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1. 发明授权

EP2827351B1 LAMINATED CERAMIC CHIP ELECTRONIC COMPONENT 有权转让
标题翻译： MEHRSCHICHTIGE KERAMISCHE ELEKTRONISCHE CHIP-KOMPONENT
公开(公告)号：EP2827351B1
公开(公告)日：2017-02-22
申请号：EP14174616.4
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Sang Soo , Park, Min Cheol , Jeong, Se Hwa
IPC分类号： H01G4/00 , H01G4/30 , H05K1/02 , H01G4/005
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611

2. 发明公开

EP2688074A1 Magnetic module for power inductor, power inductor, and manufacturing method thereof 失效转让
标题翻译： Strominduktor，Strominduktor und Herstellungsverfahrendafür
公开(公告)号：EP2688074A1
公开(公告)日：2014-01-22
申请号：EP13275063.9
申请日：2013-03-14
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Park, Sang Soo , Ahn, Young Ghyu , Park, Jung Min , Park, Min Cheol
IPC分类号： H01F17/00 , H01F41/04
CPC分类号： H01F5/00 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F41/04 , H01F41/046 , Y10T29/4902
摘要： There is provided a power inductor including: a main body; and first and second external electrodes formed on both end portions of the main body, wherein the main body includes : upper and lower cover layers; at least one coil support layer having a through hole formed in a center thereof, at least one first recess portion formed in both lateral surfaces thereof and a plurality of second recess portions formed in respective corners thereof, and disposed between the upper and lower cover layers; and first and second coil layers formed on both surfaces of the coil support layer and having respective one ends thereof connected to the first and second external electrodes.
摘要翻译：提供了一种功率电感器，包括：主体; 以及形成在主体的两个端部上的第一外部电极和第二外部电极，其中主体包括：上部和下部覆盖层; 至少一个线圈支撑层，其中心形成有通孔，形成在其两个侧面上的至少一个第一凹部和形成在其各个角部的多个第二凹部，并且设置在上盖层和下盖层之间 ; 并且形成在线圈支撑层的两个表面上并且其相应的一端连接到第一和第二外部电极的第一和第二线圈层。

3. 发明授权

EP2669914B1 LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME AND PACKING UNIT THEREOF 有权
标题翻译：多层电子芯片元件，PLATTINE用于组装和封装THEREOF
公开(公告)号：EP2669914B1
公开(公告)日：2016-05-11
申请号：EP12275123.3
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Min Cheol , Kim, Doo Young , Park, Sang Soo
IPC分类号： H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , H05K1/18 , B65B15/04 , B65B9/04
CPC分类号： H01G4/30 , B65B9/04 , B65B15/04 , H01G2/065 , H01G4/012 , H01G4/12 , H05K1/181 , H05K2201/10015

4. 发明公开

EP2827351A1 Laminated chip electronic component and board for mounting the laminated component 有权转让
标题翻译： MEHRSCHICHTIGE KERAMISCHE ELEKTRONISCHE CHIP-KOMPONENT
公开(公告)号：EP2827351A1
公开(公告)日：2015-01-21
申请号：EP14174616.4
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Sang Soo , Park, Min Cheol , Jeong, Se Hwa
IPC分类号： H01G4/00 , H01G4/30 , H05K1/02 , H01G4/005
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611
摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer. A laminated chip electronic component comprising a ceramic body including internal electrodes and dielectric layers forming an active layer, external electrodes formed to cover both end portions of the ceramic body in a length direction and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer, wherein when half of a thickness of the ceramic body is defined as A, a thickness of the lower cover layer is defined as B, half of a thickness of the active layer is defined as C, and a thickness of the upper cover layer is defined as D, a ratio (B+C) /A in which a central portion of the active layer deviates from a central portion of the ceramic body satisfies a range of 1.063 smaller or equal (B+C)/A smaller or equal 1.745. The problem to be solved being to form a laminated ceramic capacitor with asymmetric thickness cover layers to suppress squeal or noise. The solution being too makes the lover cover greater than the upper cover.
摘要翻译：层叠芯片电子部件包括：陶瓷体，包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的外部电极; 其中内部电极以相对的方式设置在其间插入介电层的有源层以形成电容; 以及在所述有源层的厚度方向的上部和下部形成的上下层，所述下覆盖层的厚度大于所述上覆盖层的厚度。一种层叠芯片电子部件，包括：陶瓷体，其包括形成有源层的内部电极和电介质层，形成为覆盖陶瓷体的长度方向的两端部的外部电极和形成在所述陶瓷体的上部和下部的上部和下部覆盖层所述下覆盖层的厚度大于所述上覆盖层的厚度，其中当所述陶瓷体的厚度的一半被定义为A时，所述下覆盖层的厚度被定义为B，活性层的厚度的一半被定义为C，上覆盖层的厚度定义为D，活性层的中心部分偏离中心部分的比率（B + C）/ A 陶瓷体满足1.063或更小（B + C）/ A的范围小于或等于1.745。要解决的问题是形成具有不对称厚度覆盖层的层压陶瓷电容器，以抑制尖叫或噪音。该解决方案也使得情人的盖子大于上盖。

