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2. 发明公开

EP2518494A2 Sugar chain- capturing substance and use thereof 审中-公开
标题翻译：糖链捕获物质及其用途
公开(公告)号：EP2518494A2
公开(公告)日：2012-10-31
申请号：EP12004568.7
申请日：2007-08-06
申请人： Sumitomo Bakelite Company, Ltd. , National University Corporation Hokkaido University
发明人： Shimaoka, Hideyuki , Nishimura, Shinichiro , Miura, Yoshiaki , Furukawa, Jun-ichi
IPC分类号： G01N33/48 , C08B37/00 , C08G81/02 , G01N30/88 , G01N33/53 , G01N37/00 , C07H1/08 , C07C243/24 , C08F8/30
CPC分类号： C08J3/24 , C07C233/20 , C07C271/08 , C07C281/02 , C08F8/30 , C08F122/38 , C08F2222/1013 , G01N33/5308 , G01N2030/027 , G01N2030/8813 , G01N2030/8836 , Y02P20/55 , Y10T428/2982 , C08F220/60
摘要： The present invention provides a method for preparing a sample characterized by binding a substance A containing a hydrazide group to a sugar chain and/or a sugar derivative via hydrazone formation between the hydrazide group of the substance A and the reducing end of the sugar chain and/or the sugar derivative thereby to enable the separation and purification of the sugar chain and/or the sugar derivative for an analytical sample from a biological sample containing the sugar chain and/or the sugar derivative by a simple operation.
摘要翻译：本发明提供了制备样品的方法，其特征在于通过物质A的酰肼基团和糖链的还原末端之间的腙形成将含有酰肼基团的物质A与糖链和/或糖衍生物结合，和从而能够通过简单的操作从含有糖链和/或糖衍生物的生物样品中分离和纯化用于分析样品的糖链和/或糖衍生物。

3. 发明公开

EP2068352A1 FILM FOR SEMICONDUCTOR, METHOD FOR PRODUCING FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：方法的半导体元件，使用半导体的薄膜
公开(公告)号：EP2068352A1
公开(公告)日：2009-06-10
申请号：EP07829202.6
申请日：2007-10-04
申请人： Sumitomo Bakelite Company, Ltd.
发明人： HIRANO, Takashi , SASAKI, Akitsugu , ODA, Naoya
IPC分类号： H01L21/301 , B32B27/00 , C09J7/02 , C09J201/00
CPC分类号： C09J9/02 , C09J7/38 , C09J2201/36 , C09J2203/326 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01059 , H01L2924/01072 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , Y10T156/10 , Y10T156/1052 , Y10T428/24942 , H01L2924/00 , H01L2924/3512
摘要： A film for use in manufacturing semiconductor devices of the present invention includes a bonding layer having a first surface and a second surface, a first adhesive layer bonding to the second surface of the bonding layer and a second adhesive layer bonding to the first adhesive layer at a side opposite to the bonding layer wherein the second adhesive layer has an outer peripheral portion extending beyond an outer peripheral edge of the first adhesive layer. Further, the film is used in dicing a semiconductor wafer in a state that the semiconductor wafer is bonded to the first surface of the bonding layer while a wafer ring is bonded to the outer peripheral portion of the second adhesive layer wherein the bonding force A 1 (cN/25mm) of the first adhesive layer to the bonding layer is smaller than the bonding force A 2 (cN/25mm) of the second adhesive layer to the wafer ring.
摘要翻译：在制造本发明的半导体装置中使用的膜包括具有第一表面和第二表面，第一粘合剂层粘结到所述粘结层的所述第二表面，并且在第二粘合剂层粘合到所述第一粘合层的粘合层相对的粘接层的一侧worin第二粘合剂层具有在延伸超过所述第一粘合剂层的外周缘的外周部。此外，将膜在一个状态切割半导体晶片使用做而晶片环接合到所述第二粘合层的外周部worin粘合力A 1与半导体晶片接合到所述接合层的所述第一表面第一粘合层到粘结层的（CN个/ 25mm）比第二粘结层到晶片环的粘合力A 2（CN / 25毫米）小。

