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1. 发明公开

EP1981173A1 COMPOSITE HIGH-FREQUENCY COMPONENTS AND MOBILE COMMUNICATION APPARATUS 审中-公开
标题翻译： HOCHFREQUENZ-VERBUNDKOMPONENTEN移动电话KOMMUNIKATIONSVORRICHTUNG
公开(公告)号：EP1981173A1
公开(公告)日：2008-10-15
申请号：EP07706968.0
申请日：2007-01-18
申请人： Murata Manufacturing Co. Ltd.
发明人： UEJIMA, Takanori , NAKAYAMA, Naoki
IPC分类号： H04B1/40
CPC分类号： H04B1/006 , H04B1/48
摘要： A composite high-frequency component has a diplexer (102) for separating/combining transmission/reception signals in frequency bands of a plurality of communication systems, transmit/receive switches (103) (104), filters (105) (106), and a balanced-unbalanced reception signal switch (124), and a matching circuit (108). The balanced-unbalanced reception signal switch (124) is composed of a reception signal switch (121) and balanced-unbalanced filters (122) (123). A stripline (GSL2) in the transmit/receive switch (103) and a stripline (ASL2) in the reception signal switch (121) are formed on the same layers, and the matching circuit (108) composed of capacitors (GCu3) (AGPr) is arranged between the transmit/receive switch (103) and the reception signal switch (121).
摘要翻译：复合高频分量具有用于在多个通信系统的频带中分离/组合发送/接收信号的双工器（102），发送/接收开关（103）（104），滤波器（105）（106）和平衡不平衡接收信号开关（124）和匹配电路（108）。平衡不平衡接收信号开关（124）由接收信号开关（121）和平衡不平衡滤波器（122）（123）组成。在同一层上形成发送/接收开关（103）中的带状线（GSL2）和接收信号开关（121）中的带状线（ASL2），并且由电容器（GCu3）（AGPr）组成的匹配电路）设置在发送/接收开关（103）和接收信号开关（121）之间。

2. 发明授权

EP2763323B1 HIGH-FREQUENCY MODULE 有权
公开(公告)号：EP2763323B1
公开(公告)日：2019-04-17
申请号：EP12835495.8
申请日：2012-09-21
申请人： Murata Manufacturing Co., Ltd.
发明人： MURASE, Hisanori , HAYAKAWA, Masashi , UEJIMA, Takanori
IPC分类号： H04B1/00 , H04B1/44

3. 发明公开

EP1928222A1 PACKAGING METHOD OF ELECTRONIC COMPONENT MODULE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS USING IT, AND ELECTRONIC COMPONENT MODULE 有权
标题翻译： VERKAPSELUNGSVERFAHRENFÜREIN ELEKTRONISCHES KOMPONENTENMODUL UND ELEKTRONISCHES KOMPONENTENMODUL
公开(公告)号：EP1928222A1
公开(公告)日：2008-06-04
申请号：EP06781961.5
申请日：2006-07-28
申请人： MURATA MANUFACTURING CO., LTD.
发明人： KOYAMA, Kunihiro , YAMAMOTO, Muneyoshi , UEJIMA, Takanori , NAKAGAWA, Dai , KIMURA, Masaki
IPC分类号： H05K13/04 , H01L25/00 , H05K3/34
CPC分类号： H01L25/165 , H01L23/3121 , H01L24/16 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/16152 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/288 , H05K3/303 , H05K2201/0125 , H05K2203/0195 , H05K2203/082 , H05K2203/083 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , Y10T428/24917 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides a method for mounting an electronic-component module in which an adsorption head can adsorb and hold the electronic-component module, the electronic-component module can be efficiently mounted on a target board, and a height of the electronic-component module mounted on the target board can be sufficiently lowered and a method for manufacturing an electronic apparatus involving the method for mounting an electronic-component module, and an electronic-component module that can lower the height thereof.
An adsorption face member 12 is provided on an electronic-component module 20 composed of an electronic-component base plate 1 and surface mount devices 2 (2a, 2b, 2c, 2d) mounted on the electronic-component base plate 1 in order to form an adsorption face 12a at a position that is substantially equal to or higher than that of an upper end of a transistor 2 (2c) that is the tallest surface-mount device. The adsorption head adsorbs the adsorption face to hold the electronic-component module and the electronic-component module is mounted on a motherboard 14 serving as the target board. Then a treatment is performed to prevent a situation in which an upper end of the adsorption face member is higher than the upper end of the tallest surface-mount device mounted on the electronic-component base plate.
摘要翻译：本发明提供了一种用于安装电子部件模块的方法，其中吸附头可以吸附和保持电子部件模块，电子部件模块可以有效地安装在目标板上，电子部件的高度可以充分降低安装在目标板上的模块，以及涉及用于安装电子部件模块的方法的电子设备的制造方法以及能够降低其高度的电子部件模块。吸附面构件12设置在由电子部件基板1和安装在电子部件基板1上的表面安装装置2（2a，2b，2c，2d）构成的电子部件模块20上，以形成在基本上等于或高于作为最高表面安装器件的晶体管2（2c）的上端的位置处的吸附面12a。吸附头吸附吸附面以保持电子部件模块，电子部件模块安装在作为目标板的母板14上。然后进行处理以防止吸附面构件的上端高于安装在电子部件基板上的最高表面安装装置的上端的情况。

