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1. 发明公开

EP2477466A2 Method of manufacturing a package for embedding one ore more electronic components 有权转让
标题翻译：一种用于制备一种包装，用于嵌入一个或多个电子元件的过程
公开(公告)号：EP2477466A2
公开(公告)日：2012-07-18
申请号：EP12151074.7
申请日：2012-01-13
申请人： Sony Corporation
发明人： Merkle, Thomas , Koch, Stefan , Choi, Joo-Young
IPC分类号： H05K1/18 , H05K1/02
CPC分类号： H05K3/4697 , H01L23/49827 , H01L23/5389 , H01L23/66 , H01L25/16 , H01L2223/6616 , H01L2223/6633 , H01L2223/6677 , H01L2223/6683 , H01L2924/0002 , H05K1/0243 , H05K1/16 , H05K1/185 , H05K3/301 , H05K3/465 , H05K2201/0715 , H05K2201/0723 , H05K2201/09972 , H05K2201/09981 , H05K2203/1469 , H01L2924/00
摘要： The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave / THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.
摘要翻译：本发明涉及INTEGRA婷电子系统的领域并在毫米波和太赫兹频率下操作。一种单片多芯片封装，为寻求一个包以及制造方法制造的载体结构检查包和这样的载体结构的建议，以获得包没有完全屏蔽所述毫米波/太赫兹系统的不同功能。该包是由感光性单体聚合倾入到位。逐渐成长周围和微波集成电路（单片微波集成电路），使得连接到MMIC的，但凹陷芯片的高频区域的上方。所提出的方法导致功能块都被电磁屏蔽完全呼叫。这些单位可以结合和级联gemäß系统的需求。

2. 发明公开

EP2204671A1 Camera assisted sensor imaging system and multi aspect imaging system 有权
标题翻译： KameraunterstütztesAbtastabbildungssystem und Mehrfachaspekt-Abbildungssystem
公开(公告)号：EP2204671A1
公开(公告)日：2010-07-07
申请号：EP08173088.9
申请日：2008-12-30
申请人： Sony Corporation
发明人： Koch, Stefan , Guthörl, Marc
IPC分类号： G01S13/89 , G01S13/86 , G06T7/00 , H04N5/225 , G06K9/00
CPC分类号： H04N5/225 , G01S7/4802 , G01S13/50 , G01S13/867 , G01S13/887 , G01S13/89 , G01S17/89 , G01V8/005
摘要： The present invention relates to the fields of imaging systems, security screenings, contraband object detection, microwave screening, millimeter wave screening and Terahertz screening. The present invention especially relates to a camera assisted sensor imaging system and a multi aspect imaging system.
The camera assisted sensor imaging system according to the present invention comprises an optical and/or infrared camera unit for generating camera image information, a processing and control unit for detecting targets based on the generated camera image information, and a sensor unit adapted to successively scan portions of a detected target and to generate a plurality of corresponding image information parts, whereby the sensor unit is operable in the microwave, millimeter wave and/or Terahertz frequency range, and the processing and control unit is further adapted to construct an image of the target based on the image information parts and based on the generated camera image information.
The multi aspect imaging system according to the present invention comprises one or more reflective elements and a sensor section operable in the microwave, millimeter wave and/or Terahertz frequency range. The sensor section is adapted to scan a first and a second aspect of a target, whereby the second aspect is scanned via a reflective element and the second aspect is scanned directly or via another reflective element.
摘要翻译：本发明涉及成像系统，安全检查，违禁品检测，微波筛选，毫米波筛选和太赫兹筛选等领域。本发明特别涉及相机辅助传感器成像系统和多方面成像系统。根据本发明的相机辅助传感器成像系统包括用于生成相机图像信息的光学和/或红外相机单元，用于基于生成的相机图像信息来检测目标的处理和控制单元，以及适于连续扫描的传感器单元并且生成多个对应的图像信息部分，由此所述传感器单元可在微波，毫米波和/或太赫兹频率范围内操作，并且所述处理和控制单元进一步适于构建所述检测目标的图像，基于图像信息部分并基于所生成的相机图像信息。根据本发明的多方面成像系统包括一个或多个反射元件和可在微波，毫米波和/或太赫兹频率范围内操作的传感器部分。传感器部分适于扫描目标的第一和第二方面，由此通过反射元件扫描第二方面，并且第二方面直接扫描或经由另一反射元件进行扫描。

