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1. 发明公开

EP4067854A3 PRESSURE SENSOR 审中-实审
公开(公告)号：EP4067854A3
公开(公告)日：2023-01-04
申请号：EP22165418.9
申请日：2022-03-30
申请人： ROSEMOUNT AEROSPACE INC.
发明人： POTASEK, David P. , JONSSON, Ulf J.
IPC分类号： G01L19/00 , G01L19/06
摘要： A pressure sensor includes a housing (20), an isolator (26) positioned at a first end (22) of the housing, and a first cavity (28) formed between the first end of the housing and the isolator. The pressure sensor further includes a second cavity (42) formed in the housing and a channel (48) with a first end (50) fluidly connected to the first cavity and a second end (52) fluidly coupled to the second cavity. A pressure sensor chip (62) is positioned in the second cavity and includes a first diaphragm (68) positioned at a top side of the pressure sensor chip laterally outwards from the second end of the channel.

2. 发明公开

EP4067854A2 PRESSURE SENSOR 审中-实审
公开(公告)号：EP4067854A2
公开(公告)日：2022-10-05
申请号：EP22165418.9
申请日：2022-03-30
申请人： ROSEMOUNT AEROSPACE INC.
发明人： POTASEK, David P. , JONSSON, Ulf J.
IPC分类号： G01L19/00 , G01L19/06
摘要： A pressure sensor includes a housing (20), an isolator (26) positioned at a first end (22) of the housing, and a first cavity (28) formed between the first end of the housing and the isolator. The pressure sensor further includes a second cavity (42) formed in the housing and a channel (48) with a first end (50) fluidly connected to the first cavity and a second end (52) fluidly coupled to the second cavity. A pressure sensor chip (62) is positioned in the second cavity and includes a first diaphragm (68) positioned at a top side of the pressure sensor chip laterally outwards from the second end of the channel.

3. 发明公开

EP3315935A2 MEMS SENSOR WITH ELECTRONICS INTEGRATION 审中-公开
标题翻译：具有电子集成的MEMS传感器
公开(公告)号：EP3315935A2
公开(公告)日：2018-05-02
申请号：EP17198026.1
申请日：2017-10-24
申请人： Rosemount Aerospace Inc.
发明人： POTASEK, David P.
IPC分类号： G01L9/00 , G01L19/14
CPC分类号： B81C3/001 , B81B3/0021 , B81B2201/0264 , B81B2207/012 , B81B2207/07 , B81C2201/013 , B81C2201/019 , B81C2203/0172 , G01L9/0042 , G01L19/148
摘要： A MEMS device with electronics integration places integrated circuit components on a topping wafer (120A) of a sensing die to conserve space, minimize errors and reduce cost of the device as a whole. The topping wafer is bonded to a sensing wafer (118) and secured in a housing (138).
摘要翻译：具有电子集成的MEMS器件将集成电路组件放置在感测芯片的顶部晶片（120A）上以节省空间，最小化错误并降低器件整体的成本。顶部晶片结合到感测晶片（118）并固定在壳体（138）中。

