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    • 2. 发明公开
    • SWITCH MODE POWER SUPPLY (SMPS) AND METHODS THEREOF
    • SCHALTNETZTEIL UND VERFAHRENDAFÜR
    • EP2193598A1
    • 2010-06-09
    • EP08833765.4
    • 2008-09-24
    • QUALCOMM Incorporated
    • MOK, Ken Tsz KinGAGNE, Justin Joseph Rosen
    • H02M3/157
    • H02M3/157H02M2001/0019H02M2003/1566
    • Embodiments of the present invention are directed to switched-mode power supply (SMPS) circuits and methods thereof. The SMPS circuit receives information related to a future load change. For example, the information may be received at a decoder (e.g., a serial bus interface (SBI) decoder) from a microprocessor or microcontroller, such as a mobile station modem (MSM). The SMPS circuit may include an analog-to-digital converter configured to sample an output voltage of the SMPS circuit to determine a time when the future load change occurs. The SMPS circuit may further include a transient recovery circuit (TRC) for stabilizing the output voltage based on the received information when the future load change occurs. For example, the TRC calculates a duty cycle used to transition states of switches of the SMPS circuit to compensate for the future load change.
    • 本发明的实施例涉及开关电源(SMPS)电路及其方法。 SMPS电路接收与未来负载变化相关的信息。 例如,可以在诸如移动台调制解调器(MSM)的微处理器或微控制器的解码器(例如,串行总线接口(SBI)解码器)处接收信息。 SMPS电路可以包括被配置为对SMPS电路的输出电压进行采样以确定发生未来负载变化的时间的模拟 - 数字转换器。 SMPS电路还可以包括瞬态恢复电路(TRC),用于当未来的负载变化发生时基于所接收的信息稳定输出电压。 例如,TRC计算用于转换SMPS电路的开关状态的占空比,以补偿未来的负载变化。
    • 3. 发明公开
    • SYSTEM AND METHOD OF SILICON SWITCHED POWER DELIVERY USING A PACKAGE
    • 系统在维也纳FÜRSILIZIUMGESCHALTETE LEISTUNGSZUFUHR MITTELSGEHÄUSE
    • EP2025060A2
    • 2009-02-18
    • EP07797397.2
    • 2007-05-09
    • Qualcomm Incorporated
    • CHUA-EOAN, Lew G.TOMS, Thomas R.ANDREEV, Boris DimitrovGAGNE, Justin Joseph RosenSHI, Chunlei
    • H03K19/00
    • H03K17/223H01L2924/0002H01L2924/00
    • In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first pin, a second pin, and metallization coupling the first pin to the second pin. The substrate is coupled to the package via the first pin and the second pin. The substrate includes a plurality of power domains and a power control unit. The second pin of the package is coupled to a particular power domain of the plurality of power domains. The power control unit includes logic and a switch, where the switch includes a first terminal coupled to a voltage supply terminal, a control terminal coupled to the logic, and a second terminal coupled to the first pin of the package. The logic selectively activates the switch to distribute power to the particular power domain via the metallization of the package.
    • 在一个特定实施例中,集成电路包括电气和物理耦合到封装的封装和衬底。 封装包括第一引脚,第二引脚和将第一引脚耦合到第二引脚的金属化。 衬底经由第一引脚和第二引脚耦合到封装。 基板包括多个电力域和功率控制单元。 封装的第二引脚耦合到多个电源域的特定电源域。 功率控制单元包括逻辑和开关,其中开关包括耦合到电压源端子的第一端子,耦合到逻辑电路的控制端子和耦合到封装的第一引脚的第二端子。 该逻辑选择性地激活开关以通过封装的金属化将功率分配给特定的功率域。