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1. 发明公开

EP2369223A3 Light-emitting device and illumination device 审中-公开
标题翻译：发光装置和照明装置
公开(公告)号：EP2369223A3
公开(公告)日：2013-03-20
申请号：EP11158451.2
申请日：2011-03-16
申请人： Toshiba Lighting & Technology Corporation
发明人： Sanpei, Tomohiro , Takenaka, Erika
IPC分类号： H05K1/00 , F21K99/00 , H05K1/05 , H05K3/28 , H01L25/075 , H01L33/56 , H01L33/60
CPC分类号： H05K3/284 , F21K9/23 , F21V3/00 , F21V23/002 , F21V29/773 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H01L33/56 , H01L33/60 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/73265 , H05K1/0274 , H05K1/056 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device includes a substrate (21), a light reflection layer (25), a plurality of light-emitting elements (37), and a sealing member (47). The substrate (21) includes an insulating layer (23) constituted of epoxy resin using an acid anhydride as a hardening agent or one of a polyimide resin, a polyethylene terephthalate resin, and a fluororesin. The light reflection layer (25) is formed on the insulating layer (23). The light reflection layer (25) includes a metallic light-reflecting surface (28) higher in optical reflectance than the insulating layer (23). The light-emitting elements (37) are mounted on the light-reflecting surface (28). The sealing member (47) is constituted of a material having gas permeability and translucency, and is formed on the insulating layer (23) to seal the light reflection layer (25) and the light-emitting elements (37).
摘要翻译：根据一个实施例，发光装置包括基板（21），光反射层（25），多个发光元件（37）和密封构件（47）。基板（21）包括由使用酸酐作为硬化剂的环氧树脂或聚酰亚胺树脂，聚对苯二甲酸乙二醇酯树脂和氟树脂中的一种构成的绝缘层（23）。光反射层（25）形成在绝缘层（23）上。光反射层（25）具有光反射率比绝缘层（23）高的金属光反射面（28）。发光元件（37）安装在光反射面（28）上。密封部件47由具有透气性和透光性的材料构成，形成在绝缘层23上，密封光反射层25和发光元件37。

2. 发明公开

EP2261548A2 Light emitting module and illumination device 审中-公开
标题翻译： Lichtemittierendes Modul und Beleuchtungsvorrichtung
公开(公告)号：EP2261548A2
公开(公告)日：2010-12-15
申请号：EP10164477.1
申请日：2010-05-31
申请人： Toshiba Lighting & Technology Corporation
发明人： Morikawa, Kazuto , Izumi, Masahiro , Nishimura, Kiyoshi , Sanpei, Tomohiro , Takenaka, Erika , Matsuda, Shuhei
IPC分类号： F21K99/00
CPC分类号： H05K1/0274 , F21K9/23 , F21K9/232 , F21Y2115/10 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H05K3/284 , H05K2201/0108 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： A light-emitting module 1 includes a module substrate (5), a reflective layer (11), conductive layers (12, 13), a light-emitting element (21), and a sealing member (28). A reflective layer (11) is provided on a surface of an insulating layer of the module substrate (5), and the conductive layers (12, 13) are provided in the vicinity of the reflective layer (11). Further, the light-emitting element (21) is provided on the reflective layer (11). Moreover, the translucent sealing member (28) has translucency and bury the reflective layer (11), the conductive layers (12, 13), and the light-emitting element (21). The ratio of the area occupied by the reflective layer (11) and the conductive layers (12, 13) to the sealed region sealed by the sealing member (28) is equal to or greater than 80%.
摘要翻译：发光模块1包括模块基板（5），反射层（11），导电层（12,13），发光元件（21）和密封构件（28）。在模块基板（5）的绝缘层的表面上设置反射层（11），在反射层（11）附近设置导电层（12,13）。此外，发光元件（21）设置在反射层（11）上。此外，半透明密封构件（28）具有半透明性并埋入反射层（11），导电层（12,13）和发光元件（21）。由反射层（11）和导电层（12,13）占据由密封构件（28）密封的密封区域的面积的比率等于或大于80％。

