专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

EP2719497B1 PRINTING METHOD BY SOLDER PASTE 失效
标题翻译：用锡膏印刷的方法
公开(公告)号：EP2719497B1
公开(公告)日：2017-07-26
申请号：EP12799838.3
申请日：2012-06-08
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： OKADA Sakie
IPC分类号： B23K35/363 , B23K3/06 , B23K35/22 , H05K3/34 , B23K101/42 , B23K1/00 , B23K3/08 , B23K35/02 , H05K3/12 , B23K35/36 , B23K35/362
CPC分类号： B23K1/0016 , B23K3/0638 , B23K3/082 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/3612 , B23K35/3613 , B23K35/362 , B23K2201/42 , C22C13/00 , H05K3/04 , H05K3/1233 , H05K3/3484 , H05K3/4007 , H05K2203/0139 , H05K2203/085

2. 发明公开

EP2719497A1 SOLDER PASTE 失效
标题翻译： VERFAHREN ZUM DRUCKEN VONLÖTPASTE
公开(公告)号：EP2719497A1
公开(公告)日：2014-04-16
申请号：EP12799838.3
申请日：2012-06-08
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： OKADA Sakie
IPC分类号： B23K35/363 , B23K3/06 , B23K35/22 , H05K3/34 , B23K101/42
CPC分类号： B23K1/0016 , B23K3/0638 , B23K3/082 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/3612 , B23K35/3613 , B23K35/362 , B23K2201/42 , C22C13/00 , H05K3/04 , H05K3/1233 , H05K3/3484 , H05K3/4007 , H05K2203/0139 , H05K2203/085
摘要： To provide solder paste that can be filled in minute apertures.
The solder paste that is printed on a substrate through a mask member in which apertures are formed is supplied to the apertures of the mask member under decompression pressure and has a viscosity so that the solder paste is filled in the apertures under atmospheric pressure. It is preferable that the solder paste has a viscosity of 50 through 150 Pa.s and a thixotropic ratio of 0.3 through 0.5. Further, the solder paste is obtained by mixing a flux containing solvent having a boiling point such that volatilization thereof is suppressed under the decompression pressure and solder powders. It is preferable that in the flux, the solvent having the boiling point of 240 °C or more is used and the solvent is octanediol.
摘要翻译：提供可以填充微小孔径的焊膏。通过形成有孔的掩模构件在基板上印刷的焊膏在减压下供给到掩模构件的孔，并且具有粘度，使得焊膏填充在大气压下的孔中。焊膏的粘度优选为50〜150Pa·s，触变比为0.3〜0.5。此外，通过混合具有在减压下抑制其挥发的沸点的溶剂的助熔剂和焊料粉末来获得焊膏。在助熔剂中，优选使用沸点为240℃以上的溶剂，溶剂是辛二醇。

3. 发明公开

EP4015138A1 FLUX AND SOLDER PASTE 有权
公开(公告)号：EP4015138A1
公开(公告)日：2022-06-22
申请号：EP20870464.3
申请日：2020-08-28
申请人： Senju Metal Industry Co., Ltd.
发明人： UKAI Ryuji , OHTA Kengo , OKADA Sakie , KITAZAWA Kazuya
IPC分类号： B23K35/363 , B23K35/26 , C22C11/06 , C22C13/00
摘要： The present invention relates to a flux including rosin, an active agent, a solvent, a thixotropic agent containing polyethyleneglycol, and a solder powder, wherein the polyethyleneglycol content is 10 to 20% by mass with respect to the total mass of the flux, and the thixotropic agent content excluding the polyethyleneglycol is no greater than 5% by mass with respect to the total mass of the flux.

4. 发明授权

EP2682221B1 FLUX 有权
公开(公告)号：EP2682221B1
公开(公告)日：2015-12-30
申请号：EP12752792.7
申请日：2012-02-28
申请人： Senju Metal Industry Co., Ltd
发明人： OKADA Sakie , KOROKI Motoki , ISEKI Hiroaki , ITOYAMA Taro
IPC分类号： B23K35/363 , B23K35/02 , B23K35/26 , B23K35/362 , B23K35/36
CPC分类号： B23K35/362 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3616 , B23K35/3618

5. 发明公开

EP2682221A1 FLUX 有权
公开(公告)号：EP2682221A1
公开(公告)日：2014-01-08
申请号：EP12752792.7
申请日：2012-02-28
申请人： Senju Metal Industry Co., Ltd
发明人： OKADA Sakie , KOROKI Motoki , ISEKI Hiroaki , ITOYAMA Taro
IPC分类号： B23K35/363
CPC分类号： B23K35/362 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3616 , B23K35/3618
摘要： To provide flux for producing solder paste, viscosity of which is prevented from varying.
In the flux which is mixed with solder powder to produce the solder paste, an amount of methacrylate polymer which reduces a thixotropic index of the solder paste and enhances viscosity thereof is contained. As the methacrylate polymer, polyalkyl methacrylate having an alkyl group is preferable and it is preferable that an addition amount of polyalkyl methacrylate is 0.5-5.0 mass% thereof. Further, as the thixotropic agent, hardened castor oil is preferably added.
摘要翻译：为了提供用于生产焊膏的焊剂，防止其粘度变化。在与焊料粉末混合以生产焊膏的助熔剂中，包含降低焊膏的触变指数并提高其粘度的甲基丙烯酸酯聚合物的量。作为甲基丙烯酸酯聚合物，优选具有烷基的聚甲基丙烯酸烷基酯，并且聚甲基丙烯酸烷基酯的添加量优选为0.5〜5.0质量％。另外，作为触变剂，优选添加硬化蓖麻油。

6. 发明公开

EP2682220A1 FLUX 审中-公开
公开(公告)号：EP2682220A1
公开(公告)日：2014-01-08
申请号：EP12752393.4
申请日：2012-02-28
申请人： Senju Metal Industry Co., Ltd
发明人： OKADA Sakie , KOROKI Motoki , ISEKI Hiroaki , ITOYAMA Taro
IPC分类号： B23K35/363
CPC分类号： B23K35/3613 , B23K35/0244 , B23K35/025 , B23K35/3601 , B23K35/362
摘要： To provide flux which has a property of suppression of sedimentation of the solder powder, dissolves by heating at the time of the soldering to remain no residue and does not block any wettability of the solder.
In the flux which is mixed with solder powder to produce the solder paste, an amount of methacrylate polymer which suppresses of sedimentation of the solder powder at a normal temperature range and dissolves or vaporizes during a heating course at the time of the soldering. As the methacrylate polymer, polyalkyl methacrylate having an alkyl group is preferable and it is preferable that an addition amount of polyalkyl methacrylate is not less than 0.1 mass% through less than 1.0 mass%. It is also preferable to contain further a solvent having at least three OH groups.
摘要翻译：为了提供具有抑制焊料粉末沉降性能的焊剂，在焊接时通过加热而溶解，从而不残留焊剂，并且不会阻碍焊料的润湿性。在与焊料粉末混合以产生焊膏的助熔剂中，一定量的甲基丙烯酸酯聚合物在焊接时在加热过程中抑制钎料粉末在常温范围内的沉降并且溶解或汽化。作为甲基丙烯酸酯聚合物，优选具有烷基的聚甲基丙烯酸烷基酯，并且优选聚甲基丙烯酸烷基酯的添加量不小于0.1质量％至不足1.0质量％。还优选进一步含有具有至少三个OH基团的溶剂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式