4. 发明公开

EP3196617A1 MEMS PRESSURE SENSOR WITH MODIFIED CAVITY TO IMPROVE BURST PRESSURE 无效
标题翻译：带改性腔的MEMS压力传感器改善爆破压力
公开(公告)号：EP3196617A1
公开(公告)日：2017-07-26
申请号：EP17150950.8
申请日：2017-01-11
申请人： Rosemount Aerospace Inc.
发明人： ZHANG, Weibin , POTASEK, David P.
IPC分类号： G01L9/00 , G01L19/06
CPC分类号： B81B3/0021 , B81B2203/0127 , B81C1/00158 , B81C2201/0132 , B81C2201/0133 , G01L9/0048 , G01L19/0618
摘要： A method for producing a silicon based MEMS pressure sensor includes forming a cavity in a first (100) surface of a silicon wafer with first and second parallel (100) surfaces wherein the angle between the walls of the first cavity and the first (100) surface where they intersect the first (100) surface are greater than 90 degrees and the remaining material between the bottom of the cavity and the second parallel (100) surface comprises a flexible diaphragm. The method also includes forming a backing wafer, having a through hole, and bonding the silicon wafer to the backing wafer such that the hole in the backing wafer matches up with the cavity in the second side of the (100) silicon wafer. A dielectric layer is formed on the second side of the (100) silicon wafer and a sensing element is formed on the dielectric layer to detect pressure induced deflection of the silicon diaphragm.
摘要翻译：一种用于制造硅基MEMS压力传感器的方法包括：在具有第一和第二平行（100）表面的硅晶片的第一（100）表面中形成空腔，其中第一空腔的壁和第一（100）它们与第一（100）表面相交的表面大于90度，并且腔体的底部和第二平行（100）表面之间的剩余材料包括柔性隔膜。该方法还包括形成具有通孔的背衬晶片，并且将硅晶片结合到背衬晶片，使得背衬晶片中的孔与（100）硅晶片的第二侧中的空腔匹配。在（100）硅晶片的第二侧上形成介电层，并且在介电层上形成感测元件以检测硅膜的压力引起的偏转。

5. 发明公开

EP3772641A1 THERMALLY-MATCHED PIEZORESISTIVE ELEMENTS IN BRIDGES 有权
公开(公告)号：EP3772641A1
公开(公告)日：2021-02-10
申请号：EP19215614.9
申请日：2019-12-12
申请人： ROSEMOUNT AEROSPACE INC.
发明人： POTASEK, David P. , BACKMAN, Roger Alan
IPC分类号： G01L9/00 , G01L9/06 , G01L19/04
摘要： A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.

6. 发明公开

EP3392194A3 APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS 审中-公开
公开(公告)号：EP3392194A3
公开(公告)日：2019-01-09
申请号：EP18167588.5
申请日：2018-04-16
申请人： Rosemount Aerospace Inc.
发明人： GOLDEN, Jim , POTASEK, David P. , CHILDRESS, Marcus Allen
IPC分类号： B81C99/00
摘要： A method of testing sensors (40) includes providing a test sheet (60) that includes a plurality of sensor assemblies (18), a plurality of test pads (64), and traces (66) extending from the sensor assemblies (18) to the plurality of test pads (64). A sensor (40) is positioned on each sensor assembly (18). Each sensor (40) is connected to the sensor assembly (18) with wire bonds (44A, 44B). An enclosure (60) is formed over the plurality of sensor assemblies (18). An electrical signal is detected from each of the plurality of sensor assemblies (18) at the test pads (64).

7. 发明公开

EP3364165A3 PIEZORESISTIVE SENSOR WITH SPRING FLEXURES FOR STRESS ISOLATION 有权
公开(公告)号：EP3364165A3
公开(公告)日：2018-12-26
申请号：EP18152565.0
申请日：2018-01-19
申请人： Rosemount Aerospace Inc.
发明人： GOLLY, Timothy Thomas , POTASEK, David P. , HUYNH, Cuong Tho
IPC分类号： G01L9/00 , G01L19/14
摘要： A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.

8. 发明公开

EP3321655A1 ALL SILICON CAPACITIVE PRESSURE SENSOR 有权
标题翻译：全硅电容式压力传感器
公开(公告)号：EP3321655A1
公开(公告)日：2018-05-16
申请号：EP17201370.8
申请日：2017-11-13
申请人： Rosemount Aerospace Inc.
发明人： POTASEK, David P. , HOULIHAN, Sean
IPC分类号： G01L9/00
CPC分类号： B81B3/0086 , B81B3/0081 , B81B2201/0264 , B81B2207/07 , B81C1/00269 , B81C2201/013 , B81C2201/014 , G01L9/0047 , G01L9/0073
摘要： A configuration for a capacitive pressure sensor uses a silicon on insulator wafer to create an electrically isolated sensing node across a gap from a pressure sensing wafer. The electrical isolation, small area of the gap, and silicon material throughout the capacitive pressure sensor allow for minimal parasitic capacitance and avoid problems associated with thermal mismatch.
摘要翻译：用于电容式压力传感器的配置使用绝缘体上硅晶片来跨压力感测晶片的间隙形成电隔离感测节点。整个电容式压力传感器的电气隔离，间隙的小面积和硅材料允许最小的寄生电容并避免与热失配相关的问题。

