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1. 发明公开

EP1993948A1 MEMS DEVICE 有权转让
标题翻译： MEMS器件
公开(公告)号：EP1993948A1
公开(公告)日：2008-11-26
申请号：EP07705267.8
申请日：2007-02-23
申请人： Wolfson Microelectronics plc
发明人： LAMING, Richard, Ian , TRAYNOR, Anthony
IPC分类号： B81C1/00
CPC分类号： B81C1/00158 , B81B3/0027 , B81B2201/0257 , B81C1/00246 , B81C1/00904 , B81C2201/056 , G01L9/0073 , H04R3/005 , H04R19/005 , H04R19/04
摘要： A method of fabricating a micro-electrical-mechanical system (MEMS) apparatus on a substrate (10) comprises the steps of processing the substrate (10) so as to fabricate an electronic circuit (11 ); depositing a first electrode (15) that is operably coupled with the electronic circuit (11 ); depositing a membrane (16) so that it is mechanically coupled to the first electrode (15); applying a sacrificial layer (50); depositing a structural layer (18) and a second electrode (17) that is operably coupled with the electronic circuit (11 ) so that the sacrificial layer (50) is disposed between the membrane (16) and the structural layer (18) so as to form a preliminary structure; singulating the substrate (10); and removing the sacrificial layer (50) so as to form a MEMS structure, in which the step of singulating the substrate (10) is carried out before the step of removing the sacrificial layer (50).

2. 发明授权

EP1996507B1 METHOD FOR FABRICATING A MEMS MICROPHONE 有权转让
标题翻译：用于生产MEMS显微镜
公开(公告)号：EP1996507B1
公开(公告)日：2015-03-04
申请号：EP07732064.6
申请日：2007-03-20
申请人： Wolfson Microelectronics plc
发明人： LAMING, Richard Ian , BEGBIE, Mark , TRAYNOR, Anthony
IPC分类号： B81C99/00 , H04R7/18 , H04R19/00 , B81C1/00 , H04R7/10
CPC分类号： B81C1/00158 , B81B2201/0257 , B81B2203/0127 , B81C99/004 , B81C2201/0109 , H04R7/10 , H04R7/18 , H04R19/005 , H04R2307/207 , Y10S977/733

3. 发明公开

EP1996507A2 METHOD FOR FABRICATING A MEMS MICROPHONE 有权转让
标题翻译：用于生产MEMS显微镜
公开(公告)号：EP1996507A2
公开(公告)日：2008-12-03
申请号：EP07732064.6
申请日：2007-03-20
申请人： Wolfson Microelectronics plc
发明人： LAMING, Richard Ian , BEGBIE, Mark , TRAYNOR, Anthony
IPC分类号： B81C1/00
CPC分类号： B81C1/00158 , B81B2201/0257 , B81B2203/0127 , B81C99/004 , B81C2201/0109 , H04R7/10 , H04R7/18 , H04R19/005 , H04R2307/207 , Y10S977/733
摘要： A MEMS device, for example a capacitive microphone, comprises a flexible membrane (11) that is free to move in response to pressure differences generated by sound waves. A first electrode (13) is mechanically coupled to the flexible membrane (11), and together form a first capacitive plate of the capacitive microphone device. A second electrode (23) is mechanically coupled to a generally rigid structural layer or back-plate (14), which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate (1), for example a silicon wafer. A back- volume (33) is provided below the membrane (11), and is formed using a 'back-etch' through the substrate (1). A first cavity (9) is located directly below the membrane (11), and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes (13 and 23) is a second cavity (17), which is formed using a second sacrificial layer during the fabrication process. A plurality of bleed holes (15) connect the first cavity (9) and the second cavity (17). Acoustic holes (31) are arranged in the back-plate (14) so as to allow free movement of air molecules, such that the sound waves can enter the second cavity (17). The first and second cavities (9 and 17) in association with the back-volume (33) allow the membrane (11) to move in response to the sound waves entering via the acoustic holes (31) in the back-plate (14). The provision of first and second sacrifjciaj layers has the advantage of protecting the membrane during manufacture, and disassociating the back etch process from the definition of the membrane. The bleed holes (15) aid with the removal of the first and second sacrificial layers. The bleed holes (15) also contribute to the operating characteristics of the microphone.

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