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1. 发明公开

EP4411787A1 METHOD FOR SEPARATING BONDED WAFER 审中-公开
公开(公告)号：EP4411787A1
公开(公告)日：2024-08-07
申请号：EP22876187.0
申请日：2022-09-27
申请人： Shin-Etsu Handotai Co., Ltd. , SHIN-ETSU CHEMICAL CO., LTD.
发明人： ISHIZAKI, Junya , YAMADA, Masato , OGAWA, Yoshinori
IPC分类号： H01L21/02
CPC分类号： H01L21/02
摘要： The present invention is a method for separating a bonded wafer, the method comprises separating a support from a bonded wafer which comprises a device structure portion having two or more electrodes with different polarities on one side of an epitaxial functional layer, and the device structure portion being bonded to a support made of a foreign substrate using a curable bonding material, wherein, by irradiating the bonded wafer with a laser beam, the curable bonding material and/or at least a portion of the surface of the device structure portion that comes into contact with the curable bonding material absorb(s) the laser beam to decompose the curable bonding material and/or the surface of the device structure portion, and thus the device structure portion and the support are separated. As a result, it is provided a method for separating a bonded wafer with a high survival rate of device structure portion in the separation of a bonded wafer that is firmly bonded with a curable bonding material, as a bonded wafer, which has the device structure portion having two or more electrodes with different polarities on one surface of an epitaxial functional layer and the device structure portion is bonded to a support made of a foreign substrate with the curable bonding material.

2. 发明公开

EP4270457A1 STAMP COMPONENT FOR TRANSFERRING MICROSTRUCTURE 审中-实审
公开(公告)号：EP4270457A1
公开(公告)日：2023-11-01
申请号：EP21910042.7
申请日：2021-11-16
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： NAKAGAWA, Hideo , OGAWA, Yoshinori , OZAI, Toshiyuki
IPC分类号： H01L21/677
摘要： The present invention is a microstructure-transfer stamp component including a substrate and a silicone-based rubber film formed on the substrate, wherein a surface of the silicone-based rubber film facing away from the substrate has one or more recesses each being closed except for a surface opening. This provides a microstructure-transfer stamp component that can optimize temporary adhesive strength of the surface of the silicone-based rubber film stamp in a short period of time.

3. 发明公开

EP4209563A1 ULTRAVIOLET RAY CURABLE SILICONE ADHESIVE COMPOSITION AND CURED PRODUCT THEREOF 审中-实审
公开(公告)号：EP4209563A1
公开(公告)日：2023-07-12
申请号：EP23160237.6
申请日：2019-10-25
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： OTAKE, Kohei , KITAGAWA, Taichi , MATSUMOTO, Nobuaki , OZAI, Toshiyuki , OGAWA, Yoshinori
IPC分类号： C09J183/07 , C08F290/06 , C09J4/02 , C09J7/38 , C09J11/04 , C09J183/04
摘要： This composition does not contain a non-crosslinkable organopolysiloxane resin but contains:(A) an organopolysiloxane having, per molecule, two groups each represented by formula (1)
(R1 represents a C1-20 monovalent hydrocarbon group, R2 represents an oxygen atom or the like, R3 represents an acryloyloxyalkyl group or the like, and p and a respectively represent numbers satisfying 0-10 and 1-3);(B) a monofunctional(meth)acrylate compound not including a siloxane structure;(C) an organopolysiloxane resin which comprises a unit (a) represented by formula (2)(R1, R2, R3, a, and p are identical to those described above), a R43SiO1/2 unit (b) (in the formula, R4 represents a monovalent hydrocarbon group having 1-10 carbon atoms), and a SiO4/2 unit (c), and in which the mole ratio of the total of units (a) and (b) to unit (c) is in a range of 0.4 to 1.2 : 1; and(D) a photoinitiator.Said composition provides a cured product having excellent elastic modulus and adhesiveness when used as a temporary fixing material.

4. 发明公开

EP4150409A1 METHOD AND SYSTEM FOR TRANSFERRING ALIGNMENT MARKS BETWEEN SUBSTRATE SYSTEMS 审中-实审
公开(公告)号：EP4150409A1
公开(公告)日：2023-03-22
申请号：EP21805175.3
申请日：2021-05-03
申请人： Semileds Corporation , SHIN-ETSU CHEMICAL CO., LTD.
发明人： DOAN, David, Trung , OGAWA, Yoshinori , MATSUMOTO, Nobuaki
IPC分类号： G03F9/00 , H01L23/544

5. 发明公开

EP3926695A1 MICROSTRUCTURE TRANSFER DEVICE, STAMP HEAD UNIT, STAMP COMPONENT FOR MICROSTRUCTURE TRANSFER, AND METHOD FOR TRANSFERRING MICROSTRUCTURE INTEGRATED COMPONENT 审中-公开
公开(公告)号：EP3926695A1
公开(公告)日：2021-12-22
申请号：EP19914902.2
申请日：2019-12-10
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： NAKAGAWA, Hideo , OGAWA, Yoshinori , MATSUMOTO, Nobuaki , UEDA, Shuhei , OHORI, Keiji , OTAKE, Kohei
IPC分类号： H01L33/00 , H01L21/677
摘要： The present invention is a stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.

