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1. 发明授权

EP2669915B1 LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME AND PACKING UNIT 有权转让
标题翻译：层压芯片电子元件，安装板和包装单元的板
公开(公告)号：EP2669915B1
公开(公告)日：2017-06-28
申请号：EP12275125.8
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Ahn, Young Ghyu , Park, Sang Soo , Park, Min Cheol , Jeong, Se Hwa
IPC分类号： H01G4/00 , H01G4/30 , H01G4/005 , H05K1/02
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611

2. 发明授权

EP2827351B1 LAMINATED CERAMIC CHIP ELECTRONIC COMPONENT 有权转让
标题翻译： MEHRSCHICHTIGE KERAMISCHE ELEKTRONISCHE CHIP-KOMPONENT
公开(公告)号：EP2827351B1
公开(公告)日：2017-02-22
申请号：EP14174616.4
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Sang Soo , Park, Min Cheol , Jeong, Se Hwa
IPC分类号： H01G4/00 , H01G4/30 , H05K1/02 , H01G4/005
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611

3. 发明公开

EP2827351A1 Laminated chip electronic component and board for mounting the laminated component 有权转让
标题翻译： MEHRSCHICHTIGE KERAMISCHE ELEKTRONISCHE CHIP-KOMPONENT
公开(公告)号：EP2827351A1
公开(公告)日：2015-01-21
申请号：EP14174616.4
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Sang Soo , Park, Min Cheol , Jeong, Se Hwa
IPC分类号： H01G4/00 , H01G4/30 , H05K1/02 , H01G4/005
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611
摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer. A laminated chip electronic component comprising a ceramic body including internal electrodes and dielectric layers forming an active layer, external electrodes formed to cover both end portions of the ceramic body in a length direction and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer, wherein when half of a thickness of the ceramic body is defined as A, a thickness of the lower cover layer is defined as B, half of a thickness of the active layer is defined as C, and a thickness of the upper cover layer is defined as D, a ratio (B+C) /A in which a central portion of the active layer deviates from a central portion of the ceramic body satisfies a range of 1.063 smaller or equal (B+C)/A smaller or equal 1.745. The problem to be solved being to form a laminated ceramic capacitor with asymmetric thickness cover layers to suppress squeal or noise. The solution being too makes the lover cover greater than the upper cover.
摘要翻译：层叠芯片电子部件包括：陶瓷体，包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的外部电极; 其中内部电极以相对的方式设置在其间插入介电层的有源层以形成电容; 以及在所述有源层的厚度方向的上部和下部形成的上下层，所述下覆盖层的厚度大于所述上覆盖层的厚度。一种层叠芯片电子部件，包括：陶瓷体，其包括形成有源层的内部电极和电介质层，形成为覆盖陶瓷体的长度方向的两端部的外部电极和形成在所述陶瓷体的上部和下部的上部和下部覆盖层所述下覆盖层的厚度大于所述上覆盖层的厚度，其中当所述陶瓷体的厚度的一半被定义为A时，所述下覆盖层的厚度被定义为B，活性层的厚度的一半被定义为C，上覆盖层的厚度定义为D，活性层的中心部分偏离中心部分的比率（B + C）/ A 陶瓷体满足1.063或更小（B + C）/ A的范围小于或等于1.745。要解决的问题是形成具有不对称厚度覆盖层的层压陶瓷电容器，以抑制尖叫或噪音。该解决方案也使得情人的盖子大于上盖。

4. 发明公开

EP2669915A1 Laminated chip electronic component, board for mounting the same, and packing unit thereof 有权转让
标题翻译： MEHRSCHICHTIGE ELEKTRONISCHE CHIP-KOMPONENTE，PLATINE ZU DEREN MONTAGE UND VERPACKUNGSEINHEITDAFÜR
公开(公告)号：EP2669915A1
公开(公告)日：2013-12-04
申请号：EP12275125.8
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Sang Soo , Park, Min Cheol , Jeong, Se Hwa
IPC分类号： H01G4/00
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611
摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.
摘要翻译：层叠芯片电子部件包括：陶瓷体，包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的外部电极; 其中内部电极以相对的方式设置在其间插入介电层的有源层以形成电容; 以及在所述有源层的厚度方向的上部和下部形成的上下层，所述下覆盖层的厚度大于所述上覆盖层的厚度。

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