3. 发明公开

EP2224161A1 Lighting device and lighting fixture 审中-公开
标题翻译： Beleuchtungsvorrichtung und Beleuchtungsbefestigung
公开(公告)号：EP2224161A1
公开(公告)日：2010-09-01
申请号：EP10154734.7
申请日：2010-02-25
申请人： Toshiba Lighting & Technology Corporation
发明人： Sakai, Makoto , Osawa, Shigeru , Shibahara, Yusuke , Hisayasu, Takeshi , Morikawa, Kazuto , Sanpei, Tomohiro , Takenaka, Erika
IPC分类号： F21K99/00 , F21Y101/02 , F21V21/00
CPC分类号： F21V23/06 , F21K9/23 , F21K9/238 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/773 , F21V29/89 , F21Y2113/13 , F21Y2115/10 , F21Y2115/30
摘要： A lighting device (10) and a lighting fixture (30) of the embodiment of the present invention comprises a thermally conductive main body (13) having a substrate support portion (13e) in one end portion, and having a through-hole (13g) and a groove portion (13h) formed in the substrate support portion (13e), the through-hole (13g) penetrating from the one end portion to the other end portion of the main body (13), the groove portion (13h) extending continuously from the through-hole (13g), a substrate (14) mounted with a semiconductor light-emitting device (11), and disposed on the substrate support portion (13e), an electrical connector (15) connected to the semiconductor light-emitting device (11), a power supply device (12) housed in the main body (13) and configured to light the semiconductor light-emitting device (11), a wire (16) connected to the power supply device (12) and to the electrical connector (15) while being inserted through the through-hole (13g) and the groove portion (13h), and a base member (17) provided in the other end portion of the main body (13)and connected to the power supply device (12). Therefore a lighting device (10) and a lighting fixture (30) of this embodiment of the present invention reduced in size, is configured to be suitable for mass production and is capable of producing a certain luminous flux.
摘要翻译：本发明实施例的照明装置（10）和照明器具（30）包括：导热主体（13），其在一个端部具有基板支撑部分（13e），并且具有通孔（13g ）和形成在基板支撑部（13e）中的槽部（13h），从主体（13）的一端部延伸到另一端部的通孔（13g），槽部（13h）从所述通孔（13g）连续延伸安装有半导体发光器件（11）的基板（14），并且设置在所述基板支撑部分（13e）上;电连接器（15），连接到所述半导体光（11），容纳在主体（13）中并配置为点亮半导体发光装置（11）的电源装置（12），连接到电源装置（12）的电线（16）并且在插入通孔（13g）和槽部的同时连接到电连接器（15）（13h）和设置在主体（13）的另一端部并与电源装置（12）连接的基座部件（17）。因此，本发明的实施例的照明装置（10）和照明器具（30）的尺寸减小，被配置为适合于批量生产并且能够产生一定的光通量。

4. 发明公开

EP2302299A2 Self-ballasted lamp and lighting equipment 审中-公开
标题翻译： Lampe mitVorschaltgerätundBeleuchtungsgerät
公开(公告)号：EP2302299A2
公开(公告)日：2011-03-30
申请号：EP10178361.1
申请日：2010-09-22
申请人： Toshiba Lighting & Technology Corporation , Kabushiki Kaisha Toshiba
发明人： Hisayasu, Takeshi , Morikawa, Kazuto , Shibahara, Yusuke , Sakai, Makoto , Sanpei, Tomohiro
IPC分类号： F21V29/00 , F21K99/00
CPC分类号： F21V3/00 , F21K9/23 , F21V23/002 , F21V29/773 , F21Y2115/10
摘要： A base body (12) having a base body portion (21) and a plurality of heat radiating fins (22) disposed on the circumference of the base body portion is provided. On one end side of the base body, a light-emitting module (13) having semiconductor light-emitting elements (43), and a globe (16) that covers the light-emitting module are provided. A cap (15) is provided on the other end side of the base body. A lighting circuit (17) is housed between the base body and the cap. The lamp total length from the globe (16) to the cap (15) is 70 to 120 mm, and the area of a surface of the base body (12) which is exposed to the outside per 1W of power charged to the light-emitting module is 20.5 to 24.4 cm 2 /W.
摘要翻译：设置有具有基体部（21）的基体（12）和设置在基体部的圆周上的多个散热片（22）。在基体的一端侧，设置有具有半导体发光元件（43）的发光模块（13）和覆盖发光模块的罩（16）。盖体（15）设置在基体的另一端侧。照明电路（17）容纳在基体和盖之间。从灯泡（16）到灯头（15）的灯总长度为70〜120mm，并且每1W向外部暴露于外部的基体（12）的表面的面积，发射模块为20.5〜24.4cm 2 / W。

5. 发明授权

EP2105947B1 Self-ballasted fluorescent lamp and illumination apparatus 有权
标题翻译：紧凑型荧光灯和照明装置
公开(公告)号：EP2105947B1
公开(公告)日：2011-01-26
申请号：EP09250518.9
申请日：2009-02-26
申请人： Toshiba Lighting & Technology Corporation
发明人： Ikada, Kunihiko , Sanpei, Tomohiro , Matsunaga, Yoshiyuki
IPC分类号： H01J61/32 , H01J61/34 , H01J61/35 , H01J9/26
CPC分类号： H01J61/327 , H01J9/266 , H01J61/34 , H01J61/35

