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    • 3. 发明公开
    • POWER CONTROL UNIT
    • 功率控制单元
    • EP2693624A1
    • 2014-02-05
    • EP11861963.4
    • 2011-03-31
    • TOYOTA JIDOSHA KABUSHIKI KAISHA
    • SHIBA, Kenjiro
    • H02M7/48
    • B60L11/00H02M7/003H02M2001/007H05K5/0069H05K7/1432
    • A power control unit is mounted on a vehicle, and controls the electric power for vehicle-running. The power control unit includes: a PCU case (50) having a lid (51) where an opening (53) is formed; a terminal block (61) having a connector retain hole (110) for retaining an interlock connector (120) formed, and arranged at the PCU case (50), facing the opening (53); and a substrate (70) stored in the PCU case (50), and on which an electronic component (84) is mounted. The substrate (70) is arranged at the side opposite to the lid (51) relative to the terminal block (61), and deviated from the position facing an aperture of the connector retain hole (110). The power control unit includes a wall (130) provided integrally with the terminal block (61), and arranged between the substrate (70) and the connector retain hole (110). By such a configuration, there is provided a power control unit having an intrusion of a foreign object suppressed while aiming to reduce the size and cost.
    • 动力控制单元安装在车辆上,并且控制用于车辆行驶的电力。 功率控制单元包括:具有形成开口(53)的盖(51)的PCU壳体(50) 具有用于保持形成在所述PCU壳体(50)上且面向所述开口(53)的互锁连接器(120)的连接器保持孔(110)的端子台(61); 和存储在PCU壳体(50)中的基板(70),并且电子部件(84)安装在基板(70)上。 基板(70)相对于端子台(61)配置在与盖(51)相反的一侧,且偏离与连接器保持孔(110)的开口相对的位置。 功率控制单元包括与接线盒(61)一体设置且布置在基板(70)和连接器保持孔(110)之间的壁(130)。 通过这种配置,提供了一种功率控制单元,该功率控制单元在抑制异物进入的同时减小尺寸和成本。
    • 5. 发明公开
    • COOLING STRUCTURE OF POWER SEMICONDUCTOR ELEMENT AND INVERTER
    • 赫尔辛基(KÜHLSTRUKTUR)EINES LEISUNGSHALBLEITERELEMENTS UND WECHSELRICHTER
    • EP1981081A1
    • 2008-10-15
    • EP07708012.5
    • 2007-01-30
    • Toyota Jidosha Kabushiki Kaisha
    • SHIBA, Kenjiro
    • H01L23/473
    • H01L23/473H01L2924/0002H05K7/20927H01L2924/00
    • A cooling structure of a power semiconductor device includes a cooling water passage (26) and a plurality of fins (22). The cooling water for cooling the power semiconductor device flows through the cooling water passage (26). The plurality of fins (22) are provided on a path of the cooling water passage (26) and set up with a spacing therebetween in a direction orthogonal to a flow direction of the cooling water. The plurality of fins (22) promote heat exchange between the power semiconductor device and the cooling water. The plurality of fins (22) have ends (41) facing the upstream side of a cooling water flow. The end (41) of at least one fin (22) among the plurality of fins (22) is arranged so as to be displaced to a more upstream side of the cooling water flow than the ends (41) of the fins (22) adjacent to both sides of the at least one fin (22). By such a configuration, there is provided a cooling structure of a power semiconductor device and an inverter with excellent cooling efficiency.
    • 功率半导体器件的冷却结构包括冷却水通道(26)和多个翅片(22)。 用于冷却功率半导体器件的冷却水流过冷却水通道(26)。 多个翅片(22)设置在冷却水通道(26)的路径上,并在与冷却水的流动方向正交的方向上间隔设置。 多个翅片(22)促进功率半导体器件和冷却水之间的热交换。 多个翅片(22)具有面向冷却水流的上游侧的端部(41)。 多个翅片(22)中的至少一个翅片(22)的端部(41)布置成比翅片(22)的端部(41)更靠上游侧的冷却水流动, 邻近所述至少一个翅片(22)的两侧。 通过这样的结构,提供了功率半导体器件和具有优良冷却效率的逆变器的冷却结构。
    • 10. 发明公开
    • CASING COVER
    • GEHÄUSEABDECKUNG
    • EP2645834A1
    • 2013-10-02
    • EP10860080.0
    • 2010-11-25
    • TOYOTA JIDOSHA KABUSHIKI KAISHA
    • SAKAMOTO, YusukeSHIBA, Kenjiro
    • H05K5/03B60R16/02H01R13/52
    • H05K7/1432
    • There is provided a casing cover that can accommodate a dimensional tolerance of a step on a casing. A casing cover 10 is provided with an upper step cover 30 which covers openings 22A to 22C in an upper step surface 14 of a casing 12 and a lower step cover 32 which covers an opening 22D in a lower step surface 16 of the casing 12. In addition, an insertion opening 36 penetrating in the step height direction is formed in one of the upper step cover 30 and the lower step cover 32, while a guiding member 38 configured to be inserted into the insertion opening 36 and have a length L2 in the step height direction longer than a maximum permissible size value L0+d of the step height is provided in another one of the upper step cover 30 and the lower step cover 32. Further, there is provided a connecting member 40 which connects the upper step cover 30 to the lower step cover 32 to thereby prevent the guiding member 38 from falling out from the insertion opening 36.
    • 提供了可以适应壳体上的台阶的尺寸公差的壳体盖。 壳体盖10设置有上台阶盖30,其覆盖壳体12的上台阶表面14中的开口22A至22C,以及覆盖壳体12的下台阶表面16中的开口22D的下台阶盖32。 此外,在上台阶盖30和下台阶盖32中的一个中形成有沿台阶高度方向贯穿的插入开口36,而构造成插入到插入开口36中并且具有长度L2的引导构件38 在步骤高度的最大允许尺寸值L0 + d以上的台阶高度方向设置在上台阶盖30和下台阶盖32的另一个中。此外,设置连接构件40,其连接上台阶 盖30到下台阶盖32,从而防止引导构件38从插入开口36脱落。