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1. 发明授权

EP2911184B1 PHOTOCURABLE RESIN COMPOSITION FOR IMPRINTING, METHOD FOR PRODUCING MOLD FOR IMPRINTING, AND MOLD FOR IMPRINTING 有权
公开(公告)号：EP2911184B1
公开(公告)日：2019-07-24
申请号：EP13848733.5
申请日：2013-10-15
申请人： Soken Chemical & Engineering Co., Ltd.
发明人： YAMADA, Hiroko , SUTO, Yasuo
IPC分类号： G03F7/00 , G03F7/027 , G03F7/029 , G03F7/031 , G03F7/075 , B29L31/00 , B29C33/40 , B29C33/38 , B29C59/02 , C08F2/48

2. 发明授权

EP2602089B1 RESIN MOLD FOR NANOIMPRINTING AND MANUFACTURING METHOD THEREOF 失效
标题翻译：纳米印刷用树脂模及其制造方法
公开(公告)号：EP2602089B1
公开(公告)日：2017-12-20
申请号：EP11814673.7
申请日：2011-08-03
申请人： Soken Chemical & Engineering Co., Ltd.
发明人： YAMADA, Hiroko , MIZAWA, Takahide
IPC分类号： B29C33/40 , B29C33/42 , B29C59/02 , B29C33/56 , B29K33/04 , H01L21/027 , G03F7/00 , B82Y10/00 , B82Y40/00
CPC分类号： B29C59/005 , B29C33/40 , B29C33/424 , B29C33/56 , B29C2033/426 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： Problem: An object of the present invention is to provide a resin mold for nanoimprinting without transfer defects, that has excellent mold releasability from the resin to be imprinted, and that does not cause imprinting defects. Moreover, another object of the present invention is to provide a resin mold for nanoimprinting such that peeling does not occur between various layers and the substrate during imprinting. Means to Solve the Problem: The resin mold for nanoimprinting of the present invention has a substrate, a resin layer formed upon the substrate and having a depressions and protrusions pattern on a surface, an inorganic substance layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the resin layer, and a mold release agent layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the inorganic substance layer. The resin of the resin layer includes constituent units derived from an epoxy group-containing unsaturated compound at a concentration of 1 to 50 percent relative to total constituent units, and the epoxy value is 7.0 × 10 -4 to 4.0 × 10 -2 .

3. 发明公开

EP2752283A1 RESIN MOLD BONDING METHOD AND ROLL-TO-ROLL CONTINUOUS MOLD COMPOSITION USING SAME 审中-公开
标题翻译： HARZFORMKLEBEVERFAHREN UND ROLLE-ZU-ROLLE-ENDLOSFORMZUSAMMENSETZUNG DAMIT
公开(公告)号：EP2752283A1
公开(公告)日：2014-07-09
申请号：EP12827068.3
申请日：2012-07-31
申请人： Soken Chemical & Engineering Co., Ltd.
发明人： YAMADA, Hiroko , TAKAHASHI, Takanori , SUTO, Yasuo
IPC分类号： B29C33/40 , B29C59/04 , H01L21/027
CPC分类号： B29C65/48 , B29C33/0011 , B29C33/0022 , B29C33/40 , B29C59/04 , B29C65/1406 , B29C65/4825 , B29C65/483 , B29C65/4845 , B29C65/5057 , B29C65/524 , B29C65/546 , B29C65/76 , B29C66/1122 , B29C66/1142 , B29C66/1282 , B29C66/12841 , B29C66/4322 , B29C66/49 , B29C66/5326 , B29C66/71 , B29C66/723 , B29C66/72323 , B29C66/72326 , B29C66/72327 , B29C2035/0827 , B29D99/0035 , B29L2016/00 , B29L2031/324 , Y10T156/1089 , B29K2023/00 , B29K2023/38 , B29K2025/04 , B29K2033/08 , B29K2033/12 , B29K2063/00 , B29K2067/00 , B29K2067/003 , B29K2069/00 , B29K2079/08 , B29K2081/06
摘要： [Technical Problem]
It is an object to provide a bonding method of a resin mold and a roll-to-roll continuous mold composition that is produced by using the bonding method, which are used to manufacture resin structures (in particular, resin-based replica molds) in quantity on a roll-to-roll basis, and with which the strength of a joint part may be increased to a satisfactory extent in the case in which an end part of a resin mold is bonded to each other, almost no step is formed at the joint part, and a transcription of a reversal pattern of a fine concave convex pattern that is desired is carried out in a successful manner.
[Solution of Problem]
A bonding method of a resin mold is characterized by comprising the step of butting the end parts of resin molds that is provided with a formed reversal pattern of a fine concave convex pattern that is desired to each other for bonding the resin molds, wherein a detachable resin is filled in a gap of the butted part between the end parts of the resin mold and the end parts of the resin molds are bonded to each other in an integrated manner by the hardening of the detachable resin.
摘要翻译：技术问题本发明的目的是提供一种通过使用粘合方法制造的树脂模具和辊对连续模具组合物的粘合方法，所述粘合方法用于制造树脂结构体（特别是树脂基树脂复制模具），并且在树脂模具的端部彼此结合的情况下，可以将接合部件的强度增加到令人满意的程度，几乎不会在接合部形成台阶，成功地进行所希望的细凹凸图案的反转图案的转印。 [问题的解决方案]树脂模具的接合方法的特征在于包括：将树脂模具的端部对接的步骤，该树脂模具的端部具有形成的彼此所需的凹凸图案的反转图案，用于粘合树脂其中在树脂模具的端部与树脂模具的端部之间的对接部分的间隙中填充有可拆卸树脂通过可分离树脂的硬化以一体的方式彼此粘合。