5. 发明公开

EP2669915A1 Laminated chip electronic component, board for mounting the same, and packing unit thereof 有权转让
标题翻译： MEHRSCHICHTIGE ELEKTRONISCHE CHIP-KOMPONENTE，PLATINE ZU DEREN MONTAGE UND VERPACKUNGSEINHEITDAFÜR
公开(公告)号：EP2669915A1
公开(公告)日：2013-12-04
申请号：EP12275125.8
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Sang Soo , Park, Min Cheol , Jeong, Se Hwa
IPC分类号： H01G4/00
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611
摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.
摘要翻译：层叠芯片电子部件包括：陶瓷体，包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的外部电极; 其中内部电极以相对的方式设置在其间插入介电层的有源层以形成电容; 以及在所述有源层的厚度方向的上部和下部形成的上下层，所述下覆盖层的厚度大于所述上覆盖层的厚度。

6. 发明授权

EP2688074B1 Magnetic module for power inductor, power inductor, and manufacturing method thereof 失效转让
公开(公告)号：EP2688074B1
公开(公告)日：2018-08-01
申请号：EP13275063.9
申请日：2013-03-14
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Park, Sang Soo , Ahn, Young Ghyu , Park, Jung Min , Park, Min Cheol
IPC分类号： H01F17/00 , H01F41/04
CPC分类号： H01F5/00 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F41/04 , H01F41/046 , Y10T29/4902
摘要： There is provided a power inductor including: a main body; and first and second external electrodes formed on both end portions of the main body, wherein the main body includes : upper and lower cover layers; at least one coil support layer having a through hole formed in a center thereof, at least one first recess portion formed in both lateral surfaces thereof and a plurality of second recess portions formed in respective corners thereof, and disposed between the upper and lower cover layers; and first and second coil layers formed on both surfaces of the coil support layer and having respective one ends thereof connected to the first and second external electrodes.

7. 发明授权

EP2669915B1 LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME AND PACKING UNIT 有权转让
标题翻译：层压芯片电子元件，安装板和包装单元的板
公开(公告)号：EP2669915B1
公开(公告)日：2017-06-28
申请号：EP12275125.8
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Ahn, Young Ghyu , Park, Sang Soo , Park, Min Cheol , Jeong, Se Hwa
IPC分类号： H01G4/00 , H01G4/30 , H01G4/005 , H05K1/02
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611

8. 发明授权

EP2819134B1 Laminated chip electronic component, board for mounting the same, and packing unit thereof 有权
标题翻译：多层电子芯片元件板到它的装配和包装单元及其
公开(公告)号：EP2819134B1
公开(公告)日：2016-08-17
申请号：EP14174610.7
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Min Cheol , Kim, Doo Young , Park, Sang Soo
IPC分类号： B65B9/04 , H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , B65B15/04 , H05K1/18
CPC分类号： H01G4/30 , B65B9/04 , B65B15/04 , H01G2/065 , H01G4/012 , H01G4/12 , H05K1/181 , H05K2201/10015

9. 发明公开

EP2669914A1 Laminated chip electronic component, board for mounting the same, and packing unit thereof 有权
标题翻译： MEHRSCHICHTIGE ELEKTRONISCHE CHIP-KOMPONENTE，PLATTINE ZU DEREN MONTAGE UND VERPACKUNGSEINHEITDAFÜR
公开(公告)号：EP2669914A1
公开(公告)日：2013-12-04
申请号：EP12275123.3
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Min Cheol , Kim, Doo Young , Park, Sang Soo
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , B65B9/04 , B65B15/04 , H01G2/065 , H01G4/012 , H01G4/12 , H05K1/181 , H05K2201/10015
摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; first and second external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; and additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer.
摘要翻译：层叠芯片电子部件包括：陶瓷体，包括内部电极和电介质层; 第一和第二外部电极，其形成为在长度方向上覆盖陶瓷体的两端部; 其中内部电极以相对的方式设置在其间插入介电层的有源层以形成电容; 上下层形成在有源层的厚度方向的上部和下部上，下覆盖层的厚度大于上覆盖层的厚度; 以及附加的电极层，与下覆盖层内的电容的形成无关。

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