuator computed by the computing circuit.
摘要翻译：用于汽车的阻尼器，能够在确保高可靠性的同时以简单的结构产生良好的阻尼效果。阻尼器用于减少车身振动并附着在车身上。阻尼器包括用于驱动辅助质量的致动器，用于检测流过致动器的电枢的电流的电流检测器，用于检测施加到致动器的端子电压的装置，用于从致动器的电感计算致动器的感应电压的计算电路由电流检测器和端子电压检测的电流，并且计算致动器的相对速度，其相对移位及其相对加速度中的至少一个;以及控制电路，用于根据以下至少一项来驱动/控制致动器：由计算电路计算的致动器的相对速度，相对偏移和相对加速度。

4. 发明公开

EP2036733A2 Information recording apparatus 有权
标题翻译：信息记录装置
公开(公告)号：EP2036733A2
公开(公告)日：2009-03-18
申请号：EP08252973.6
申请日：2008-09-08
申请人： Ricoh Company, Ltd. , Shinko Electric Co., Ltd , Wedg Co. Ltd
发明人： Tatewaki, Tadafumi , Sakurai, Hideo , Tsuji, Kazuhiro , Yoshida, Naoki
IPC分类号： B41J2/32
CPC分类号： B41J2/32 , B65H5/04 , B65H9/101 , B65H2403/5331 , B65H2404/64 , B65H2405/3322
摘要： An information recording apparatus enables information to be recorded in a thermosensitive recording medium accurately while preventing the development of skew. When a rewritable medium is conveyed to a recording unit, the rotation of the rewritable medium and its position with reference to an axis are adjusted. Specifically, the rewritable medium is held between guide pins to such an extent as not to warp the rewritable medium while the medium is sandwiched between a clamper and a conveyance tray, until the rewritable medium reaches the recording unit. Thus, the rewritable medium is delivered to the recording unit with an adjusted posture, allowing the recording unit to record information in the rewritable medium without the development of skew in the rewritable medium.
摘要翻译：信息记录装置能够使信息准确地记录在热敏记录介质中，同时防止歪斜的发展。当可重写介质被传送到记录单元时，可重写介质的旋转及其相对于轴的位置被调整。具体地，可重写介质被保持在引导销之间，直到介质被夹持器和输送托盘夹持，直到可重写介质到达记录单元为止不会使可重写介质变形。因此，可重写介质以调整后的姿势被传送到记录单元，允许记录单元将信息记录在可重写介质中而不会在可重写介质中产生歪斜。

5. 发明公开

EP1699078A4 IC CHIP MOUNTING BODY MANUFACTURING METHOD AND MANUFACTURING DEVICE 审中-公开
标题翻译： IC芯片ANBRINGKÖRPER进程和生产设施
公开(公告)号：EP1699078A4
公开(公告)日：2008-08-06
申请号：EP04807590
申请日：2004-12-22
申请人： SHINKO ELECTRIC CO LTD
发明人： INOUE TAICHI , ARIMA SUMIHIRO , NAGANO KAZUTAKA , MORITA MASASHI
IPC分类号： G06K19/077 , H01L21/60 , B42D15/10 , G06K19/00 , G06K19/07 , H01L21/00 , H01L21/52 , H01L23/498
CPC分类号： H01L24/86 , G06K19/07718 , G06K19/07749 , H01L21/67144 , H01L23/4985 , H01L23/49855 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01021 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , Y10T29/53178 , H01L2224/0401
摘要： A film substrate that has antenna circuits formed at a fixed spacing on one surface thereof is transported at a constant speed, and IC chips are moved along the film substrate, and are mounted at the fixed spacing on the film substrate so as to be connected to the antenna circuits.

6. 发明授权

EP1233244B1 Induction heating furnace and bottom tapping mechanism thereof 失效
标题翻译：感应加热炉及其底部攻丝机构
公开(公告)号：EP1233244B1
公开(公告)日：2007-08-15
申请号：EP02002367.7
申请日：1998-04-22
申请人： Shinko Electric Co. Ltd.
发明人： Tsuda, Masanori , Okuno, Atsushi , Nakai, Yasuhiro
IPC分类号： F27D3/15 , F27B14/06
CPC分类号： F27B14/20 , F27B14/04 , F27B14/063 , F27B2014/102 , F27D3/1509 , F27D3/1518 , F27D2099/0016