4. 发明公开

EP2711161A1 NANOIMPRINT MOLD AND CURVED BODY 审中-公开
标题翻译： NANOPRÄGEFORMUNDGEKRÜMMTERKÖRPER
公开(公告)号：EP2711161A1
公开(公告)日：2014-03-26
申请号：EP12785578.1
申请日：2012-05-15
申请人： Soken Chemical & Engineering Co., Ltd.
发明人： TAKAHASHI, Takanori , YAMADA, Hiroko , MIZAWA, Takahide , KOJIMA, Ryota
IPC分类号： B29C59/02 , B29C33/40 , H01L21/027
CPC分类号： B29C33/424 , B29C33/405 , B29K2883/00 , G03F7/0002 , Y10T428/24479
摘要： The nanoimprint mold for a curved surface of the present invention is characterized by comprising a silicone rubber elastic body having an Hs rubber hardness, in the case of a thickness of 250 µm, of 10 to 55 and by having fine depressions and protrusions formed on the surface. According to the nanoimprint mold for a curved surface of the present invention, a nanoimprint can be formed even on a curved surface.
摘要翻译：本发明的弯曲表面的纳米压印模具的特征在于，在厚度为250μm，厚度为10〜55的情况下，具有Hs橡胶硬度的硅橡胶弹性体，并且在其上形成微小的凹凸表面。根据本发明的曲面用纳米压印模具，即使在曲面上也能形成纳米压印。

5. 发明公开

EP2602089A1 RESIN MOLD FOR NANOIMPRINTING AND MANUFACTURING METHOD THEREOF 失效
标题翻译：哈兹福德
公开(公告)号：EP2602089A1
公开(公告)日：2013-06-12
申请号：EP11814673.7
申请日：2011-08-03
申请人： Soken Chemical & Engineering Co., Ltd.
发明人： YAMADA, Hiroko , MIZAWA, Takahide
IPC分类号： B29C59/02 , B29C33/40 , B29C33/56 , H01L21/027 , B29K33/04
CPC分类号： B29C59/005 , B29C33/40 , B29C33/424 , B29C33/56 , B29C2033/426 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： Problem: An object of the present invention is to provide a resin mold for nanoimprinting without transfer defects, that has excellent mold releasability from the resin to be imprinted, and that does not cause imprinting defects. Moreover, another object of the present invention is to provide a resin mold for nanoimprinting such that peeling does not occur between various layers and the substrate during imprinting.
Means to Solve the Problem: The resin mold for nanoimprinting of the present invention has a substrate, a resin layer formed upon the substrate and having a depressions and protrusions pattern on a surface, an inorganic substance layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the resin layer, and a mold release agent layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the inorganic substance layer. The resin of the resin layer includes constituent units derived from an epoxy group-containing unsaturated compound at a concentration of 1 to 50 percent relative to total constituent units, and the epoxy value is 7.0 × 10 -4 to 4.0 × 10 -2 .
摘要翻译：问题：本发明的目的是提供一种没有转印缺陷的纳米压印用树脂模具，其具有优异的脱模性，并且不会产生印记缺陷。此外，本发明的另一个目的是提供一种用于纳米压印的树脂模具，使得在压印期间不同层和基板之间不会发生剥离。解决问题的手段本发明的纳米压印用树脂模具具有基材，形成在基材上的树脂层，在表面上具有凹凸状图案，至少在表面上形成均匀厚度的无机物层具有树脂层的凹凸和突起图案，以及在至少具有无机物层的凹凸的图案的表面上形成均匀厚度的脱模剂层。树脂层的树脂包含相对于总构成单位为1〜50％的含环氧基的不饱和化合物的结构单元，环氧值为7.0×10 -4〜4.0×10 -2。

