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1. 发明公开

EP2917931A1 METHOD FOR BONDING BARE CHIP DIES 有权
标题翻译：方法绑定芯片阵列
公开(公告)号：EP2917931A1
公开(公告)日：2015-09-16
申请号：EP13801876.7
申请日：2013-11-08
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO , IMEC vzw
发明人： SMITS, Edsger Constant Pieter , PERINCHERY, Sandeep Menon , VAN DEN BRAND, Jeroen , MANDAMPARAMBIL, Rajesh , SCHOO, Harmannus Franciscus Maria
IPC分类号： H01L21/60 , H01L21/48 , B23K3/06 , B23K35/26 , C09J9/02 , H01L23/00 , H01L33/62 , H01L23/498 , H01L23/485 , H01L21/683
CPC分类号： H01L24/83 , B23K35/02 , B23K35/26 , B23K35/262 , C09J5/06 , C09J2201/61 , C09J2203/326 , C09J2205/31 , H01L21/4853 , H01L21/50 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L23/4985 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/73 , H01L24/81 , H01L24/92 , H01L33/62 , H01L2021/60277 , H01L2221/68359 , H01L2221/68381 , H01L2224/11003 , H01L2224/111 , H01L2224/1111 , H01L2224/1133 , H01L2224/13005 , H01L2224/13111 , H01L2224/1329 , H01L2224/133 , H01L2224/14131 , H01L2224/27001 , H01L2224/29011 , H01L2224/29013 , H01L2224/29034 , H01L2224/73103 , H01L2224/73104 , H01L2224/742 , H01L2224/75252 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/81862 , H01L2224/83192 , H01L2224/83224 , H01L2224/83862 , H01L2224/9211 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/381 , H01L2224/81 , H01L2224/83 , H01L2924/2076 , H01L2924/01047 , H01L2924/01029 , H01L2924/00 , H01L2924/00012
摘要： A method is provided for assembly of a micro-electronic component comprising the steps of: providing a conductive die bonding material comprising of a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer; and impinging a laser beam on the dynamic release layer adjacent to the die bonding material layer; in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated to cover a selected part of the pad structure with a transferred conductive die bonding material; and wherein the laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.

2. 发明公开

EP3041675A1 ELECTRICALLY INTERCONNECTING FOIL 审中-公开
标题翻译：电气相关FILM
公开(公告)号：EP3041675A1
公开(公告)日：2016-07-13
申请号：EP14777194.3
申请日：2014-09-04
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO , IMEC vzw
发明人： VAN DEN ENDE, Daan Anton , KUSTERS, Roel Henry Louis , VAN DEN BRAND, Jeroen
IPC分类号： B32B15/095 , B32B27/28 , B32B27/40 , H01R3/00 , H01R4/00 , H01R35/00 , H05K3/38
CPC分类号： H01L51/0097 , H01L51/05 , H01L51/42 , H01L51/50 , H05K1/0283 , H05K1/0296 , H05K1/0353 , H05K1/181 , H05K2201/0129
摘要： The invention relates to a bendable electrically interconnecting foil for making flexible electronic circuits, more in particular circuits comprising rigid electronic components such as integrated circuits. The foil comprises a flexible substrate and stretchable conductive tracks for connecting the electronic components. Between the substrate and the tracks a resilient layer is situated. The invention further relates to an electronic circuit comprising the bendable electrically interconnecting foil.

3. 发明公开

EP3804477A2 STRETCHABLE ELECTRONIC DEVICE 审中-实审
公开(公告)号：EP3804477A2
公开(公告)日：2021-04-14
申请号：EP19743012.7
申请日：2019-05-21
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
发明人： BARINK, Marco , SMITS, Edsger Constant Pieter , VAN DEN BRAND, Jeroen
IPC分类号： H05K1/02 , H05K1/18 , H05K3/28

4. 发明公开

EP3801198A1 A WEARABLE DEVICE 有权
公开(公告)号：EP3801198A1
公开(公告)日：2021-04-14
申请号：EP19727004.4
申请日：2019-05-28
申请人： Koninklijke Philips N.V. , Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO
发明人： GROB, Timon, Rutger , TASAR, Ozgur , TALGORN, Elise, Claude, Valentine , ADRIAENSSEN, Lieven , BARINK, Marco , SMITS, Edsger, Constant, Pieter , VAN DEN BRAND, Jeroen
IPC分类号： A61B5/00

