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    • 2. 发明公开
    • Lighting device
    • 照明设备
    • EP2587111A1
    • 2013-05-01
    • EP12183700.9
    • 2012-09-10
    • Toshiba Lighting & Technology Corporation
    • Hisayasu, TakeshiNakata, ShinjiKubota, Hiroshi
    • F21K99/00
    • F21V29/87F21K9/23F21Y2103/33F21Y2115/10
    • According to one embodiment, an LED lamp (100) includes a housing (11), a base (15), an LED module (12), an LED lighting circuit board (14), and a globe (13). The base (15) is attached to one end of the housing (11), and is supplied with electric power. The LED module (12) is attached to the other end of the housing (11), and is equipped with LEDs. The LED lighting circuit board (14) is accommodated in the housing (11), and the LED lighting circuit board is equipped with a lighting circuit. The globe (13) covers the LEDs, and diffuses and radiates light emitted from the LEDs, and is attached to the housing (11). The housing (11) is formed of resin having high thermal conductivity containing carbon-based filler. The light emitting module (12) is attached to the housing (11) through a heat transfer plate (16) a part of which is exposed from the housing (11).
    • 根据一个实施例,LED灯(100)包括外壳(11),基座(15),LED模块(12),LED照明电路板(14)和灯罩(13)。 底座(15)连接到壳体(11)的一端,并且被供电。 LED模块(12)附接到壳体(11)的另一端,并配备有LED。 LED照明电路板(14)容纳在壳体(11)中,并且LED照明电路板配备有照明电路。 灯罩13覆盖LED,扩散并照射从LED发出的光,并附着于壳体11。 壳体(11)由具有高热导率的含碳基填料的树脂形成。 发光模块12通过传热板16安装在壳体11上,传热板16的一部分从壳体11露出。