6. 发明公开

EP2911184A1 PHOTOCURABLE RESIN COMPOSITION FOR IMPRINTING, METHOD FOR PRODUCING MOLD FOR IMPRINTING, AND MOLD FOR IMPRINTING 有权
标题翻译：固化性树脂组合物成型，制造方法FORM用以塑造成形
公开(公告)号：EP2911184A1
公开(公告)日：2015-08-26
申请号：EP13848733.5
申请日：2013-10-15
申请人： Soken Chemical & Engineering Co., Ltd.
发明人： YAMADA, Hiroko , SUTO, Yasuo
IPC分类号： H01L21/027 , B29C33/38 , B29C59/02 , C08F220/00 , C08F220/26 , C08F230/08
CPC分类号： C08F222/20 , B29C33/38 , B29C33/3857 , B29C33/40 , B29L2031/757 , C08F2/48 , G03F7/0002 , G03F7/027 , G03F7/029 , G03F7/031 , G03F7/0755 , C08F222/1006 , C08F230/08 , C08F2222/1013 , C08F2220/286 , C08F2230/085
摘要： Provided is a photocurable resin composition for producing an imprinting mold which has superior releasability from a transfer target resin and is flexible. The photocurable resin composition does not undergo curing shrinkage when subjected to photo-imprinting as a transfer target of photo-imprinting; and is capable of producing by photo-imprinting an imprinting mold which has high surface hardness and in which the occurrence of yellowing is suppressed even when irradiated with e.g., ultraviolet ray. The photocurable resin composition for imprinting includes a (meth)acrylic monomer (A), a silicon-containing monomer (B) and a photoinitiator (C), wherein the photoinitiator includes a combination of an alkylphenone-based photoinitiator (C1) and an acylphosphine oxide-based photoinitiator (C2).
摘要翻译：提供了一种用于制造柔性的，以压印模具，其从传送目标树脂具有优异的脱模性和是光固化性树脂组合物。光固化性树脂组合物不经历固化收缩当经受光压印作为光压印的转移目标; 并且能够通过在压印模具，其具有高的表面硬度，并且其中泛黄发生被抑制，即使当与E. G.，紫外线照射光压印生产的。用于压印用光固化性树脂组合物包括（甲基）丙烯酸类单体（A），单体含硅（B）和光引发剂（C），worin光引发剂包括在acylphosphines基于烷基苯-光引发剂（C1）的和一个组合基于氧化物的光引发剂（C2）。

7. 发明公开

EP2858093A1 PHOTOCURABLE RESIN COMPOSITION FOR IMPRINTING, METHOD FOR PRODUCING SAME, AND STRUCTURE 无效
标题翻译：固化性树脂组合物成型，METHOD FOR其制造和结构
公开(公告)号：EP2858093A1
公开(公告)日：2015-04-08
申请号：EP13793970.8
申请日：2013-05-15
申请人： Soken Chemical & Engineering Co., Ltd.
发明人： YAMADA, Hiroko , SUTO, Yasuo , MIYAZAWA, Yukihiro
IPC分类号： H01L21/027 , B81C99/00 , C08F2/50
CPC分类号： C08F22/10 , B29C59/005 , B29C59/026 , C08F2/50 , G03F7/0002 , Y10T428/24612
摘要： Provided are a photocurable resin composition in which curing shrinkage in photo-imprinting is suppressed, and a photocurable resin composition capable of producing by photo-imprinting a structure which has high surface hardness and in which the occurrence of yellowing is suppressed even when irradiated with e.g., ultraviolet ray. The photocurable resin composition for imprinting includes a (meth)acrylic monomer (A) and a photoinitiator (B), wherein the photoinitiator (B) has a combination of an alkylphenone-based photoinitiator (B1) and an acylphosphine oxide-based photoinitiator (B2), wherein a blending weight ratio (B1: B2) of the alkylphenone-based photoinitiator (B1) to the acylphosphine oxide-based photoinitiator (B2) is in the range of 1:99 to 90:10.
摘要翻译：本发明提供在光压印在固化收缩光固化性树脂组合物被抑制，并能够通过产生的光固化性树脂组合物，光压印，其具有高的表面硬度，并且其中变黄的发生，即使抑制当与例如照射的结构，紫外线射线。用于压印用光固化性树脂组合物包括（甲基）丙烯酸类单体（A）和光引发剂（B），worin光引发剂（B）具有的结合（在烷基苯基光引发剂（B1），并且在酰基氧化膦系光聚合引发剂B2 ）worin的共混重量比（B1：对烷基苯基光引发剂（B1）的酰基氧化膦类光引发剂（B2的B2））是在1:99至90:10的范围内。

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