4. 发明授权

EP1928222B1 PACKAGING METHOD OF ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE 有权
标题翻译：和封装的电子部件模块的电子组件模块
公开(公告)号：EP1928222B1
公开(公告)日：2011-09-28
申请号：EP06781961.5
申请日：2006-07-28
申请人： MURATA MANUFACTURING CO., LTD.
发明人： KOYAMA, Kunihiro , YAMAMOTO, Muneyoshi , UEJIMA, Takanori , NAKAGAWA, Dai , KIMURA, Masaki
IPC分类号： H05K13/04 , H01L25/00 , H05K3/34
CPC分类号： H01L25/165 , H01L23/3121 , H01L24/16 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/16152 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/288 , H05K3/303 , H05K2201/0125 , H05K2203/0195 , H05K2203/082 , H05K2203/083 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , Y10T428/24917 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides a method for mounting an electronic-component module in which an adsorption head can adsorb and hold the electronic-component module, the electronic-component module can be efficiently mounted on a target board, and a height of the electronic-component module mounted on the target board can be sufficiently lowered and a method for manufacturing an electronic apparatus involving the method for mounting an electronic-component module, and an electronic-component module that can lower the height thereof. An adsorption face member 12 is provided on an electronic-component module 20 composed of an electronic-component base plate 1 and surface mount devices 2 (2a, 2b, 2c, 2d) mounted on the electronic-component base plate 1 in order to form an adsorption face 12a at a position that is substantially equal to or higher than that of an upper end of a transistor 2 (2c) that is the tallest surface-mount device. The adsorption head adsorbs the adsorption face to hold the electronic-component module and the electronic-component module is mounted on a motherboard 14 serving as the target board. Then a treatment is performed to prevent a situation in which an upper end of the adsorption face member is higher than the upper end of the tallest surface-mount device mounted on the electronic-component base plate.

