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    • 3. 发明授权
    • POLYCYCLOOLEFIN POLYMERIC COMPOSITIONS FOR SEMICONDUCTOR APPLICATIONS
    • 用于半导体应用的聚环烯烃聚合物组合物
    • EP1791888B1
    • 2009-03-25
    • EP05786286.4
    • 2005-08-17
    • Promerus, LLC
    • RAVIKIRAN, RamakrishaNG, HendraPUTHENKOVILAKOM, Rajesh, RajaZHANG, LindaAMOROSO, DinoKNAPP, BrianBELL, AndrewRHODES, Larry, F.
    • C08G61/08
    • C08K5/0091C08G61/06C08K3/36C08K5/5425C08L65/00C08L45/00
    • Polymeric compositions for semiconductor applications comprising 10 to 99 wt.% of norbornene-type cycloolefin monomers represented by one or more of Formulae I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt.% of an addition polymerization procatalyst, and optionally: up to 0.5 wt.% of a cocatalyst, up to 59 wt.% of a crosslinking monomer, up to 50 wt.% of a viscosifier, up to 20 wt.% of a thixotropic additive(s), up to 80 wt.% of a filler, up to 10 wt.% of an antioxidant, and up to 0.6 wt.% of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.
    • 用于半导体应用的聚合物组合物包含10至99重量%由式I(a),I(b)和任选的I(c)和/或I(d)中的一种或多种表示的降冰片烯型环烯烃单体,0.0005 至0.5重量%的加成聚合前催化剂,和任选地:至多0.5重量%的助催化剂,至多59重量%的交联单体,至多50重量%的增粘剂,至多20重量% %的触变添加剂,至多80重量%的填充剂,至多10重量%的抗氧化剂和至多0.6重量%的抗氧化剂增效剂,所述制剂的组分总量加入 高达100%。 这样的配方被大量聚合或固化以形成具有多种特定电子,微电子,光电子和微光电子应用所需性能的聚合物组合物,例如管芯粘合剂,底部填充材料,预浸料粘合剂,密封剂,保护层和 其他相关应用。