3. 发明公开

EP2093891A1 Transceiver structure 审中-公开
标题翻译： Sende- /Empfangsgerätstruktur
公开(公告)号：EP2093891A1
公开(公告)日：2009-08-26
申请号：EP08151807.8
申请日：2008-02-22
申请人： Sony Corporation , Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
发明人： Koch, Stefan , Kallfass, Ingmar
IPC分类号： H04B1/40
CPC分类号： H04B1/403 , H04B1/18
摘要： The present invention relates to an integrated transceiver structure 1; 20, comprising at least one antenna terminal
2a-2d, a mixer 4 adapted to down-convert signals received via said at least one antenna terminal 2a-2d and to up-convert signals to be transmitted via said antenna terminal 2a-2d, a receiving path 5 adapted to guide signals received via said at least one antenna terminal 2a-2d to said mixer 4, a transmitting path 16 adapted to guide signals to be transmitted from said mixer 4 to said at least one antenna terminal 2a-2d, a first switch 7 adapted to selectively connect said at least one antenna terminal 2a-2d to said receiving path 5 or said transmitting path 16, and a second switch 8 adapted to selectively connect said receiving path 5 or said transmitting path 6 to said mixer 4.
The transceiver structure 1; 20 of the invention is advantageously implemented on a single chip and is preferably suitable for millimeter wave wireless applications.
摘要翻译：本发明涉及集成收发器结构1; 20，包括至少一个天线端子2a-2d，适于对经由所述至少一个天线端子2a-2d接收的信号进行下转换的上变频和经由所述天线端子2a-2d传输的信号的混频器4，适于将经由所述至少一个天线端子2a-2d接收的信号引导到所述混频器4的接收路径5，适于将要从所述混频器4发送的信号引导到所述至少一个天线端子2a-2d的发送路径16，适于将所述至少一个天线端子2a-2d选择性地连接到所述接收路径5或所述发送路径16的第一开关7以及适于将所述接收路径5或所述发送路径6选择性地连接到所述混合器4的第二开关8。收发机结构1; 本发明的优点20有利地在单个芯片上实现，并且优选地适用于毫米波无线应用。

4. 发明公开

EP2477466A3 Method of manufacturing a package for embedding one ore more electronic components 有权转让
标题翻译：一种用于制备一种包装，用于嵌入一个或多个电子元件的过程
公开(公告)号：EP2477466A3
公开(公告)日：2013-10-16
申请号：EP12151074.7
申请日：2012-01-13
申请人： Sony Corporation
发明人： Merkle, Thomas , Koch, Stefan , Choi, Joo-Young
IPC分类号： H05K1/18 , H05K1/02 , H01L23/66 , H05K1/16
CPC分类号： H05K3/4697 , H01L23/49827 , H01L23/5389 , H01L23/66 , H01L25/16 , H01L2223/6616 , H01L2223/6633 , H01L2223/6677 , H01L2223/6683 , H01L2924/0002 , H05K1/0243 , H05K1/16 , H05K1/185 , H05K3/301 , H05K3/465 , H05K2201/0715 , H05K2201/0723 , H05K2201/09972 , H05K2201/09981 , H05K2203/1469 , H01L2924/00
摘要： The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave / THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

5. 发明授权

EP2204671B1 Camera assisted sensor imaging system and multi aspect imaging system 有权
标题翻译：摄像机辅助Abtastabbildungssystem和多方位成像系统
公开(公告)号：EP2204671B1
公开(公告)日：2012-04-11
申请号：EP08173088.9
申请日：2008-12-30
申请人： Sony Corporation
发明人： Koch, Stefan , Guthörl, Marc
IPC分类号： G01S7/48 , G01S13/50 , G01S17/89 , G01S13/88 , G01S13/89 , G01S13/86 , G06T7/00 , H04N5/225 , G06K9/00
CPC分类号： H04N5/225 , G01S7/4802 , G01S13/50 , G01S13/867 , G01S13/887 , G01S13/89 , G01S17/89 , G01V8/005

