会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明公开
    • OPTO-ELECTRONIC DEVICE WITH TEXTURED SURFACE AND METHOD OF MANUFACTURING THEREOF
    • 具有纹理化表面的光电装置及其制造方法
    • EP3238271A1
    • 2017-11-01
    • EP15813453.6
    • 2015-12-21
    • Total S.A.Ecole PolytechniqueCentre National de la Recherche Scientifique
    • ROCA I CABARROCAS, PereCHEN, WanghuaFOLDYNA, MartinPOULAIN, Gilles
    • H01L31/0216H01L31/0232H01L31/0236
    • H01L31/0236H01L31/02168H01L31/02327H01L31/18Y02E10/50
    • The present invention concerns an opto-electronic device comprising a semiconducting substrate, a layered interface comprising at least one layer (2, 3), said layered interface having a first surface (21) in contact with a surface (20) of said semiconducting substrate (1) and said layered interface being adapted for passivating said surface (20) of said semiconducting substrate (1), said layered interface having a second surface (23) and said layered interface being adapted for electrically insulating said first surface (21) from said second surface (23), and a textured surface structure comprising a plurality of nanowires (4) and a transparent dielectric coating (5), said textured surface structure being in contact with said second surface (23) of said layered interface, said plurality of nanowires (4) protruding from said second surface (23) and said plurality of nanowires (4) being embedded between said second surface (23) and said transparent dielectric coating (5).
    • 本发明涉及包括半导体衬底,包括至少一个层(2,3)的分层界面的光电子器件,所述分层界面具有与所述半导体衬底(2)的表面(20)接触的第一表面(21) (1)和所述分层界面适于钝化所述半导体衬底(1)的所述表面(20),所述分层界面具有第二表面(23),并且所述分层界面适于将所述第一表面(21)与所述第一表面 所述第二表面(23)和包括多个纳米线(4)和透明电介质涂层(5)的纹理化表面结构,所述纹理化表面结构与所述分层界面的所述第二表面(23)接触,所述多个 从所述第二表面(23)突出的纳米线(4),并且所述多个纳米线(4)嵌入在所述第二表面(23)和所述透明电介质涂层(5)之间。
    • 5. 发明公开
    • METHOD FOR MANUFACTURING INTER-DIGITATED BACK CONTACT PHOTOVOLTAIC DEVICES
    • 制造背间接触式光伏装置的方法
    • EP3179522A1
    • 2017-06-14
    • EP15306957.0
    • 2015-12-08
    • TOTAL MARKETING SERVICESÉcole PolytechniqueCentre National de la Recherche Scientifique
    • LEAL, RonanPOULAIN, GillesDAMON-LACOSTE, Jérôme
    • H01L31/18
    • H01L31/0682H01L31/1804Y02E10/547
    • The invention concerns a method for manufacturing an IBC device comprising the steps of:
      a) providing a crystalline silicon substrate (1) having a back surface (12);
      b) forming first masked areas (22) and first opened areas (21) ;
      c) first selective epitaxial PECVD step, so as to deposit a first crystalline silicon layer (31) on the first opened areas (21) and a non-crystalline silicon layer (32) on the first masked areas (22) ;
      d) depositing a second dielectric layer (4) ;
      e) selectively etching the first dielectric layer (2) for forming second opened areas (42) and second masked areas (41) coating the first crystalline silicon layer (31);
      f) second selective epitaxial PECVD step, so as to deposit a second crystalline silicon layer (52) on the second opened areas (42) and a second non-crystalline silicon layer (51) on the second masked areas (41) ;
      g) selectively etching the second dielectric layer (4).
    • 本发明涉及一种制造IBC器件的方法,包括以下步骤:a)提供具有背表面(12)的晶体硅衬底(1); b)形成第一掩蔽区域(22)和第一开放区域(21); c)第一选择性外延PECVD步骤,以在第一开口区域(21)上沉积第一晶体硅层(31),并在第一掩模区域(22)上沉积非晶体硅层(32); d)沉积第二介电层(4); e)选择性地蚀刻第一介电层(2)以形成涂覆第一晶体硅层(31)的第二开口区域(42)和第二掩模区域(41); f)第二选择性外延PECVD步骤,以便在所述第二开口区域(42)上沉积第二晶体硅层(52),并且在所述第二掩模区域(41)上沉积第二非晶体硅层(51); g)选择性地蚀刻第二介电层(4)。