5. 发明公开

EP2106030A1 HIGH-FREQUENCY PART 审中-公开
标题翻译： HOCHFREQUENZELEMENT
公开(公告)号：EP2106030A1
公开(公告)日：2009-09-30
申请号：EP08703451.8
申请日：2008-01-18
申请人： Murata Manufacturing Co. Ltd.
发明人： UEJIMA, Takanori
IPC分类号： H04B1/50 , H03H7/075 , H03H7/46
CPC分类号： H04B1/0057 , H03H7/0123 , H03H7/075 , H03H7/1758 , H03H7/1766 , H03H7/463 , H03H2001/0085
摘要： It is an object to provide a high-frequency component in which a low-frequency-band transmission characteristic is not degraded even when impedance mismatching is generated by providing a SAW filter in a high-frequency-band circuit. The high-frequency component includes a diplexer (1) having a high pass filter (102) and a low pass filter (101) connected in parallel to an antenna port, a high-frequency-band circuit serially connected to the high pass filter (102), and a low-frequency-band circuit serially connected to the low pass filter (101). A filter causing impedance mismatching is connected to the high-frequency-band circuit. The high pass filter (102) includes a first series resonant circuit (102A) and a second series resonant circuit (102B), and the resonance frequency of the first series resonant circuit (102A) is a trap frequency of a signal in the low-frequency band, and the resonance frequency of the second series resonant circuit (102B) is a trap frequency of undesired resonance generated in the transmission characteristic of the filter of the low-frequency-band side.
摘要翻译：本发明的目的是提供即使在通过在高频带电路中提供SAW滤波器来产生阻抗失配的情况下，低频带传输特性也不会降低的高频分量。高频分量包括具有与天线端口并联连接的高通滤波器（102）和低通滤波器（101）的双工器（1），串联连接到高通滤波器的高频带电路 102）和串联连接到低通滤波器（101）的低频带电路。引起阻抗失配的滤波器连接到高频带电路。高通滤波器（102）包括第一串联谐振电路（102A）和第二串联谐振电路（102B），并且第一串联谐振电路（102A）的谐振频率是低通滤波器中的信号的陷波频率，频带和第二串联谐振电路（102B）的谐振频率是在低频带侧的滤波器的传输特性中产生的不期望的谐振的陷波频率。

6. 发明授权

EP2003788B1 HIGH FREQUENCY PART 有权
标题翻译：高频率成份
公开(公告)号：EP2003788B1
公开(公告)日：2015-03-25
申请号：EP08703453.4
申请日：2008-01-18
申请人： Murata Manufacturing Co. Ltd.
发明人： UEJIMA, Takanori
IPC分类号： H04B1/50 , H01P1/15 , H03H7/075 , H03H7/46
CPC分类号： H01P1/2135 , H01P1/15 , H01P1/213 , H03H7/0115 , H03H7/175 , H03H7/1758 , H03H7/1766 , H03H7/46 , H03H2001/0085 , H03H2250/00 , H04B1/005

7. 发明公开

EP2763323A1 HIGH-FREQUENCY MODULE 有权
标题翻译：高频模块
公开(公告)号：EP2763323A1
公开(公告)日：2014-08-06
申请号：EP12835495.8
申请日：2012-09-21
申请人： Murata Manufacturing Co., Ltd.
发明人： MURASE, Hisanori , HAYAKAWA, Masashi , UEJIMA, Takanori
IPC分类号： H04B1/40
CPC分类号： H04B1/44 , H03H7/466 , H03H9/725 , H04B1/006 , H04B1/0064
摘要： A high-frequency module (10) includes a first switch element (21) and a second switch element (22) that are mounted on a multilayer body (100). The first switch element (21) is equipped with a common terminal (Pc1) and individual terminals (Pi11, Pi12, Pi13 and Pi14). The second switch element (22) is equipped with a common terminal (Pc2) and individual terminals (Pi21, Pi22, Pi23 and Pi24). The individual terminals (Pi11, Pi12, Pi13, Pi21, Pi22 and Pi23) are connected to any of SAW filters (411, 412, 421 and 422) mounted on the multilayer body (100) or low loss filters (31 and 32) formed inside the multilayer body (100). The individual terminals (Pi14 and Pi24) are grounded by being connected to an inner layer ground electrode (DPG01) inside the multilayer body (100) by conductive via holes (131 and 132).
摘要翻译：高频模块（10）包括安装在多层体（100）上的第一开关元件（21）和第二开关元件（22）。第一开关元件（21）配备有公共端子（Pc1）和单独端子（Pi11，Pi12，Pi13和Pi14）。第二开关元件（22）配备有公共端子（Pc2）和单独端子（Pi21，Pi22，Pi23和Pi24）。各个端子（Pi11，Pi12，Pi13，Pi21，Pi22和Pi23）连接到安装在多层体（100）上的SAW滤波器（411,412,421和422）或者形成在低损耗滤波器（31和32）在多层体（100）内部。各个端子（Pi14和Pi24）通过导电通孔（131和132）连接到多层体（100）内的内层接地电极（DPG01）而接地。