6. 发明公开

EP2202535A1 Radiometric electrical line sensor in combination with mechanical rotating mirror for creating 2D image 审中-公开
标题翻译：在组合辐射电线传感器与机械旋转镜用于创建二维图像
公开(公告)号：EP2202535A1
公开(公告)日：2010-06-30
申请号：EP08172714.1
申请日：2008-12-23
申请人： Sony Corporation
发明人： Guthörl, Marc , Koch, Stefan
IPC分类号： G01S13/86 , H01Q3/20 , H01Q19/10 , G03B37/00
CPC分类号： H01Q3/20 , G01S13/887 , G03B37/00 , H01Q19/104
摘要： The present invention relates to the field of two dimensional (2D) radiometric imaging. The present invention especially relates to a sensor unit. The sensor unit according to the present invention comprises a reflecting element mounted so as to be rotatable around an axis of rotation and a line sensor operating in the microwave, millimeter wave and/or terahertz frequency range and having its field of view directed towards the reflecting element, whereby the axis of rotation intersects with a reflection plane of the reflecting element.
摘要翻译：本发明涉及二维（2D）辐射成像领域。本发明特别的爱涉及一种传感器单元。传感器单元雅丁到本发明包括反射元件安装成围绕可旋转底座上的旋转轴和线传感器在微波操作，毫米波和/或兆兆赫兹频率范围工作并且使其视朝向反射场元件，由此，旋转轴与该反射元件的反射平面相交。

7. 发明公开

EP2211155A1 Method and system to measure noise inserted mm-waves 审中-公开
标题翻译：维尔芬和系统zum Messen von Rauschen在MM-Wellen
公开(公告)号：EP2211155A1
公开(公告)日：2010-07-28
申请号：EP09150983.6
申请日：2009-01-21
申请人： Sony Corporation
发明人： Guthoerl, Marc , Koch, Stefan
IPC分类号： G01K11/00 , G01V8/00
CPC分类号： G01K11/006 , G01V8/005
摘要： The present invention relates to a radiometer for detecting electromagnetic signals in the microwave and millimetre wave range. The radiometer comprises an antenna operable to receive the electromagnetic signals, an internal noise signal generator operable to receive a control signal and to generate and output a calibration noise signal depending on the control signal, and a coupler operable to couple the received electromagnetic signal with the calibration noise signal and to output a coupled electromagnetic signal. Furthermore, the internal noise signal generator is activated based on the control signal.
摘要翻译：本发明涉及一种用于检测微波和毫米波范围内的电磁信号的辐射计。辐射计包括可操作以接收电磁信号的天线，可操作以接收控制信号并根据控制信号产生和输出校准噪声信号的内部噪声信号发生器，以及可操作以将所接收的电磁信号与校准噪声信号并输出耦合的电磁信号。此外，内部噪声信号发生器基于控制信号被激活。

8. 发明公开

EP2107638A1 Half-mode substrate integrated antenna structure 审中-公开
标题翻译：在einem Substrat integrierte Halbmodus-Antennenstruktur
公开(公告)号：EP2107638A1
公开(公告)日：2009-10-07
申请号：EP08153742.5
申请日：2008-03-31
申请人： Sony Corporation
发明人： Guthoerl, Marc , Koch, Stefan
IPC分类号： H01Q1/38 , H01Q13/02 , H01P3/12
CPC分类号： H01Q13/025 , H01P3/121 , H01Q1/38
摘要： The present invention relates to a half mode substrate integrated antenna structure 1, 10, 11 for electro-magnetic signals, comprising a substrate 2 with a top 2a and a bottom side 26, said substrate being essentially of a flat shape with a main plane M, a conductive layer 3a arranged on said top and a conductive layer 3b arranged on said bottom side, a series of conductive vias 4 extending between the conductive layers 3a, 3b of the top and the bottom side of the substrate so that a waveguide having a feeding end 5 and an antenna end 6 is formed, wherein said antenna end 6 is formed by end regions 7 of said conductive layers 3a, 3b and said substrate 2 so that a radiation pattern of said antenna structure 1 essentially extends in the main plane M.
摘要翻译：本发明涉及一种用于电磁信号的半模式衬底集成天线结构1,10,11，其包括具有顶部2a和底侧26的衬底2，所述衬底基本上具有主平面M的平坦形状布置在所述顶部上的导电层3a和布置在所述底侧上的导电层3b，在衬底的顶部和底侧的导电层3a，3b之间延伸的一系列导电通孔4，使得具有馈电端5和天线端6，其中所述天线端6由所述导电层3a，3b和所述衬底2的端部区域7形成，使得所述天线结构1的辐射图案在主平面M中基本上延伸。

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