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1. 发明公开

EP2009142A1 COMPOSITION FOR ETCHING TREATMENT OF RESIN MOLDED ARTICLE 有权转让
标题翻译： ZUSAMMENSETZUNG ZURÄTZBEHANDLUNGVONHARZFORMKÖRPER
公开(公告)号：EP2009142A1
公开(公告)日：2008-12-31
申请号：EP07737680.4
申请日：2007-03-02
申请人： Okuno Chemical Industries Co. Ltd
发明人： SATOU, Kazuya , YOSHIKANE, Yusuke
IPC分类号： C23C18/24
CPC分类号： C23C18/24 , C23C18/2086 , C23C18/31
摘要： The present invention provides a composition for the etching treatment of a resin molded article. The composition is composed of an aqueous solution containing 20 to 1,200 g/l of an inorganic acid, 0.01 to 10 g/l of a manganese salt, and 1 to 200 g/l of at least one component selected from the group consisting of halogen oxoacids, halogen oxoacid salts, persulfate salts, and bismuthate salts.
The etching composition of the invention is a novel etching solution capable of forming a plating film having a good adhesion to various resin molded articles made of ABS resins or the like, and can be used in place of chromic acid mixtures. The composition is highly safe so that the liquid waste is easily disposed of.
摘要翻译：本发明提供了一种用于树脂模塑制品的蚀刻处理的组合物。该组合物由含有20〜1200g / l的无机酸，0.01〜10g / l的锰盐和1〜200g / l的选自卤素的组分的水溶液含氧酸，卤素含氧酸盐，过硫酸盐和铋酸盐。本发明的蚀刻组合物是能够形成对由ABS树脂等制成的各种树脂模塑制品具有良好粘附性的镀膜的新型蚀刻溶液，并且可以用于代替铬酸混合物。该组合物是高度安全的，因此易于处理废液。

2. 发明授权

EP2009142B8 COMPOSITION FOR ETCHING TREATMENT OF RESIN MOLDED ARTICLE 有权转让
标题翻译：组成蚀刻处理树脂成型品
公开(公告)号：EP2009142B8
公开(公告)日：2013-08-14
申请号：EP07737680.4
申请日：2007-03-02
申请人： OKUNO CHEMICAL INDUSTRIES CO., LTD.
发明人： SATOU, Kazuya , YOSHIKANE, Yusuke
IPC分类号： C23C18/16 , C23C18/24
CPC分类号： C23C18/24 , C23C18/2086 , C23C18/31

3. 发明公开

EP3168332A1 ELECTROLYTIC STRIPPING AGENT FOR JIG 有权转让
标题翻译： JIG的电解溶出剂
公开(公告)号：EP3168332A1
公开(公告)日：2017-05-17
申请号：EP16764540.7
申请日：2016-01-29
申请人： Okuno Chemical Industries Co., Ltd.
发明人： YOSHIKANE, Yusuke , KITA, Koji
IPC分类号： C25D17/06 , C25D5/56 , C25F5/00
CPC分类号： C25F5/00 , C01B7/096 , C01B21/38 , C01C1/00 , C01G55/001 , C23C18/163 , C23C18/1653 , C23C18/30 , C25D5/56 , C25D17/06
摘要： An object of the invention is to provide a jig electrolytic stripper that can sufficiently remove palladium adhered to the current-conducting portion of a plating jig, that can remove palladium adhered to the insulating-material-coated portion of the jig, and that exhibits reduced erosion of the metal of the current-conducting portion of the jig. The jig electrolytic stripper comprises the following components (A) to (C): (A) at least one member selected from the group consisting of nitric acid and salts thereof, (B) at least one member selected from the group consisting of ammonia, ammonium salts, ethylene amine compounds, alkyl diamine compounds, and amino acids, and (C) a bromide.
摘要翻译：本发明的目的是提供一种夹具电解剥离器，其能够充分地除去附着在电镀夹具的导电部分上的钯，该钯可以去除附着在夹具的绝缘材料涂覆部分上的钯，并且表现出减少夹具的导电部分的金属的侵蚀。该夹具式电解汽提器包括下列组分（A）至（C）：（A）选自硝酸及其盐中的至少一种，（B）选自氨，铵盐，亚乙基胺化合物，烷基二胺化合物和氨基酸，和（C）溴化物。

4. 发明公开

EP2149622A8 PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT 审中-公开
标题翻译：制备工艺的化学镀用树脂成形体，方法用于镀覆树脂成形体与处理剂
公开(公告)号：EP2149622A8
公开(公告)日：2010-04-14
申请号：EP08752904.6
申请日：2008-05-16
申请人： OKUNO CHEMICAL INDUSTRIES CO., LTD.
发明人： NAGAO, Toshimitsu , YOSHIKANE, Yusuke , YOSHIKAWA, Junji , MORIMOTO, Toru , MURATA, Toshiya , SATOU, Kazuya
IPC分类号： C23C18/24 , C23C18/20 , C23C18/30 , C25D5/56
CPC分类号： C23C18/22 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/28
摘要： The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.