8. 发明公开

EP2003788A1 HIGH FREQUENCY PART 有权
标题翻译： HOCHFREQUENZELEMENT
公开(公告)号：EP2003788A1
公开(公告)日：2008-12-17
申请号：EP08703453.4
申请日：2008-01-18
申请人： Murata Manufacturing Co. Ltd.
发明人： UEJIMA, Takanori
IPC分类号： H04B1/50 , H01P1/15 , H03H7/075 , H03H7/46
CPC分类号： H01P1/2135 , H01P1/15 , H01P1/213 , H03H7/0115 , H03H7/175 , H03H7/1758 , H03H7/1766 , H03H7/46 , H03H2001/0085 , H03H2250/00 , H04B1/005
摘要： There is provided a high-frequency component in which, even when a SAW filter is provided in a low-frequency circuit and there is an impedance mismatch, high-frequency transmission characteristics are not degraded. The high-frequency component includes a diplexer (1) in which a high-pass filter (102) and a low-pass filter (101) are connected in parallel with an antenna port, a high-frequency circuit cascaded to the high-pass filter (102), and a low-frequency circuit cascaded to the low-pass filter (101). A filter which causes an impedance mismatch to occur is connected to the low-frequency circuit. The low-pass filter (101) includes a line (Lt1). The low-pass filter (101) is constituted by a parallel resonant circuit (101A) including the line (Lt1) and a series circuit (101B) including the line (Lt1). A resonance frequency of the parallel resonant circuit (101A) is a trap frequency of a high-frequency transmission/reception signal. A frequency of resonance of all elements of the low-pass filter (101) is a trap frequency of undesired resonance that occurs at high frequencies.
摘要翻译：提供了一种高频分量，其中即使在低频电路中设置SAW滤波器并且存在阻抗失配，高频传输特性也不会降低。高频分量包括双工器（1），其中高通滤波器（102）和低通滤波器（101）与天线端口并联连接，高频电路级联到高通滤波器（102）和级联到低通滤波器（101）的低频电路。导致发生阻抗失配的滤波器连接到低频电路。低通滤波器（101）包括线（Lt1）。低通滤波器（101）由包括线路（Lt1）的并行谐振电路（101A）和包括线路（Lt1）的串联电路（101B）构成。并联谐振电路（101A）的谐振频率是高频发送/接收信号的陷波频率。低通滤波器（101）的所有元件的谐振频率是在高频下发生的不期望的谐振的陷波频率。

9. 发明公开

EP1838006A1 HIGH FREQUENCY SWITCH 审中-公开
标题翻译： HOCHFREQUENZSCHALTUNG
公开(公告)号：EP1838006A1
公开(公告)日：2007-09-26
申请号：EP06782798.0
申请日：2006-08-17
申请人： MURATA MANUFACTURING CO., LTD.
发明人： UEJIMA, Takanori , NAKAYAMA, Naoki
IPC分类号： H04B1/40 , H04B1/44
CPC分类号： H04B1/48 , H04B1/0057
摘要： To obtain a high-frequency switch that allows quick switching from a transmission mode to a reception mode.
A high-frequency switch (11) is formed by connecting a first diode (D1) and a second diode (D2) that serve as switching elements, inductors (SL1) and (SL2), capacitors (C5) and (C6), and resistors (R) and (RA). One end of the resistor (RA) is connected between the first diode (D1) and the second diode (D2), and the other end of the resistor (RA) is connected to the ground. Thus, charges accumulated in the diodes (D1) and (D2) in the ON states are immediately released to ground via the resistor. Accordingly, quick switching from the transmission mode to the reception mode by switching of a control power supply terminal (Vc) from ON to OFF is achieved.
摘要翻译：获得允许从传输模式快速切换到接收模式的高频开关。通过连接作为开关元件，电感器（SL1）和（SL2），电容器（C5）和（C6）的第一二极管（D1）和第二二极管（D2）形成高频开关（11），以及电阻（R）和（RA）。电阻器（RA）的一端连接在第一二极管（D1）和第二二极管（D2）之间，电阻器（RA）的另一端连接到地。因此，在ON状态下在二极管（D1）和（D2）中累积的电荷通过电阻器立即释放到地。因此，通过将控制电源端子（Vc）从ON切换到OFF，实现从传输模式到接收模式的快速切换。

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