9. 发明公开

EP3205998A1 OPEN DIAPHRAGM HARSH ENVIRONMENT PRESSURE SENSOR 有权
标题翻译：开放式隔膜环境压力传感器
公开(公告)号：EP3205998A1
公开(公告)日：2017-08-16
申请号：EP17155350.6
申请日：2017-02-09
申请人： Rosemount Aerospace Inc.
发明人： POTASEK, David P. , LITTLE, Charles , ZHANG, Weibin
IPC分类号： G01L19/14 , G01L19/06
CPC分类号： G01L19/0645 , G01L9/0052 , G01L9/0072 , G01L19/0618 , G01L19/146 , G01L19/147
摘要： A pressure sensor comprising a housing (62, 64), a diaphragm wafer (68), and an isolator (66) configured to absorb lateral stress. The diaphragm wafer (68) includes a fully exposed diaphragm (69), a fluid contact surface, a sensing element (74), and a support portion, where the support portion and the contact surface define a cavity. The isolator (66) extends laterally from the support portion to the housing (62, 64). The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm (69) can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.
摘要翻译：一种压力传感器，包括壳体（62,64），隔膜晶片（68）和构造成吸收侧向应力的隔离器（66）。隔膜晶片（68）包括完全暴露的隔膜（69），流体接触表面，感测元件（74）和支撑部分，其中支撑部分和接触表面限定了空腔。隔离器（66）从支撑部分横向延伸到壳体（62,64）。压力传感器很容易排空，消除了微粒的积聚，膜片（69）可以直接引线键合到印刷电路板上，从而不需要大量的电气馈通。

10. 发明公开

EP3095756A1 PRESSURE SENSOR PACKAGE WITH STRESS ISOLATION FEATURES 有权
标题翻译： DRUCKSENSORGEHÄUSEMIT BELASTUNGSISOLIERUNGSMERKMALEN
公开(公告)号：EP3095756A1
公开(公告)日：2016-11-23
申请号：EP16170089.3
申请日：2016-05-18
申请人： Rosemount Aerospace Inc.
发明人： POTASEK, David P. , STUELKE, Robert
IPC分类号： B81B7/00
CPC分类号： B81B7/0058 , B81B7/0048 , B81B2207/015 , H01L2224/48247
摘要： A sensor package (100) includes a manifold (102) and a MEMS die (104). The manifold (102) includes a cylindrical body (106), a flange (110), and a mounting surface (120). The cylindrical body (106) defines a first passage (112) that extends longitudinally along a central axis from a first exterior end (114) to an interior end (116) of the cylindrical body (106). The flange (110) extends from the cylindrical body (106) and has an outer periphery that is configured to support a print circuit board (126). The mounting surface (120) is disposed at the interior end (116) of the first passage (112). The surface area of the mounting surface (120) is less than the surface area of a MEMS die (104) configured to mate with the mounting surface (120).
摘要翻译：传感器封装（100）包括歧管（102）和MEMS管芯（104）。歧管（102）包括圆柱体（106），凸缘（110）和安装表面（120）。圆柱体（106）限定第一通道（112），其沿着中心轴线从第一外端（114）纵向延伸到圆柱形本体（106）的内端（116）。凸缘（110）从圆柱体（106）延伸并且具有被配置为支撑印刷电路板（126）的外周边。安装表面（120）设置在第一通道（112）的内端（116）处。安装表面（120）的表面积小于构造成与安装表面（120）配合的MEMS管芯（104）的表面积。

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