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1. 发明公开

EP3258752A1 METHOD FOR FORMING LAMINATED CIRCUIT BOARD, AND LAMINATED CIRCUIT BOARD FORMED USING SAME 审中-公开
标题翻译：形成层压电路板的方法以及使用相同形式形成的层压电路板
公开(公告)号：EP3258752A1
公开(公告)日：2017-12-20
申请号：EP16749345.1
申请日：2016-02-12
申请人： Pi-Crystal Incorporation
发明人： TAKEYA, Junichi , YAMAGUCHI, Seiichiro , ITOH, Masataka
IPC分类号： H05K3/46 , H05K3/36
CPC分类号： H05K3/361 , H05K1/115 , H05K1/144 , H05K3/36 , H05K3/4038 , H05K3/46 , H05K3/4623 , H05K2201/041 , H05K2201/10121 , H05K2201/10151
摘要： Research on practical realization of various types of printable devices has progressed, and the realization of devices in which these printable devices are integrated on a flexible board is expected. However, there is the problem that, if a plurality of printable devices are simply integrated on the same board, the area of the integrated device increases, and the yield ratio greatly decreases. An integration technique that solves the problem of an increase in the area and a decrease in the yield ratio is in demand. Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through-vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.
摘要翻译：对各种可打印设备的实际实现的研究已经取得了进展，并且期望实现这些可打印设备集成在柔性板上的设备。但是，如果多个可印刷设备简单地集成在同一板上，则存在这样的问题：集成设备的面积增加，并且成品率大大降低。需求解决面积增加和产量比降低的问题的集成技术。要集成的电子器件形成在单独的板上，板以预定关系彼此重叠，然后在预定位置形成通孔。由此，电子设备彼此电连接，并且起到集成设备的作用。

2. 发明公开

EP3288012A1 METHOD FOR MANUFACTURING ACTIVE MATRIX ARRAY DEVICE, AND ACTIVE MATRIX ARRAY DEVICE MANUFACTURED THEREBY 有权转让
标题翻译：有源矩阵阵列装置的制造方法以及由其制造的有源矩阵阵列装置
公开(公告)号：EP3288012A1
公开(公告)日：2018-02-28
申请号：EP16783306.0
申请日：2016-04-20
申请人： Pi-Crystal Incorporation
发明人： YAMAGUCHI, Seiichiro , TAKEYA, Junichi , ITOH, Masataka , SHOMOTO, Norikazu , UEMATSU, Mina
IPC分类号： G09F9/30 , G02F1/1368 , H01L21/336 , H01L29/786 , H01L51/05
CPC分类号： G02F1/136286 , G02F1/1368 , G02F2001/13613 , G09F9/30 , H01L27/1259 , H01L27/3274 , H01L29/786 , H01L51/05
摘要： Active matrix array devices are constituted by devices that have a function such as those of a display/light emitting device, a sensor, a memory, or an actuator, and are arranged in a matrix array shape, and the expansion of usage in various fields and applications is expected. However, there is little similarity and compatibility in the forming process and materials between a device such as a display/light emitting device, a sensor, a memory, or an actuator, and a circuit portion that controls such a device in the matrix element, and therefore the device and the circuit portion are mutually restricting factors. This results in an increase in the manufacturing cost and limitation of the function.
A conventional active matrix array device is manufactured by performing various process steps on the same substrate. Control circuit portions each including a transistor are formed in some of the process steps. In contrast, the problem described above is solved by forming the control circuit portions of an active matrix array device on a substrate different from that of other portions, and the control circuit portions are respectively mounted on matrix elements in a middle step of the manufacturing process of the matrix array body or after a final step thereof.
摘要翻译：有源矩阵阵列器件由具有诸如显示器/发光器件，传感器，存储器或致动器的功能的器件构成，并且以矩阵阵列形状布置，并且扩展了各种领域的使用并预计应用程序。然而，在诸如显示器/发光器件，传感器，存储器或致动器之类的器件与控制矩阵元件中的这种器件的电路部分之间的形成过程和材料中几乎没有相似性和兼容性，因此该装置和电路部分是相互制约的因素。这导致制造成本的增加和功能的限制。传统的有源矩阵阵列器件是通过在同一衬底上执行各种工艺步骤而制造的。在一些处理步骤中形成均包括晶体管的控制电路部分。相反，通过在与其它部分不同的衬底上形成有源矩阵阵列器件的控制电路部分来解决上述问题，并且在制造过程的中间步骤中将控制电路部分分别安装在矩阵元件上矩阵阵列主体或其最终步骤之后。

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