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1. 发明公开

EP2473014A2 Circuit board and connection substrate 审中-公开
标题翻译：电路板和连接基板
公开(公告)号：EP2473014A2
公开(公告)日：2012-07-04
申请号：EP12000095.5
申请日：2007-03-14
申请人： Sumitomo Bakelite Company, Ltd.
发明人： Chuma, Toshiaki , Inaba, Makoto
IPC分类号： H05K1/14 , H05K3/36 , H05K3/46
CPC分类号： H05K1/148 , H05K3/363 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481
摘要： There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion.
摘要翻译：提供了一种电路板，包括：第一和第二电路基板，所述第一和第二电路基板间隔设置，第一和第二导体焊盘分别设置在所述电路板上; 以及连接基板，包括从一侧或另一侧突出的第一和第二导体柱; 所述连接基板以覆盖所述第一电路基板和所述第二电路基板的一部分的方式配置，并架设在所述连接基板上; 所述第一导体柱和所述第一导体焊盘以及所述第二导体柱和所述第二导体焊盘被布置为彼此相对; 所述电路板还包括待在所述第一导体柱和所述第一导体焊盘中的至少一个的表面上预先形成的金属涂层熔化时形成的连接器部分以及所述第二导体柱和所述第二导体焊盘中的至少一个的表面上的第二导体柱和第二导体垫; 第一和第二电路基板和连接基板通过连接器部分电连接。

2. 发明公开

EP2461656A2 Circuit board and connection substrate 审中-公开
标题翻译： PCB和终端基板
公开(公告)号：EP2461656A2
公开(公告)日：2012-06-06
申请号：EP12000096.3
申请日：2007-03-14
申请人： Sumitomo Bakelite Company, Ltd.
发明人： Chuma, Toshiaki , Inaba, Makoto
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K1/148 , H05K3/363 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481
摘要： There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion.

3. 发明公开

EP2461656A3 Circuit board and connection substrate 审中-公开
标题翻译： PCB和终端基板
公开(公告)号：EP2461656A3
公开(公告)日：2012-08-01
申请号：EP12000096.3
申请日：2007-03-14
申请人： Sumitomo Bakelite Company, Ltd.
发明人： Chuma, Toshiaki , Inaba, Makoto
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K1/148 , H05K3/363 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481
摘要： There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion.

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