4. 发明公开

EP2056106A1 SUGAR CHAIN-CAPTURING SUBSTANCE AND USE THEREOF 有权
标题翻译：糖链EINFANGSUBSTANZ及其用途
公开(公告)号：EP2056106A1
公开(公告)日：2009-05-06
申请号：EP07790327.6
申请日：2007-08-06
申请人： Sumitomo Bakelite Company, Ltd. , National University Corporation Hokkaido University
发明人： SHIMAOKA, Hideyuki , NISHIMURA, Shinichiro , SHINOHARA, Yasuro , MIURA, Yoshiaki , FURUKAWA, Jun-ichi
IPC分类号： G01N33/48 , C08B37/00 , C08G81/02 , G01N30/88 , G01N33/53 , G01N37/00
CPC分类号： C08J3/24 , C07C233/20 , C07C271/08 , C07C281/02 , C08F8/30 , C08F122/38 , C08F2222/1013 , G01N33/5308 , G01N2030/027 , G01N2030/8813 , G01N2030/8836 , Y02P20/55 , Y10T428/2982 , C08F220/60
摘要： The present invention provides a method for preparing a sample characterized by binding a substance A containing a hydrazide group to a sugar chain and/or a sugar derivative via hydrazone formation between the hydrazide group of the substance A and the reducing end of the sugar chain and/or the sugar derivative thereby to enable the separation and purification of the sugar chain and/or the sugar derivative for an analytical sample from a biological sample containing the sugar chain and/or the sugar derivative by a simple operation.

5. 发明公开

EP2055756A1 ADHESIVE TAPE, JOINT STRUCTURE, AND SEMICONDUCTOR PACKAGE 审中-公开
标题翻译： KLEBEBAND，GELENKSTRUKTUR SOWIEHALBLEITERGEHÄUSE
公开(公告)号：EP2055756A1
公开(公告)日：2009-05-06
申请号：EP07737114.4
申请日：2007-04-25
申请人： Sumitomo Bakelite Company, Ltd.
发明人： KATSURAYAMA, Satoru , YAMASHIRO, Tomoe , MIYAMOTO, Tetsuya
IPC分类号： C09J7/02 , C09J7/00 , C09J9/02 , C09J11/04 , C09J163/00 , C09J163/02 , C09J201/00 , H01L21/60
CPC分类号： H05K3/323 , C08K3/08 , C08K5/09 , C08L2666/54 , C09J7/35 , C09J9/02 , C09J11/04 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L23/49816 , H01L24/11 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L2224/13099 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81203 , H01L2224/8121 , H01L2224/81801 , H01L2224/83101 , H01L2224/83203 , H01L2224/8321 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H05K3/3494 , H05K2203/0425 , Y10T428/25 , H01L2924/00014 , H01L2924/00 , H01L2924/01083 , H01L2924/01049 , H01L2924/00012 , H01L2224/32225
摘要： An adhesive tape 101 electrically connecting conductive components includes a resin layer 132 containing a thermosetting resin, a solder powder 103 and a curing agent. The solder powder 103 and the curing agent reside in the resin layer 132, the curing temperature T 1 of the resin layer 132 and the melting point T 2 of the solder powder 103 satisfy T 1 ≥ T 2 + 20°C, wherein the resin layer 132 shows a melt viscosity of 50 Pa·s or above and 5000 Pa·s or below, at the melting point T 2 of the solder powder 103.
摘要翻译：电连接导电部件的胶带101包括含有热固性树脂的树脂层132，焊料粉末103和固化剂。焊料粉末103和固化剂位于树脂层132中，树脂层132的固化温度T 1和焊料粉末103的熔点T 2满足T 1‰×T 2 + 20℃，其中树脂层132在焊料粉末103的熔点T 2处显示50Pa·s以上且5000Pa·s以下的熔融粘度。

6. 发明公开

EP2007176A1 CIRCUIT BOARD AND CONNECTION SUBSTRATE 审中-公开
标题翻译： LEITERPLATTE UND VERBINDUNGSSUBSTRAT
公开(公告)号：EP2007176A1
公开(公告)日：2008-12-24
申请号：EP07736883.5
申请日：2007-03-14
申请人： Sumitomo Bakelite Company, Ltd.
发明人： CHUMA, Toshiaki, c/o Akita Sumitomo Bake Co., Ltd. , INABA, Makoto, c/o Akita Sumitomo Bake Co., Ltd.
IPC分类号： H05K1/14
CPC分类号： H05K1/148 , H05K3/363 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481
摘要： There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion.
摘要翻译：提供了一种电路板，其包括分别设置有第一和第二导体焊盘的间隔的第一和第二电路基板; 以及连接基板，包括从一侧或另一侧突出的第一导体柱和第二导体柱; 所述连接基板设置成覆盖所述第一和第二电路基板的一部分，并在其间桥接; 第一导体柱和第一导体焊盘以及第二导体柱和第二导体焊盘彼此相对设置; 电路板还包括在熔融金属涂层时形成的连接器部分，其预先形成在第一导体柱和第一导体焊盘中的至少一个的表面上，并且在第二部分中的至少一个的表面上形成导体柱和第二导体垫; 第一和第二电路基板和连接基板通过连接器部分电连接。