6. 发明公开

EP2270393A1 Self-ballasted lamp and lighting equipment 审中-公开
标题翻译：自镇流灯和照明设备
公开(公告)号：EP2270393A1
公开(公告)日：2011-01-05
申请号：EP10006720.6
申请日：2010-06-29
申请人： Toshiba Lighting & Technology Corporation , Kabushiki Kaisha Toshiba
发明人： Takenaka, Erika , Osawa, Shigeru , Shibahara, Yusuke , Hisayasu, Takeshi , Morikawa, Kazuto , Sanpei, Tomohiro , Sakai, Makoto
IPC分类号： F21V29/00 , F21K99/00 , F21V23/00
CPC分类号： F21V29/004 , F21K9/232 , F21K9/233 , F21V3/061 , F21V3/062 , F21V23/002 , F21V29/773 , F21Y2115/10
摘要： The present invention provides a self-ballasted lamp (11) which efficiently conducts heat of a plurality of LED chips (43) of a light emitting module (13) to its holder (12), and can prevent the temperature rise of the LED chips (43). The holder (12) has a base portion (23), an edge portion (26) provided at one end side of the base portion (23), which is thick at the base portion side thereof and thin at the distal end side thereof, and heat radiation fins (22) provided at the other end side from the edge part and at the circumference of the base portion (23). The heat from the semiconductor light emitting elements (43) is conducted from the base portion (23) to the edge part (26) and radiated therefrom. At this time, the edge part (26) is thickened at the base portion side, wherein the thermal capacity is increased, and the heat conduction is improved.
摘要翻译：本发明提供一种能够有效地将发光模块（13）的多个LED芯片（43）的热量传导到其支架（12）的自镇流灯（11），并且可以防止LED芯片（43）。保持件12具有：基部23;设置在基部23的一端侧且在其基部侧较厚且前端侧较薄的边缘部26; 以及散热片（22），其设置在比所述基部（23）的所述边缘部靠周端的另一端侧。来自半导体发光元件（43）的热量从基部（23）传导至边缘部（26）并从其辐射。此时，端部（26）在基部侧变厚，热容量增大，导热性提高。

7. 发明公开

EP1686631A2 Light-emitting diode apparatus 审中-公开
标题翻译： Leuchtdiodenvorrichtung
公开(公告)号：EP1686631A2
公开(公告)日：2006-08-02
申请号：EP06001880.1
申请日：2006-01-30
申请人： Toshiba Lighting & Technology Corporation
发明人： Toda, Masahiro , Iwamoto, Masami , Moriyama, Takayoshi , Nakanishi, Akiko , Saito, Akiko , Kawashima, Seiko , Sanpei, Tomohiro , Shiozaki, Mitsuru , Uetake, Hisayo
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： A light-emitting diode lighting apparatus includes a plurality of light-emitting diode apparatus arranged on a substrate. Each of the light-emitting diode apparatus is provided with a light-emitting diode chip mounted on a substrate, a phosphor layer coating the light-emitting diode chip, and a reflective layer, disposed on the substrate, having reflection characteristics in which a reflectance for light in a wavelength range of light emission from the light-emitting diode chip is lower than a reflectance of nickel and the reflectance for light in the wavelength range of fluorescence emission from the phosphor layer is higher than the reflectance of nickel.
摘要翻译：发光二极管照明装置包括布置在基板上的多个发光二极管装置。每个发光二极管装置设置有安装在基板上的发光二极管芯片，涂覆发光二极管芯片的荧光体层和设置在基板上的反射层，具有反射特性，其中反射率对于来自发光二极管芯片的发光波长范围的光低于镍的反射率，并且来自荧光体层的荧光发射的波长范围内的光的反射率高于镍的反射率。

8. 发明公开

EP2397746A2 Light-emitting module and illumination device 审中-公开
标题翻译：发光模块和照明装置
公开(公告)号：EP2397746A2
公开(公告)日：2011-12-21
申请号：EP11169878.3
申请日：2011-06-14
申请人： Toshiba Lighting & Technology Corporation
发明人： Sanpei, Tomohiro
IPC分类号： F21K99/00 , H05K1/02 , H01L25/075
CPC分类号： H05K1/056 , F21K9/68 , F21Y2115/10 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/73265 , H05K3/284 , H05K2201/0209 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting module comprises a module substrate (25), a light-reflecting layer (28), a plurality of light-emitting elements (37), and a sealing material (46). The module substrate (25) includes an insulating layer (27) formed of at least one of a glycidyl ester-type, linear aliphatic epoxide-type, and alicyclic epoxide-type resin. The light-reflecting layer (28) is superposed on the insulating layer (27), and includes a silver light-reflecting surface (32). The light-emitting elements (37) are mounted on the module substrate (25). The sealing material (46) has light transmittance, and superposed on the insulating layer (27) to cover the light-reflecting layer (28) and the light-emitting elements (37).
摘要翻译：根据一个实施例，发光模块包括模块基板（25），光反射层（28），多个发光元件（37）和密封材料（46）。模块衬底（25）包括由缩水甘油酯型，线性脂族环氧化物型和脂环族环氧化物型树脂中的至少一种形成的绝缘层（27）。光反射层（28）叠置在绝缘层（27）上，并且包括银反光表面（32）。发光元件（37）安装在模块基板（25）上。密封材料46具有透光性，并叠置在绝缘层27上以覆盖光反射层28和发光元件37。

