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1. 发明授权

EP2660591B1 Ultrasonic probe 有权
标题翻译：超声探头
公开(公告)号：EP2660591B1
公开(公告)日：2016-08-24
申请号：EP13166063.1
申请日：2013-04-30
申请人： Samsung Electronics Co., Ltd
发明人： Cho, Kyung Il , Lee, Seung Heun , Kim, Bae Hyung , Kim, Young Il , Song, Jong Keun
IPC分类号： G01N29/24 , B06B1/02 , G01N29/32 , H05K1/02
CPC分类号： H05K7/20336 , B06B1/0292 , G01N29/2406 , G01N29/326 , H05K1/0204 , H05K2201/064 , H05K2201/09072 , H05K2201/10598

2. 发明公开

EP2685255A3 Transducer module including curved surface frame, ultrasonic probe including transducer module, and method of producing curved surface frame 审中-公开
标题翻译：转换器模块与框架的弯曲表面，所述超声波探头与所述换能器模块和制造框架的弯曲表面的方法
公开(公告)号：EP2685255A3
公开(公告)日：2014-08-13
申请号：EP13175789.0
申请日：2013-07-09
申请人： Samsung Electronics Co., Ltd
发明人： Kim, Young Il , Kim, Bae Hyung , Song, Jong Keun , Lee, Seung Heun , Cho, Kyung Il
IPC分类号： G01N29/24 , B06B1/06 , G01N29/28 , G01S15/89
CPC分类号： G01N29/26 , B06B1/0622 , G01N29/2406 , G01N29/2456 , G01N29/28 , G01N2291/106 , G01N2291/2636 , G01N2291/2638 , G01S15/892
摘要： A transducer module includes a curved surface frame which is formed from a flexible material in a curved shape and includes a front surface and a rear surface; a transducer which is disposed on the front surface; and a support frame which is mounted on the rear surface and supports the curved surface frame.

3. 发明公开

EP2660591A1 Ultrasonic probe 有权
标题翻译：超声波探头
公开(公告)号：EP2660591A1
公开(公告)日：2013-11-06
申请号：EP13166063.1
申请日：2013-04-30
申请人： Samsung Electronics Co., Ltd
发明人： Cho, Kyung Il , Lee, Seung Heun , Kim, Bae Hyung , Kim, Young Il , Song, Jong Keun
IPC分类号： G01N29/24 , B06B1/02 , G01N29/32 , H05K1/02
CPC分类号： H05K7/20336 , B06B1/0292 , G01N29/2406 , G01N29/326 , H05K1/0204 , H05K2201/064 , H05K2201/09072 , H05K2201/10598
摘要： An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.
摘要翻译：提供了一种超声波探头，其中释放了与cMUT结合的集成电路中产生的热量。超声波探头包括被配置为产生超声波辐射的换能器，安装在换能器的后表面上的集成电路，安装在集成电路的后表面上并具有开口的印刷电路板，经由该开口，所述集成电路的后表面至少部分地暴露;散热器，其具有插入所述印刷电路板的所述开口中的突起并且被配置为吸收在所述集成电路中产生的热量;以及散热模块，其被配置为释放散热器向外部吸收的热量。

4. 发明授权

EP2639789B1 Multi-array ultrasonic probe apparatus and method for manufacturing multi-array probe apparatus 有权
标题翻译：用于制造多阵列探头设备多阵列超声波探头的装置和方法
公开(公告)号：EP2639789B1
公开(公告)日：2016-06-08
申请号：EP13159231.3
申请日：2013-03-14
申请人： Samsung Electronics Co., Ltd
发明人： Kim, Young Il , Kim, Dong Wook , Kim, Bae Hyung , Song, Jong Keun , Lee, Seung Heun , Cho, Kyung Il
IPC分类号： G10K11/00 , B06B1/02
CPC分类号： H04R1/00 , B06B1/0292 , G10K11/004 , H04R31/00 , Y10T29/49005