5. 发明公开

EP3787381A1 ELECTRONIC DEVICE WITH MULTILAYER LAMINATE 审中-公开
公开(公告)号：EP3787381A1
公开(公告)日：2021-03-03
申请号：EP19194775.3
申请日：2019-08-30
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
发明人： VAN DEN BRAND, Jeroen , HARKEMA, Stephan , DE KOK, Margaretha Maria , VAN DER WAAL, Adri
IPC分类号： H05K1/02 , H05K3/28
摘要： An electronic device (100) comprises an electronics substrate (10) with at least one light emitting device (12), a cover substrate (20) with a graphical pattern including at least one window (22), and a thermoplastic layer (30) there between. A multilayer laminate (40) of the device (100) is formed by combining the electronics substrate (10) and the cover substrate (20) by lamination with protruding electronic components (11,12) facing the thermoplastic layer (30). At least the thermoplastic layer (30) is heated to a lamination temperature (Tl) for increasing a plasticity of the thermoplastic material (30m). The electronic components (11,12) are pushed by the lamination into the heated thermoplastic layer (30) for embedding the electronic components (11,12) in the thermoplastic material (30m).

6. 发明授权

EP2268488B1 LAMINATING DEVICE AND LAMINATING METHOD 有权
标题翻译：层压装置和层压方法
公开(公告)号：EP2268488B1
公开(公告)日：2017-08-02
申请号：EP09720166.9
申请日：2009-03-13
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO
发明人： VAN DEN BRAND, Jeroen , DIETZEL, Andreas Heinrich , DE VRIES, Ike
IPC分类号： B32B38/18
CPC分类号： B32B38/1841 , B32B37/203 , B32B2457/00

7. 发明公开

EP2815444A1 OPTO-ELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLUNG EINER OPTOELEKTRISCHEN VORRICHTUNG
公开(公告)号：EP2815444A1
公开(公告)日：2014-12-24
申请号：EP13709576.6
申请日：2013-02-15
申请人： Nederlandse Organisatie voor Toegepast -Natuurwetenschappelijk Onderzoek TNO
发明人： VAN DEN BRAND, Jeroen , WILSON, Joanne Sarah , VAN MOL, Antonius Maria Bernardus , HERMES, Dorothee Christine , YOUNG, Edward Willem Albert
IPC分类号： H01L51/52
CPC分类号： H01L51/5256 , H01L33/62 , H01L51/5203 , H01L51/5212 , H01L51/5228 , H01L51/5234 , H01L51/5271 , H01L51/56
摘要： The opto-electric device (10) comprises an opto-electric layer structure (20) having an anode and a cathode layer (22, 24 resp.) as well as a opto-electric layer (26) arranged between said anode and cathode layers, and having a light-transmission side (28), the cathode layer of said anode and cathode layer being closest to said light-transmission side. A dual electrically conductive layer structure is (40) arranged at a side of said opto-electric layer structure opposite the light-transmission side, the dual electrically conductive layer structure having a first and a second electrically conductive layer (42, 44 resp.) mutually insulated by a first electrically insulating layer (46), the first electrically conductive layer of said first and second electrically conductive layer being closest to the opto-electric layer structure. A second electrically insulating layer (50) is arranged between the light emitting layer structure (20) and the dual electrically conductive layer structure (40), wherein the first electrically conductive layer (42) is electrically connected by at least a first transverse electrical conductor (62) through said second insulating layer with said anode layer (22) and said second electrically conductive layer (44) is electrically connected by at least a second transverse electrical conductor (64) through said first electrically insulating layer (46), said first electrically conductive layer (42), said second electrically insulating layer (50), said anode electrode layer (22) and said light emitting layer (26), with said cathode layer (24).
摘要翻译：光电装置（10）包括具有阳极和阴极层（22,24）的光电层结构（20）以及布置在所述阳极层和阴极层之间的光电层（26），并具有光透射侧（28），所述阳极和阴极层的阴极层最靠近所述光透射侧。双重导电层结构（40）布置在所述光电层结构的与光透射侧相对的一侧，所述双重导电层结构具有第一和第二导电层（42,44）由第一电绝缘层（46）互相绝缘，所述第一和第二导电层的第一导电层最靠近光电层结构。第二电绝缘层（50）布置在发光层结构（20）和双重导电层结构（40）之间，其中第一导电层（42）通过至少第一横向电导体（62）通过所述第二绝缘层与所述阳极层（22）和所述第二导电层（44）通过所述第一电绝缘层（46）的至少第二横向电导体（64）电连接，所述第一导电层（42），所述第二电绝缘层（50），所述阳极电极层（22）和所述发光层（26）与所述阴极层（24）连接。

