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1. 发明公开

EP2639822A2 Method of producing a resin molded semiconductor device 无效
标题翻译： Verfahren zur Herstellung einer Halbleitervorrichtung aus Formharz
公开(公告)号：EP2639822A2
公开(公告)日：2013-09-18
申请号：EP13001109.1
申请日：2013-03-05
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shiobara, Toshio , Sekiguchi, Susumu , Akiba, Hideki
IPC分类号： H01L21/56
CPC分类号： H01L21/565 , H01L21/561 , H01L23/293 , H01L23/3128 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/10253 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/85
摘要： It is an obj ect of the present invention to provide a method for producing a semiconductor apparatus in which the warp and break of a substrate after sealing can be suppressed even when a large substrate is sealed. The present invention provides a method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, including:
an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200°C, and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted;
an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and
a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus.
摘要翻译：本发明的目的是提供一种半导体装置的制造方法，其中即使在大的基板被密封时也能够抑制密封后的基板的翘曲和断裂。本发明提供一种具有模具的半导体装置的制造方法，所述模具具有上半模和下半模，该模具包括：将模具的上半模和下半模的一个上设置在基板上的布置步骤安装半导体器件，将模具保持在室温或加热至高达200℃的温度，并且在上半模和下半模的另一个上设置半个没有安装半导体器件的基板 ; 通过在其上配置有基板的模具上模制热固性树脂来整合其上安装有半导体器件的基板和不安装半导体器件的基板的积分步骤; 以及将从模具取出的集成基板切割以获得单独的半导体装置的步骤。

2. 发明公开

EP2639822A3 Method of producing a resin molded semiconductor device 无效
标题翻译：由模制树脂的用于制造半导体器件的工艺
公开(公告)号：EP2639822A3
公开(公告)日：2015-06-24
申请号：EP13001109.1
申请日：2013-03-05
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shiobara, Toshio , Sekiguchi, Susumu , Akiba, Hideki
IPC分类号： H01L21/56 , H01L23/31 , H01L23/29 , H01L23/00
CPC分类号： H01L21/565 , H01L21/561 , H01L23/293 , H01L23/3128 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/10253 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/85
摘要： It is an obj ect of the present invention to provide a method for producing a semiconductor apparatus in which the warp and break of a substrate after sealing can be suppressed even when a large substrate is sealed. The present invention provides a method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, including:
an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200°C, and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted;
an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and
a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus.

3. 发明公开

EP3024021A1 SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS 有权
标题翻译：密封剂复合材料层合密封接环密封式FORM WAFER半导体器件，半导体元件和方法半导体元素的半导体元件SUBSTRATES
公开(公告)号：EP3024021A1
公开(公告)日：2016-05-25
申请号：EP15003520.2
申请日：2013-02-06
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shiobara, Toshio , Akiba, Hideki , Sekiguchi, Susumu
IPC分类号： H01L23/29 , H01L21/56 , H01L23/31 , H01L21/60 , H01L23/488
CPC分类号： H01L21/561 , B32B5/00 , B32B7/02 , B32B27/00 , H01L21/78 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L24/32 , H01L24/97 , H01L2224/29099 , H01L2224/32225 , H01L2924/10253 , H01L2924/15788 , H01L2924/181 , Y10T428/24942 , Y10T428/26 , Y10T428/269 , Y10T428/31504 , Y10T428/31511 , Y10T428/31663 , H01L2924/00014 , H01L2924/00
摘要： It is an object of the invention to provide a sealant laminated composite that is very high in versatility, even when a large diameter or thin substrate or wafer is sealed, can prevent the substrate or wafer from warping and the semiconductor devices from peeling, can collectively seal a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed on a wafer level, and can provide a sealant laminated composite that is excellent in the heat resistance and humidity resistance after sealing. A sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed includes: a support wafer; and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer.
摘要翻译：它是本发明的一个目的是提供一种密封剂层压的复合材料所做的是在通用性非常高，即使是当一个大的直径或薄基片或晶片被密封，能够防止翘曲的基片或晶片和半导体器件的剥离，可以共同密封在其上的半导体器件被安装或形成在其上的半导体器件的晶片的表面的半导体器件在晶片级形成的衬底的半导体装置的安装表面，并且可以提供一个密封剂层压的复合材料那样具有优异的耐热性和密封后的耐湿性。用于共同地密封半导体器件安装在其上的装置被安装或形成在其上的半导体器件被形成在晶片的表面上的半导体器件包括一个半导体衬底的表面的密封剂叠层复合：支撑晶片; 和未固化的树脂层构成形成在支撑晶片的一侧上的未固化的热固性树脂制成。

