专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP1734583A1 Electron bombarded image sensor array device and its manufactoring method 审中-公开
标题翻译： ren ren ren ren ren ren ren ren ren ren ren ren ren ren
公开(公告)号：EP1734583A1
公开(公告)日：2006-12-20
申请号：EP05076385.3
申请日：2005-06-14
申请人： Photonis-DEP B.V.
发明人： Tomuta, Daniela Georgeta , Meinen, Albert Hendrik Jan , Ruiter, Gezinus , Van Spijker, Jan
IPC分类号： H01L27/146 , H01L31/0203
CPC分类号： H01J31/26 , H01L24/14 , H01L27/14618 , H01L27/14634 , H01L31/0203 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The invention relates to an electron bombarded image sensor array device comprising a vacuum chamber having a photocathode capable of releasing electrons into said vacuum chamber when exposed to light impinging on said photocathode, a photocathode capable of releasing electrons into said vacuum chamber when exposed to light impinging on said photocathode, electric field means for accelerating said released electrons from said photocathode towards an anode spaced apart from said photocathode in a facing relationship to receive an electron image from said photocathode, said anode being constructed as a back-thinned image sensor array having electric connecting pads distributed according to a pattern along the surface area of said sensor facing away from said photocathode, a carrier on which said image sensor array is mounted, said carrier having electric connecting pads distributed according to a pattern to feed electric signals from said image sensor array outside said vacuum chamber and electric connecting means for electrically connecting at least one of said electric connecting pads of said image sensor array with at least one of said electric connecting pads of said carrier.
摘要翻译：本发明涉及一种电子轰击图像传感器阵列装置，其包括具有光电阴极的真空室，该真空室当暴露于入射到所述光电阴极上的光时，能够将电子释放到所述真空室中，当暴露于光照射时能够将电子释放到所述真空室中的光电阴极在所述光电阴极上，电场装置用于将所述释放的电子从所述光电阴极朝向与所述光电阴极隔开的阳极以面对的关系加速，以接收来自所述光电阴极的电子图像，所述阳极被构造为具有电气的背面薄化图像传感器阵列沿着所述传感器的表面区域背离所述光电阴极分布的连接焊盘，安装有所述图像传感器阵列的载体，所述载体具有根据图案分布的电连接焊盘，以馈送来自所述图像传感器的电信号阵列外面的真空室a d电连接装置，用于将所述图像传感器阵列的至少一个所述电连接焊盘与所述载体的所述电连接焊盘中的至少一个电连接。

2. 发明公开

EP1734584A1 Electron bombarded image sensor array device as well as such an image sensor array 审中-公开
标题翻译： Elektronenbeschossene Bildsensorvorrichtung，sowie eine solche Bildsensoranordnung
公开(公告)号：EP1734584A1
公开(公告)日：2006-12-20
申请号：EP05076388.7
申请日：2005-06-14
申请人： Photonis-DEP B.V.
发明人： Tomuta, Daniela Georgeta , Meinen, Albert Hendrik Jan , Ruiter, Gezinus , van Spijker, Jan
IPC分类号： H01L27/146 , H01J31/49
CPC分类号： H01L27/14601 , H01J31/26 , H01J31/49 , H01L27/14618 , H01L27/14634 , H01L27/1464 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to an electron bombarded image sensor array device comprising a vacuum chamber having a photocathode capable of releasing electrons into said vacuum chamber when exposed to electromagnetic radiation impinging on said photocathode, electric field means for accelerating said released electrons from said photocathode towards an anode spaced apart from said photocathode in a facing relationship to receive an electron image from said photocathode, said anode being constructed as an back thinned image sensor array having electric connecting pads and being mounted to a carrier using mounting means, said carrier having electric connecting pads to feed electric signals from said image sensor array finally outside said vacuum chamber.
The invention also relates to an image sensor array to be used in such a device.
摘要翻译：本发明涉及一种电子轰击图像传感器阵列装置，其包括具有光电阴极的真空室，所述真空室能够暴露于入射到所述光电阴极上的电磁辐射时能将电子释放到所述真空室中，所述电场装置用于将所述释放的电子从所述光电阴极加速至阳极与所述光电阴极间隔开以接收来自所述光电阴极的电子图像，所述阳极被构造为具有电连接焊盘并且使用安装装置安装到载体的背部薄化图像传感器阵列，所述载体具有电连接焊盘将来自所述图像传感器阵列的电信号最后馈送到所述真空室外。本发明还涉及在这种装置中使用的图像传感器阵列。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式