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1. 发明公开

EP2955790A4 MULTIPOLE CONNECTOR 有权
标题翻译： MEHRPOLIGER STECKVERBINDER
公开(公告)号：EP2955790A4
公开(公告)日：2016-09-07
申请号：EP14749617
申请日：2014-01-15
申请人： NSK LTD
发明人： SUNAGA TAKASHI , KANEKO NOBORU , MIYOSHI OSAMU
IPC分类号： H01R12/58 , H01R13/405 , H01R24/60 , H01R43/24 , H01R107/00 , H05K1/14
CPC分类号： H01R12/523 , H01R12/58 , H01R13/405 , H01R43/24 , H01R2107/00 , H05K1/115 , H05K1/144 , H05K1/181 , H05K3/341 , H05K2201/042 , H05K2201/1028 , H05K2201/10303 , H05K2201/10424 , H05K2201/10522
摘要： A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch. A protection section (121) to protect a particular pin-shaped terminal (110) of the plural pin-shaped terminals (110) is provided at a part of the hold member (120) to extend from the hold member (120) to protrude in the connection direction of the particular pin-shaped terminal (110) to be protected and cover around the particular pin-shaped terminal (110).
摘要翻译：提供多极连接器。可以防止在垂直于多极连接器的连接方向的方向上排列成一行的多个销状端子的特定销状端子的变形，并且还可以防止特定销状端子的位置偏移和其他针形端子。多极连接器（101）包括沿垂直于多极连接器的连接方向（箭头Y方向）的方向（箭头X方向）沿着连接方向延伸的多个销状端子（110），并且保持构件（120）构造成在垂直于连接方向的方向上延伸并且以预定间距保持多个销状端子（110）。在保持构件（120）的一部分处设置有用于保护多个销状端子（110）的特定销状端子（110）的保护部（121），以从保持构件（120）延伸到突出部在要被保护的特定销状端子（110）的连接方向上并围绕特定的针形端子（110）覆盖。

2. 发明公开

EP2916349A4 SEMICONDUCTOR MODULE 有权
公开(公告)号：EP2916349A4
公开(公告)日：2016-08-31
申请号：EP13851225
申请日：2013-10-25
申请人： NSK LTD
发明人： SUNAGA TAKASHI , KANEKO NOBORU , MIYOSHI OSAMU
IPC分类号： H01L21/60 , H01L23/48 , H01L25/07 , H01L25/18
CPC分类号： H05K7/02 , H01L23/142 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
摘要： To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c) . The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

4. 发明公开

EP3132881A4 RESISTANCE WELDING DEVICE, RESISTANCE WELDING METHOD, AND PROTRUSION SHAPE FOR PROJECTION WELDING 有权
公开(公告)号：EP3132881A4
公开(公告)日：2018-01-10
申请号：EP15779729
申请日：2015-04-15
申请人： NSK LTD
发明人： SUNAGA TAKASHI , KANEKO NOBORU , MIYOSHI OSAMU , SUZUKI RYOICHI
IPC分类号： B23K11/24 , B23K11/00 , B23K11/14 , B23K11/25 , B23K101/00 , B62D5/04
CPC分类号： B23K11/14 , B23K11/00 , B23K11/24 , B23K11/25 , B23K2201/006 , B62D5/0403
摘要： [Problem] In joining conductors by resistance welding, a resistance welding device and a resistance welding method capable of determining a joining quality, and a shape of a projection appropriate for determination of the joining quality, and used for the projection welding are provided, and their electrical reliability and mechanical joining strength are improved by using the resistance welding device, the resistance welding method, and the shape of the projection for projection welding for connecting conductors of an electric power steering apparatus. [Means for solving the problem] A resistance welding device 1000 is provided with a moving distance measuring section 1007 for measuring distances between conductors 1004 and 1005 to be joined before and after joining and evaluating joining quality based on the distances, and a projection 200 including a base 210 and a projecting surface 230 is provided to the conductor 1005 to be connected in order to easily secure a distance between the conductors after the joining.

5. 发明公开

EP3024024A4 SEMICONDUCTOR MODULE 审中-公开
公开(公告)号：EP3024024A4
公开(公告)日：2016-10-05
申请号：EP14855368
申请日：2014-10-06
申请人： NSK LTD
发明人： SUNAGA TAKASHI , KANEKO NOBORU , MIYOSHI OSAMU , SUZUKI RYOICHI
IPC分类号： H01L23/492 , H01L21/60 , H01L25/07 , H01L25/18
CPC分类号： H01L24/41 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013
摘要： To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode-jointing portion (36bb) that is opposed to a surface to be jointed of a gate electrodes (G) of a bare-chip FET (35) and a joint surface of a substrate-jointing portion (36bc) that is opposed to a surface to be jointed of another wiring pattern (33c) include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector. (3Gb) be released from solders (34c and 34f) interposed between the joint surfaces and the surfaces to be jointed.

7. 发明公开

EP2916348A4 SEMICONDUCTOR MODULE 审中-公开
公开(公告)号：EP2916348A4
公开(公告)日：2016-01-27
申请号：EP13851001
申请日：2013-10-25
申请人： NSK LTD
发明人： SUNAGA TAKASHI , KANEKO NOBORU , MIYOSHI OSAMU
IPC分类号： H01L21/60 , B62D5/04 , H01L25/07 , H01L25/18
CPC分类号： H01L23/49551 , B62D5/0406 , H01L23/49524 , H01L23/49562 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/29101 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40106 , H01L2224/40159 , H01L2224/40225 , H01L2224/4103 , H01L2224/41175 , H01L2224/73263 , H01L2224/77272 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84095 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/92246 , H01L2224/92247 , H01L2924/014 , H01L2924/13055 , H01L2924/1306 , H01L2924/15724 , H01L2924/19041 , H01L2924/19105 , H01L2924/351 , H01L2924/00 , H01L2924/1305 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor module is provided for shortening a manufacturing tact time and reduce manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate (31) formed of a metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on one wiring pattern (33a) via a solder (34a), and copper connectors (36a, 36b) that connects electrodes (S, G) formed on the bear-chip transistor (35) and other wiring patterns (33b, 33c) via a solder (34b, 34c). The copper connectors (36a, 36b) has a bridge shape, has a width-reduced portion (36ag) formed in the vicinity of the bonding face (36af) to the electrodes (S, G), and has a stress-reducing portion (36ak) formed on the bonding face (36af) bonded to the electrode (S, G).

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