7. 发明公开

EP1990389A1 ADHESIVE FILM 审中-公开
标题翻译： KLEBFILM
公开(公告)号：EP1990389A1
公开(公告)日：2008-11-12
申请号：EP06714737.1
申请日：2006-02-27
申请人： Sumitomo Bakelite Company, Ltd.
发明人： TAKAHASHI, Toyosei
IPC分类号： C09J7/02 , H01L23/10
CPC分类号： H01L23/10 , C09J7/10 , C09J2205/102 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/1461 , H01L2924/15788 , Y10T428/1059 , Y10T428/1073 , H01L2924/00 , H01L2924/3512
摘要： An adhesive film used for bonding a semiconductor component or a liquid crystal display component with a substrate, the adhesive film being composed of a resin composition containing a curable resin and a filler, and the adhesive film showing a water vapor transmission rate of 30 [g/m 2 ·24h] or above, wherein the curable resin preferably contains photo-curable resin, thermosetting resin, or curable resin cured both by light and heat. The filler preferably contains a porous filler, the filler preferably has a mean void diameter of 0.1 to 5 nm, and the adhesive film preferably shows a water vapor transmission rate at 25°C of 4 [g/m 2 ·24h] or above.
摘要翻译：用于将半导体部件或液晶显示部件与基板接合的粘合膜，所述粘合膜由含有固化性树脂和填料的树脂组合物构成，所述粘合膜的透水率为30 [g / m 2·24h]以上，其中，固化性树脂优选含有通过光和热固化的光固化性树脂，热固性树脂或固化性树脂。填料优选含有多孔填料，填料的平均空隙直径优选为0.1〜5nm，优选25℃下的水蒸气透过率为4 [g / m 2·24h]以上。

8. 发明授权

EP2056106B1 SUGAR CHAIN-CAPTURING SUBSTANCE AND USE THEREOF 有权
标题翻译：糖链链接物质及其用途
公开(公告)号：EP2056106B1
公开(公告)日：2017-10-11
申请号：EP07790327.6
申请日：2007-08-06
申请人： Sumitomo Bakelite Company, Ltd. , National University Corporation Hokkaido University
发明人： SHIMAOKA, Hideyuki , NISHIMURA, Shinichiro , SHINOHARA, Yasuro , MIURA, Yoshiaki , FURUKAWA, Jun-ichi
IPC分类号： G01N33/48 , C08B37/00 , C08G81/02 , G01N30/88 , G01N33/53 , G01N37/00 , C07H1/08 , C07C243/24 , C08F8/30
CPC分类号： C08J3/24 , C07C233/20 , C07C271/08 , C07C281/02 , C08F8/30 , C08F122/38 , C08F2222/1013 , G01N33/5308 , G01N2030/027 , G01N2030/8813 , G01N2030/8836 , Y02P20/55 , Y10T428/2982 , C08F220/60

9. 发明授权

EP2731994B1 POLYMER AND COMPOSITIONS THEREOF FOR FORMING PATTERNED LAYERS AFTER IMAGE-WISE EXPOSURE TO ACTINIC RADIATION 有权
标题翻译：聚合物及其组合物结构化蛋鸡进行图像WEISER光化曝光的生产
公开(公告)号：EP2731994B1
公开(公告)日：2016-05-04
申请号：EP12738360.2
申请日：2012-07-16
申请人： Sumitomo Bakelite Company, Ltd.
发明人： ONISHI, Osamu , IKEDA, Haruo , TAGASHIRA, Nobuo , RHODES, Larry , KANDANARACHCHI, Pramod
IPC分类号： C08L65/00
CPC分类号： G03F7/0233 , C08F32/08 , C08F222/06 , C08F232/08 , C09D135/00 , G03F7/022 , G03F7/0226 , G03F7/027 , G03F7/038 , G03F7/0384

10. 发明公开

EP2731994A2 POLYMER AND COMPOSITIONS THEREOF FOR FORMING PATTERNED LAYERS AFTER IMAGE-WISE EXPOSURE TO ACTINIC RADIATION 有权
标题翻译：聚合物及其组合物结构化蛋鸡进行图像WEISER光化曝光的生产
公开(公告)号：EP2731994A2
公开(公告)日：2014-05-21
申请号：EP12738360.2
申请日：2012-07-16
申请人： Sumitomo Bakelite Company, Ltd. , Promerus, LLC
发明人： ONISHI, Osamu , IKEDA, Haruo , TAGASHIRA, Nobuo , RHODES, Larry , KANDANARACHCHI, Pramod
IPC分类号： C08L65/00
CPC分类号： G03F7/0233 , C08F32/08 , C08F222/06 , C08F232/08 , C09D135/00 , G03F7/022 , G03F7/0226 , G03F7/027 , G03F7/038 , G03F7/0384
摘要： Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

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