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1. 发明公开

EP1691196A1 MICROWELL ARRAY CHIP AND ITS MANUFACTURING METHOD 有权转让
标题翻译： MICROWELL-ARRAY-CHIP UND VERFAHREN ZU DESSEN HERSTELLUNG
公开(公告)号：EP1691196A1
公开(公告)日：2006-08-16
申请号：EP04773462.9
申请日：2004-09-22
申请人： Toyama Prefecture , Muraguchi, Atsushi , Kishi, Hiroyuki , Tokimitsu, Yoshiharu , Kondo, Sachiko
发明人： MURAGUCHI, Atsushi , KISHI, Hiroyuki , Tokimitsu, Yoshiharu , KONDO, Sachiko , Obata, Tsutomu , Fujiki, Satoshi , Yokoyama, Yoshiyuki , Nabesawa, Hirofumi , Takabayashi, Sotohiro , Tanino, Katsumi
IPC分类号： G01N33/53 , G01N37/00
CPC分类号： G01N33/54366 , A61K35/12 , A61K48/00 , B01J19/0046 , B01J2219/00659 , C12M23/12 , G06F19/00
摘要： A microwell array chip having multiple microwells on a principal surface of a substrate, said microwells being of a shape and size permitting the storage of only a single organic cell in each microwell, wherein microwell markers are present on the same substrate surface as the openings of the microwells. A microwell array chip having multiple microwells on a principal surface of a substrate, said microwells being of a shape and size permitting the storage of only a single organic cell in each microwell, wherein protrusions are present in the openings of said microwells so as to narrow said openings. A method for manufacturing the microwell array chip. The method comprises the steps of: forming a film on at least one principal surface of a substrate; applying a resist coating on the film that has been formed; exposing the resist surface through a mask having a microwell pattern and removing uncured portions of resist; etching the exposed portions of said film and substrate to fabricate wells in the form of a microwell array; and removing the resist. A microwell array chip made of silicon and having multiple microwells, each microwell being used to store a single specimen organic cell, wherein each microwell is of a size and shape holding just one organic cell.
摘要翻译：一种微孔阵列芯片，其在基底的主表面上具有多个微孔，所述微孔具有允许在每个微孔中仅存储单个有机细胞的形状和尺寸，其中微孔标记物存在于相同的基底表面上，微孔。一种微孔阵列芯片，其在基底的主表面上具有多个微孔，所述微孔具有允许在每个微孔中仅存储单个有机细胞的形状和尺寸，其中突起存在于所述微孔的开口中以便缩窄说开口。一种微孔阵列芯片的制造方法。该方法包括以下步骤：在衬底的至少一个主表面上形成膜; 在已经形成的膜上涂覆抗蚀涂层; 通过具有微孔图案的掩模曝光抗蚀剂表面并除去未固化的抗蚀剂部分; 蚀刻所述膜和衬底的暴露部分以制造微孔阵列形式的阱; 并除去抗蚀剂。一种由硅制成并具有多个微孔的微孔阵列芯片，每个微孔用于存储单个样品有机电池，其中每个微孔具有仅具有一个有机电池的尺寸和形状。

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