5. 发明公开

EP2860547A1 Apparatus and method for beamforming 审中-公开
标题翻译： Vorrichtung und Verfahren zur Strahlformung
公开(公告)号：EP2860547A1
公开(公告)日：2015-04-15
申请号：EP14188024.5
申请日：2014-10-08
申请人： Samsung Electronics Co., Ltd
发明人： Kim, Bae Hyung , Kim, Young Il , Song, Jong Keun , Lee, Seung Heun , Cho, Kyung Il
IPC分类号： G01S7/52 , G01S15/89 , G10K11/34
CPC分类号： A61B8/5207 , A61B8/14 , A61B8/4461 , A61B8/54 , G01S7/5202 , G01S7/52025 , G01S15/8915 , G01S15/8925 , G01S15/8927 , G10K11/346
摘要： Disclosed herein is a beamforming apparatus (200) for beamforming signals which are transmitted or received by a probe (100) which includes a plurality of transducer blocks (110, 120, 130, 140), each of which includes a plurality of transducers (111 - 143). The apparatus (200) includes a controller (210) configured to control components to delay signals to be transmitted by the plurality of transducers (111 - 143) included in each transducer block (110, 120, 130, 140) or signals received by the plurality of transducers (111 - 143) included in each transducer block (110, 120, 130, 140), and an analog beamformer (300) which includes a plurality of beamforming units (310, 320, 330, 340) which correspond to the respective transducer blocks (110, 120, 130, 140). The plurality of beamforming units (310, 320, 330, 340) is configured to perform analog beamforming on signals transmitted or received by the plurality of transducers (111 - 143) included in each transducer block (110, 120, 130, 140) based on a control signal which is received from the controller (210), to reduce a dynamic delay range, thereby reducing a size of a delay line.
摘要翻译：本文公开了一种用于波束成形信号的波束成形装置（200），其由包括多个换能器块（110,120,130,140）的探头（100）发送或接收，每个换能器块包括多个换能器（111 - 143）。装置（200）包括控制器（210），其被配置为控制部件以延迟要由包括在每个换能器块（110,120,130,140）中的多个换能器（111-143）发射的信号或由包括在每个换能器块（110,120,130,140）中的多个换能器（111-143）以及模拟波束形成器（300），其包括多个波束成形单元（310,320,330,340），其对应于各个换能器块（110,120,130,140）。多个波束形成单元（310,320,330,340）被配置为对由包括在每个换能器块（110,120,130,140）中的多个换能器（111-143）所发送或接收的信号执行模拟波束成形在从控制器（210）接收的控制信号上减少动态延迟范围，从而减小延迟线的大小。

6. 发明公开

EP2685255A2 Transducer module including curved surface frame, ultrasonic probe including transducer module, and method of producing curved surface frame 审中-公开
标题翻译：转换器模块与框架的弯曲表面，所述超声波探头与所述换能器模块和制造框架的弯曲表面的方法
公开(公告)号：EP2685255A2
公开(公告)日：2014-01-15
申请号：EP13175789.0
申请日：2013-07-09
申请人： Samsung Electronics Co., Ltd
发明人： Kim, Young Il , Kim, Bae Hyung , Song, Jong Keun , Lee, Seung Heun , Cho, Kyung Il
IPC分类号： G01N29/24 , B06B1/06 , G01N29/28
CPC分类号： G01N29/26 , B06B1/0622 , G01N29/2406 , G01N29/2456 , G01N29/28 , G01N2291/106 , G01N2291/2636 , G01N2291/2638 , G01S15/892
摘要： A transducer module includes a curved surface frame which is formed from a flexible material in a curved shape and includes a front surface and a rear surface; a transducer which is disposed on the front surface; and a support frame which is mounted on the rear surface and supports the curved surface frame.
摘要翻译：换能器模块包括曲面帧中的所有其由柔性材料形成为弯曲的形状，并且包括一个前表面和一个后表面; 的换能器的所有其前表面上处理完毕; 和支撑框架的所有其被安装在后表面上并支撑所述曲面框架上。

7. 发明公开

EP2639789A3 Multi-array ultrasonic probe apparatus and method for manufacturing multi-array probe apparatus 有权
标题翻译：用于制造多阵列探头设备多阵列超声波探头的装置和方法
公开(公告)号：EP2639789A3
公开(公告)日：2014-02-26
申请号：EP13159231.3
申请日：2013-03-14
申请人： Samsung Electronics Co., Ltd
发明人： Kim, Young Il , Kim, Dong Wook , Kim, Bae Hyung , Song, Jong Keun , Lee, Seung Heun , Cho, Kyung Il
IPC分类号： G10K11/00 , B06B1/02
CPC分类号： H04R1/00 , B06B1/0292 , G10K11/004 , H04R31/00 , Y10T29/49005
摘要： A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.

8. 发明公开

EP2639789A2 Multi-array ultrasonic probe apparatus and method for manufacturing multi-array probe apparatus 有权
标题翻译： Mehrfach-Array-Ultraschallsondenvorrichtung und Verfahren zum Herstellen der Mehrfach-Array-Sondenvorrichtung
公开(公告)号：EP2639789A2
公开(公告)日：2013-09-18
申请号：EP13159231.3
申请日：2013-03-14
申请人： Samsung Electronics Co., Ltd
发明人： Kim, Young Il , Kim, Dong Wook , Kim, Bae Hyung , Song, Jong Keun , Lee, Seung Heun , Cho, Kyung Il
IPC分类号： G10K11/00
CPC分类号： H04R1/00 , B06B1/0292 , G10K11/004 , H04R31/00 , Y10T29/49005
摘要： A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.
摘要翻译：多阵列型超声波探头装置包括发射和接收超声波束的n个瓦片; 以及具有n个引导部分的基板，分别安装有n个瓦片，以便以多阵列排列。多阵列超声波探头装置可以在相同的方向和相同的水平上对齐瓦片，以控制发送和接收要在瓦片上传输和接收的超声波束的方向和时间，从而提供稳定的超声波束。

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