7. 发明公开

EP1734650A1 POWER GENERATION SYSTEM 审中-公开
标题翻译：发电系统
公开(公告)号：EP1734650A1
公开(公告)日：2006-12-20
申请号：EP05720772.2
申请日：2005-03-15
申请人： Shinko Electric Co., Ltd
发明人： Okubo, Kazuo , Morita, Masami , Nakano, Katsuyoshi
IPC分类号： H02P9/00 , F03D7/04 , F03D9/00
CPC分类号： F03D7/0244 , F03D7/00 , F05B2210/16 , H02P9/006 , H02P2101/15 , Y02E10/723 , Y02E10/725
摘要： Wind power can be always detected even when a wind turbine 11 forcibly brakes, as well as cost of components can be reduced. A generator includes a wind turbine 11 rotated by wind power to generate a driving force, a dynamo 19 operated by the driving force of the wind turbine 11 to generate electricity, a short-circuit brake 21 for switching the output side of the dynamo 19 between an output state and a short-circuit state, a rotational speed input unit 41 or an arithmetic processing part 51 for recognizing the magnitude of the wind power in both of the output and short-circuit states based on the rotational speeds of the wind turbine 11 in both of the output and short-circuit states, and an arithmetic processing part 51 for determining which state the dynamo 19 should be changed over to between the output and short-circuit states based on the rotational speed of the wind turbine 11 and controlling the switching of the short-circuit brake 21 based on the determination result.
摘要翻译：即使当风力涡轮机11强制制动时也可始终检测风力，并且可降低部件的成本。发电机包括由风力旋转以产生驱动力的风力涡轮机11，由风力涡轮机11的驱动力操作的发电机19以发电，短路制动器21用于将发电机19的输出侧切换输出状态和短路状态;转速输入单元41或算术处理部分51，用于基于风力涡轮机11的转速识别输出和短路状态两者中的风力的大小在输出和短路状态两者中，以及运算处理部分51，用于基于风力涡轮机11的转速确定发电机19应该切换到输出状态和短路状态之间的哪个状态，并且控制基于确定结果切换短路制动器21。

9. 发明公开

EP1463111A2 Multilayer circuit board with semiconductor chip 审中-公开
标题翻译： Mehrlagen-Leiterplatte mit Halbleiterchip
公开(公告)号：EP1463111A2
公开(公告)日：2004-09-29
申请号：EP04251460.4
申请日：2004-03-15
申请人： Shinko Electric Co. Ltd.
发明人： Sunohara, Masahiro, c/o Shinko Electric Ind , Higashi, Mitsutoshi, c/o Shinko Electric Ind , Murayama, Kei, Shinko Electric Ind
IPC分类号： H01L23/31
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/24 , H01L23/5389 , H01L24/27 , H01L24/29 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/274 , H01L2224/73253 , H01L2224/83191 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/10158 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H05K1/185 , H05K3/4644 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00
摘要： A method of production of a multilayer circuit board comprises a multilayer structure circuit formed by a plurality of interconnect layers (20) and insulation layers (18) stacked together and a semiconductor chip (30,112) included therein, including the steps of placing a semiconductor chip (30,112) having a polished back surface, with its active surface facing downward, on an already formed lower interconnect layer (20) and forming an insulation layer (38) over the semiconductor chip (30,112), the method further including the step of treating the polished back surface of the semiconductor chip (30,112) to improve its bondability with the insulation layer before the step for formation of the insulation layer (38).
摘要翻译：一种制造多层电路板的方法包括由堆叠在一起的多个互连层（20）和绝缘层（18）形成的多层结构电路和包括在其中的半导体芯片（30,112），包括以下步骤：将半导体芯片（30,112），其已经形成的下部互连层（20）上具有抛光后表面，其活性表面朝下，并在半导体芯片（30,112）上形成绝缘层（38），该方法还包括处理所述半导体芯片（30,112）的抛光后表面在形成所述绝缘层（38）的步骤之前改善其与所述绝缘层的粘结性。

10. 发明公开

EP1418617A3 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：EP1418617A3
公开(公告)日：2004-05-26
申请号：EP03256994.9
申请日：2003-11-05
申请人： Shinko Electric Co. Ltd.
发明人： Sunohara, Masahiro
IPC分类号： H01L21/60 , H01L23/538 , H01L25/065 , H01L21/768 , H01L23/48
CPC分类号： H01L25/50 , H01L21/304 , H01L21/31058 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/97 , H01L25/0657 , H01L2221/68345 , H01L2224/04105 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/12105 , H01L2224/16 , H01L2224/16235 , H01L2224/73204 , H01L2224/73259 , H01L2224/81005 , H01L2224/81801 , H01L2224/82005 , H01L2224/92224 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2224/82 , H01L2924/00 , H01L2224/05599 , H01L2224/81
摘要： The present invention relates to a method of manufacturing a semiconductor device, which comprises the steps of preparing a wiring substrate (11) having a wiring pattern on a surface, bonding a connection terminal of an electronic chip (20), which has a predetermined element and the connection terminal on one surface, to the wiring pattern of the wiring substrate (11) by a flip-chip bonding, forming an insulating film (24) on the wiring substrate (11) to have a film thickness that covers the electronic chip (20), or a film thickness that exposes at least another surface of the electronic chip (20), and reducing a thickness of the electronic chip (20) by grinding said other surface of the electronic chip (20) and the insulating film (24).
摘要翻译：本发明涉及一种制造半导体器件的方法，该方法包括以下步骤：制备在表面上具有布线图案的布线衬底（11）;将具有预定元件的电子芯片（20）的连接端子和连接端子通过倒装芯片接合连接到布线衬底（11）的布线图案，在布线衬底（11）上形成绝缘膜（24）以具有覆盖电子芯片（20）的所述另一表面或者暴露所述电子芯片（20）的至少另一表面的膜厚度，并且通过研磨所述电子芯片（20）的所述另一表面和所述绝缘膜（20）来减小所述电子芯片 24）。

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