8. 发明公开

EP2504169A1 APPARATUS AND METHOD FOR LAMINATING A FIRST AND A SECOND SHEET 有权
标题翻译： DEVICE AND METHOD FOR层叠第一和第二薄膜
公开(公告)号：EP2504169A1
公开(公告)日：2012-10-03
申请号：EP10787571.8
申请日：2010-11-19
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO
发明人： VAN DEN BRAND, Jeroen , DIETZEL, Andreas, Heinrich , BROERS, Sander, Christiaan , SAALMINK, Milan
IPC分类号： B32B38/18 , H01L51/00 , H01K13/00 , B65H37/04
CPC分类号： B32B38/1841 , H01L51/0024 , H01L51/56 , Y10T156/10
摘要： The invention relates to an apparatus for laminating a first and a second sheet with a plane carrier (10) and a drum shaped carrier (20) for carrying a respective sheet. The apparatus has a first main operational mode wherein the drum shaped carrier (20) is at distance from a first carrier surface (12) of the plane carrier (10) in said third direction (Z), and a second main operational mode wherein the drum shaped carrier (20) is close to first carrier surface to bring the first and the second sheet (1, 2) in contact with each other. In the first main operational mode the drum shaped carrier (20) is virtually rolled over the first carrier surface (12) and the sheets are mutually aligned. In the second operational mode the sheets are laminated.

9. 发明公开

EP3956643A1 PRESSURE SENSOR 有权
公开(公告)号：EP3956643A1
公开(公告)日：2022-02-23
申请号：EP20720538.6
申请日：2020-04-17
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
发明人： BURGHOORN, Maria Mathea Antonetta , ZALAR, Peter , VAN DEN BRAND, Jeroen , RAITERI, Daniele , SMITS, Edsger Constant Pieter
IPC分类号： G01L9/00 , G01L1/18 , G01L1/20 , G01L1/22

10. 发明公开

EP3922433A1 THERMOFORMED DEVICE WITH OLED DISPLAY AND METHOD OF FABRICATION 审中-公开
公开(公告)号：EP3922433A1
公开(公告)日：2021-12-15
申请号：EP20179709.9
申请日：2020-06-12
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
发明人： HARKEMA, Stephan , TEUNISSEN, Jean-Pierre , DE KOK, Margaretha Maria , VAN DEN BRAND, Jeroen
IPC分类号： B29C51/00 , B29C51/12 , B29C51/14 , H01L51/00 , H01L51/52 , B29K31/00 , B29K21/00
摘要： A curved human interface device (100) is manufactured by thermoforming a stack (10). The stack (10) comprises a front substrate (11) formed of a transparent, first thermoplastic material (11m); an OLED display (13) configured to display an image through the front substrate (11); and a thermomechanical buffer layer (12) formed of a transparent, second thermoplastic material (12m) arranged between the front substrate (11) and the OLED display (13). Heat (H) is applied to the stack (10) for causing a temperature of the front substrate (11) and buffer layer (12) to increase to a respective processing temperature (T1,T2) at which the first and second thermoplastic materials (11m, 12m) become pliable. The stack (10) is thermoformed while the thermoplastic materials (11m,12m) are pliable to form the curved human interface device (100). The second thermoplastic material (12m) has a lower stiffness at the respective processing temperature (T1,T2) than the first thermoplastic material (11m).

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