4. 发明公开

EP2626898A3 Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus 有权
标题翻译：密封剂层压复合材料密封以形成一晶片，半导体装置及制造Hablleitervorrichtung的方法的半导体器件安装用基板，密封的半导体器件
公开(公告)号：EP2626898A3
公开(公告)日：2015-06-03
申请号：EP13000601.8
申请日：2013-02-06
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shiobara, Toshio , Akiba, Hideki , Sekiguchi, Susumu
IPC分类号： H01L23/29 , H01L21/56 , H01L23/31
CPC分类号： H01L21/561 , B32B5/00 , B32B7/02 , B32B27/00 , H01L21/78 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L24/32 , H01L24/97 , H01L2224/29099 , H01L2224/32225 , H01L2924/10253 , H01L2924/15788 , H01L2924/181 , Y10T428/24942 , Y10T428/26 , Y10T428/269 , Y10T428/31504 , Y10T428/31511 , Y10T428/31663 , H01L2924/00014 , H01L2924/00
摘要： It is an object of the invention to provide a sealant laminated composite that is very high in versatility, even when a large diameter or thin substrate or wafer is sealed, can prevent the substrate or wafer from warping and the semiconductor devices from peeling, can collectively seal a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed on a wafer level, and can provide a sealant laminated composite that is excellent in the heat resistance and humidity resistance after sealing. A sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed includes: a support wafer; and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer.

5. 发明授权

EP3024021B1 METHOD FOR MANUFACTURING A SEMICONDUCTOR APPARATUS 有权
公开(公告)号：EP3024021B1
公开(公告)日：2020-03-25
申请号：EP15003520.2
申请日：2013-02-06
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shiobara, Toshio , Akiba, Hideki , Sekiguchi, Susumu
IPC分类号： H01L23/29 , H01L21/56 , H01L23/31 , H01L21/60 , H01L21/58 , H01L23/488

6. 发明公开

EP2626898A2 Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus 有权
标题翻译：密封剂层压复合材料密封以形成一晶片，半导体装置及制造Hablleitervorrichtung的方法的半导体器件安装用基板，密封的半导体器件
公开(公告)号：EP2626898A2
公开(公告)日：2013-08-14
申请号：EP13000601.8
申请日：2013-02-06
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shiobara, Toshio , Akiba, Hideki , Sekiguchi, Susumu
IPC分类号： H01L23/29 , H01L21/56
CPC分类号： H01L21/561 , B32B5/00 , B32B7/02 , B32B27/00 , H01L21/78 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L24/32 , H01L24/97 , H01L2224/29099 , H01L2224/32225 , H01L2924/10253 , H01L2924/15788 , H01L2924/181 , Y10T428/24942 , Y10T428/26 , Y10T428/269 , Y10T428/31504 , Y10T428/31511 , Y10T428/31663 , H01L2924/00014 , H01L2924/00
摘要： It is an object of the invention to provide a sealant laminated composite that is very high in versatility, even when a large diameter or thin substrate or wafer is sealed, can prevent the substrate or wafer from warping and the semiconductor devices from peeling, can collectively seal a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed on a wafer level, and can provide a sealant laminated composite that is excellent in the heat resistance and humidity resistance after sealing. A sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed includes: a support wafer; and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer.
摘要翻译：它是本发明的一个目的是提供一种密封剂层压的复合材料所做的是在通用性非常高，即使是当一个大的直径或薄基片或晶片被密封，能够防止翘曲的基片或晶片和半导体器件的剥离，可以共同密封在其上的半导体器件被安装或形成在其上的半导体器件的晶片的表面的半导体器件在晶片级形成的衬底的半导体装置的安装表面，并且可以提供一个密封剂层压的复合材料那样具有优异的耐热性和密封后的耐湿性。用于共同地密封半导体器件安装在其上的装置被安装或形成在其上的半导体器件被形成在晶片的表面上的半导体器件包括一个半导体衬底的表面的密封剂叠层复合：支撑晶片; 和未固化的树脂层构成形成在支撑晶片的一侧上的未固化的热固性树脂制成。

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