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1. 发明公开

EP2986089A1 METHOD FOR MANUFACTURING SOLDER CIRCUIT BOARD, SOLDER CIRCUIT BOARD, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT 审中-公开
标题翻译：方法用于电子元件的用于制造LOTLEITERPLATTE，LOTLEITERPLATTE和方法进行组装
公开(公告)号：EP2986089A1
公开(公告)日：2016-02-17
申请号：EP14783360.2
申请日：2014-04-09
申请人： Showa Denko K.K.
发明人： SAKAI Takekazu
IPC分类号： H05K3/34 , H01L21/60
CPC分类号： H05K3/3494 , H01L21/4853 , H01L23/49811 , H01L24/13 , H01L24/81 , H01L2224/03442 , H01L2224/0347 , H01L2224/03849 , H01L2224/0401 , H01L2224/1134 , H01L2224/81075 , H01L2224/81191 , H01L2224/8121 , H01L2224/8123 , H01L2224/8138 , H01L2224/814 , H01L2224/81409 , H01L2224/81411 , H01L2224/81413 , H01L2224/81416 , H01L2224/81444 , H01L2224/81815 , H01L2924/01322 , H01L2924/15787 , H01L2924/351 , H01L2924/381 , H01L2924/3841 , H05K3/3436 , H05K3/3452 , H05K3/3463 , H05K3/3484 , H05K3/3489 , H05K2203/0425 , H05K2203/043 , H05K2203/0568 , H05K2203/0769 , H05K2203/0776 , H05K2203/0789 , H05K2203/124 , H01L2924/01082 , H01L2924/01047 , H01L2924/0105 , H01L2924/01083 , H01L2924/01048 , H01L2924/01049 , H01L2924/0103 , H01L2924/01029 , H01L2924/01051 , H01L2924/01079 , H01L2924/01032 , H01L2924/014 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A method for manufacturing a solder circuit board, the method including performing, in sequence, a resist formation step of partially coating a conductive circuit electrode surface on a printed wiring board with a resist, a tacky portion formation step of forming a tacky portion by imparting tackiness to a portion of the conductive circuit electrode surface not coated with the resist, a solder adhesion step of adhering a solder powder to the tacky portion, a resist removal step of removing the resist, and a first heating step of heating the printed wiring board and melting the solder powder.
摘要翻译：一种用于制造钎焊的电路板，该方法包括：执行，在顺序方法中，抗蚀剂的上的印刷布线板与部分涂覆导电电路电极表面形成工序的抗蚀剂，通过赋予形成粘性部分的粘性部形成工序胶粘性未涂覆除去抗蚀剂的抗蚀剂，粘附焊料粉末到粘性部分的钎焊料粘附步骤中，抗蚀剂去除步骤，以及加热所述印刷电路板的第一加热工序中的导电性电路电极表面的一部分上和熔化焊料粉末。

2. 发明公开

EP2528422A1 APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD 审中-公开
标题翻译： DEVICE FOR焊膏和方法的粘附粘附焊膏的电子电路板
公开(公告)号：EP2528422A1
公开(公告)日：2012-11-28
申请号：EP11734637.9
申请日：2011-01-18
申请人： Showa Denko K.K.
发明人： SHOJI Takashi , SAKAI Takekazu
IPC分类号： H05K3/34 , B23K3/06
CPC分类号： H05K3/3478 , B23K1/0016 , B23K1/203 , B23K3/06 , B23K2201/42 , H05K2203/0292 , H05K2203/0425 , H05K2203/1527 , H05K2203/1554
摘要： Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.
摘要翻译：本发明公开了用于在钎焊粉附着装置在电子电路板和用于钎焊粉附着到电子电路板的方法中的焊料粉细坚持。用于钎焊粉附着该装置包括：一个容器包含确实到电子电路板和钎料粉末; 设置在容器中的基板保持部以保持所述电子电路板检查做它们的板表面基本上面对垂直方向; 的倾斜装置，其设置在容器为其中该容器在第一方向倾斜的倾斜位置的initialPosition的，并且其从在第二方向上的初始位置倾斜的容器没有相对于该第一方向，并且倾斜该容器回在第一方向上; 并在其通过旋转轴的旋转提供振动到容器的底部的容器的底部的中央设置偏心电动机提供振动装置，和控制装置，用于设置所述偏心马达的旋转轴在相同的方向上该容器的倾倒方向。

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