9. 发明公开

EP1895602A3 Illumination apparatus having a plurality of semiconductor light-emitting devices 审中-公开
标题翻译： Beleuchtungsgerätmit mehreren lichtemittierenden Halbleiterbauelementen
公开(公告)号：EP1895602A3
公开(公告)日：2011-11-23
申请号：EP07253338.3
申请日：2007-08-23
申请人： Toshiba Lighting & Technology Corporation
发明人： Sanpei, Tomohiro , Izumi, Masahiro , Nogi, Shinji , Saito, Akiko
IPC分类号： F21K99/00 , H01L33/60 , H01L25/075
CPC分类号： F21V31/04 , F21K9/68 , F21Y2105/10 , F21Y2115/10 , H01L33/46 , H01L33/483 , H01L2224/48091 , H01L2224/4911 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014
摘要： An illumination apparatus (1) includes a plurality of semiconductor light-emitting devices (5), a reflective layer (3, 23), a plurality of conductor parts (4c, 25a) and a translucent adhesive layer (6). Each of the semiconductor light-emitting devices (5) has a translucent substrate (11), and a semiconductor light-emitting layer (12) formed on the substrate (11). The reflective layer (3, 23) has a size on which semiconductor light-emitting devices (5) are arranged at intervals. The conductor parts (4c, 25a) are provided on the reflective layer (3, 23), and electrically connected to the semiconductor light-emitting devices (5). The adhesive layer (6) bonds the substrates (11) of the semiconductor light-emitting devices (5) onto the reflective layer (3, 23), and thereby holds the semiconductor light-emitting devices (5) on the reflective layer (3, 23).
摘要翻译：照明装置（1）包括多个半导体发光装置（5），反射层（3,23），多个导体部（4c，25a）和半透明粘合层（6）。每个半导体发光器件（5）具有透光性基板（11）和形成在基板（11）上的半导体发光层（12）。反射层（3,23）的间隔尺寸设置有半导体发光元件（5）。导体部分（4c，25a）设置在反射层（3,23）上，电连接到半导体发光器件（5）。粘合剂层（6）将半导体发光器件（5）的基板（11）粘合到反射层（3,23）上，从而将半导体发光器件（5）保持在反射层（3）上，23）。

10. 发明公开

EP2369223A2 Light-emitting device and illumination device 审中-公开
标题翻译： Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung
公开(公告)号：EP2369223A2
公开(公告)日：2011-09-28
申请号：EP11158451.2
申请日：2011-03-16
申请人： Toshiba Lighting & Technology Corporation
发明人： Sanpei, Tomohiro , Takenaka, Erika
IPC分类号： F21K99/00 , H01L25/075 , H01L33/56 , H01L33/60
CPC分类号： H05K3/284 , F21K9/23 , F21V3/00 , F21V23/002 , F21V29/773 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H01L33/56 , H01L33/60 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/73265 , H05K1/0274 , H05K1/056 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device includes a substrate (21), a light reflection layer (25), a plurality of light-emitting elements (37), and a sealing member (47). The substrate (21) includes an insulating layer (23) constituted of epoxy resin using an acid anhydride as a hardening agent or one of a polyimide resin, a polyethylene terephthalate resin, and a fluororesin. The light reflection layer (25) is formed on the insulating layer (23). The light reflection layer (25) includes a metallic light-reflecting surface (28) higher in optical reflectance than the insulating layer (23). The light-emitting elements (37) are mounted on the light-reflecting surface (28). The sealing member (47) is constituted of a material having gas permeability and translucency, and is formed on the insulating layer (23) to seal the light reflection layer (25) and the light-emitting elements (37).
摘要翻译：根据一个实施例，发光装置包括基板（21），光反射层（25），多个发光元件（37）和密封构件（47）。基板（21）包括由使用酸酐作为硬化剂的环氧树脂或聚酰亚胺树脂，聚对苯二甲酸乙二醇酯树脂和氟树脂之一构成的绝缘层（23）。光反射层（25）形成在绝缘层（23）上。光反射层（25）包括比绝缘层（23）更高的光反射率的金属光反射表面（28）。发光元件（37）安装在光反射面（28）上。密封构件（47）由具有透气性和透光性的材料构成，并且形成在绝缘层（23）上以密封光反射层（25）和发光元件（37）。

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