5. 发明授权

EP2009142B1 COMPOSITION FOR ETCHING TREATMENT OF RESIN MOLDED ARTICLE 有权转让
标题翻译：用于树脂成型品处理的组合物
公开(公告)号：EP2009142B1
公开(公告)日：2013-05-22
申请号：EP07737680.4
申请日：2007-03-02
申请人： OKUNO CHEMICAL INDUSTRIES CO., LTD.
发明人： SATOU, Kazuya , YOSHIKANE, Yusuke
IPC分类号： C23C18/16 , C23C18/24
CPC分类号： C23C18/24 , C23C18/2086 , C23C18/31

6. 发明公开

EP2149622A1 PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT 审中-公开
标题翻译：制备工艺的化学镀用树脂成形体，方法用于镀覆树脂成形体与处理剂
公开(公告)号：EP2149622A1
公开(公告)日：2010-02-03
申请号：EP08752904.6
申请日：2008-05-16
申请人： Okuno Chemical Industries Co. Ltd
发明人： NAGAO, Toshimitsu , YOSHIKANE, Yusuke , YOSHIKAWA, Junji , MORIMOTO, Toru , MURATA, Toshiya , SATOU, Kazuya
IPC分类号： C23C18/24 , C23C18/20 , C23C18/30 , C25D5/56
CPC分类号： C23C18/22 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/28
摘要： The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.
摘要翻译：本发明提供一个预处理过程进行的树脂模塑制品的无电解镀敷，包括：使用锰酸含盐腐蚀液腐蚀树脂成形体，然后使树脂模塑制品接触到在wässrige溶液含有还原性化合物，并在无机酸; 和树脂成型制品，其包括在预处理工艺的电镀工艺。此外，本发明提供一种用于在电镀工艺中使用的各种治疗剂。。根据本发明，具有足够的粘合性的镀覆层可以形成在蚀刻处理是使用锰酸含盐蚀刻溶液执行。在以无电镀处理的树脂成型品的。

7. 发明授权

EP3168332B1 ELECTROLYTIC STRIPPING AGENT FOR REMOVING PALLADIUM FROM A JIG 有权转让
公开(公告)号：EP3168332B1
公开(公告)日：2019-03-13
申请号：EP16764540.7
申请日：2016-01-29
申请人： Okuno Chemical Industries Co., Ltd.
发明人： YOSHIKANE, Yusuke , KITA, Koji
IPC分类号： C25D21/00 , C25F5/00 , C25D21/08 , C25F3/02 , C23F1/40 , C23F1/44 , C23F1/46 , C23C18/16

8. 发明公开

EP2009142A8 COMPOSITION FOR ETCHING TREATMENT OF RESIN MOLDED ARTICLE 有权转让
标题翻译：组成蚀刻处理树脂成型品
公开(公告)号：EP2009142A8
公开(公告)日：2009-04-15
申请号：EP07737680.4
申请日：2007-03-02
申请人： OKUNO CHEMICAL INDUSTRIES CO., LTD.
发明人： SATOU, Kazuya , YOSHIKANE, Yusuke
IPC分类号： C23C18/24
CPC分类号： C23C18/24 , C23C18/2086 , C23C18/31
摘要： The present invention provides a composition for the etching treatment of a resin molded article. The composition is composed of an aqueous solution containing 20 to 1,200 g/l of an inorganic acid, 0.01 to 10 g/l of a manganese salt, and 1 to 200 g/l of at least one component selected from the group consisting of halogen oxoacids, halogen oxoacid salts, persulfate salts, and bismuthate salts.
The etching composition of the invention is a novel etching solution capable of forming a plating film having a good adhesion to various resin molded articles made of ABS resins or the like, and can be used in place of chromic acid mixtures. The composition is highly safe so that the liquid waste is easily disposed of.

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