6. 发明公开

EP4418310A1 RECEPTOR SUBSTRATE , METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TRANSFER METHOD, LED PANEL MANUFACTURING METHOD, AND STAMPER 审中-公开
公开(公告)号：EP4418310A1
公开(公告)日：2024-08-21
申请号：EP22881053.7
申请日：2022-10-12
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： YAMAOKA, Hiroshi , KURATA, Masami , USAMI, Taketo , OGAWA, Yoshinori , KONDO, Kazunori
IPC分类号： H01L21/60 , H01L21/52 , H01L21/683
CPC分类号： H01L21/60 , H01L21/683 , H01L21/52
摘要： To provide a receptor substrate that can enhance a success rate of picking up objects to be transferred during transfer by using a stamper, a method for manufacturing the receptor substrate, a transfer method using the receptor substrate, and a method for manufacturing an LED panel.
On the receptor substrate, a plurality of objects to be transferred onto another substrate by using a stamper are disposed. The receptor substrate includes a plurality of sections in each of which a group of the objects to be transferred that are to be simultaneously in a single transfer operation of the stamper are disposed, and a non-disposed region, in which the objects to be transferred are not disposed, at an outside of the section. In the receptor substrate, each of the plurality of sections is surrounded by the non-disposed region.

7. 发明公开

EP4023689A1 METHOD FOR TRANSFERRING MICROSTRUCTURES, AND METHOD FOR MOUNTING MICROSTRUCTURES 审中-实审
公开(公告)号：EP4023689A1
公开(公告)日：2022-07-06
申请号：EP20856317.1
申请日：2020-07-06
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： OGAWA, Yoshinori , OHORI, Keiji , UEDA, Shuhei , KONDO, Kazunori , OZAI, Toshiyuki , MATSUMOTO, Nobuaki , KITAGAWA, Taichi , OTAKE, Kohei , KAWAHARA, Minoru
IPC分类号： C08F290/14 , C09J4/02 , C09J5/00 , C09J11/06 , C08F220/10 , C09J183/04 , H01L21/02 , H01L21/304 , H01L21/60
摘要： A method for transferring microstructures, comprising at least the steps of:
(i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate;
(ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the plurality of microstructures temporality fixed thereon;
(iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon;
(iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and
(v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step. According to the method, a plurality of steps can be carried out while temporality fixing microstructures on a single donor substrate, and therefore it becomes possible to achieve the transfer of the microstructures with high efficiency without increasing the number of steps.

8. 发明公开

EP3828244A1 ULTRAVIOLET-CURABLE PRESSURE-SENSITIVE SILICONE ADHESIVE COMPOSITION AND CURED OBJECT OBTAINED THEREFROM 有权
公开(公告)号：EP3828244A1
公开(公告)日：2021-06-02
申请号：EP19841439.3
申请日：2019-07-17
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： OTAKE, Kohei , KITAGAWA, Taichi , MATSUMOTO, Nobuaki , OZAI, Toshiyuki , OGAWA, Yoshinori
IPC分类号： C09J183/07 , C08F290/06 , C09J11/04 , C09J11/06
摘要： A composition comprising:
(A) an organopolysiloxane having, in the molecule, two groups represented by formula (1)

(R 1 represents a C 1-20 monovalent hydrocarbon group, R 2 represents an oxygen atom, etc., R 3 represents an acryloyloxyalkyl group, etc., p is a number of 0-10, and a is a number of 1-3.);
(B) a monofunctional (meth)acrylate compound containing no siloxane structure;
(C) an organopolysiloxane resin comprising (a) R 4 3 SiO 1/2 units (R 4 is a C 1-10 monovalent hydrocarbon group) and (b) SiO 4/2 units, the molar ratio of the units (a) to the units (b) being (0.4-1.2): 1;
(D) an organopolysiloxane resin comprising (c) units represented by formula (2)

(R 1 to R 3 , a, and p are the same as defined above),
(d) R 4 3 SiO 1/2 units (R 4 is the same as defined above), and (e) SiO 4/2 units, the molar ratio of the sum of the units (c) and the units (d) to the units (e) being (0.4-1.2):1; and
(E) a photopolymerization initiator. The composition gives cured objects which, when used as temporary fixers, are excellent in terms of tackiness and modulus.

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