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1. 发明公开

EP3499638A1 WAVEGUIDE STRIP LINE TRANSDUCER AND POWER FEED CIRCUIT 审中-公开
公开(公告)号：EP3499638A1
公开(公告)日：2019-06-19
申请号：EP17839028.2
申请日：2017-06-05
申请人： Mitsubishi Electric Corporation
发明人： WATANABE, Motomi , ARAI, Shinji , TAKAHASHI, Tomohiro , OSHIMA, Takeshi , YUASA, Takeshi , NISHIMURA, Takuma , YUKAWA, Hidenori
IPC分类号： H01P5/107 , H01P3/123 , H01P5/02 , H01P5/12 , H01P5/16
摘要： A substrate (1) is used as one tube wall (12) of a hollow waveguide (11), the substrate (1) including a strip line (2) wired in an inner layer, a first ground surface (3) formed on a front surface, and a second ground surface (4) formed on a part of a back surface. As a result of such a configuration, a waveguide strip line transducer having the same dimension as the external dimension of the hollow waveguide (11) can be obtained.

2. 发明公开

EP3503390A1 MULTI-BAND FILTER 有权
公开(公告)号：EP3503390A1
公开(公告)日：2019-06-26
申请号：EP16920970.7
申请日：2016-11-08
申请人： Mitsubishi Electric Corporation
发明人： YUASA, Takeshi , OSHIMA, Takeshi , AOYAMA, Hiroyuki
IPC分类号： H03H7/01 , H03H7/38 , H03H7/46 , H03H9/72
摘要： The multiband filter includes a printed circuit board (10), a first filter (20), a second filter (30) having an outer dimension different from that of the first filter (20) and passband frequencies higher than those of the first filter, an input terminal (61), an output terminal (62), a first inductor (50), a first capacitor (40), which are connected except the first capacitor by signal line conductor patterns (13) to form a first transmission line, which connect the second filter (30), the input terminal (61), the output terminal (62), and the first capacitor (40) to form a second transmission line, a part thereof in the first transmission line being arranged in an area on the printed circuit board (10), formed by the difference between the outer dimensions of the first and the second filters (20) and (30), to achieve desirable passbands and enough attenuation in a suppression band outside the passbands.

3. 发明授权

EP3125282B1 SURFACE-MOUNT HIGH-FREQUENCY CIRCUIT 有权
公开(公告)号：EP3125282B1
公开(公告)日：2019-01-30
申请号：EP14886877.1
申请日：2014-03-26
申请人： Mitsubishi Electric Corporation
发明人： YUASA, Takeshi , ISHIDA, Kiyoshi , TSUKAHARA, Yoshihiro , NISHIGUCHI, Kohei
IPC分类号： H01L23/66 , H01L23/482 , H05K1/02

4. 发明公开

EP2278657A1 POWER DIVIDER 有权
标题翻译： LEISTUNGSTEILER
公开(公告)号：EP2278657A1
公开(公告)日：2011-01-26
申请号：EP08740274.9
申请日：2008-04-11
申请人： Mitsubishi Electric Corporation
发明人： TAHARA, Yukihiro , YUASA, Takeshi , YONEDA, Naofumi
IPC分类号： H01P5/19 , H01P3/08
CPC分类号： H01P5/16
摘要： In cases where a power divider is constructed by using a multilayer substrate, a power divider is obtained which is smaller in size and has a good reflection property. The power divider according to the present invention is provided with a multilayer dielectric substrate (1), strip conductor patterns (2a through 2c) formed on one surface of the multilayer dielectric substrate (1), and a ground conductor pattern (3) formed on the other surface of the multilayer dielectric substrate (1), wherein a transmission line is composed of the dielectric substrate (1), the strip conductor patterns (2a through 2c) and the ground conductor pattern (3), and the transmission line has its one end branched to form a plurality of branch lines (12a, 12b), with an isolation resistance (4) being formed between the branch lines. A first capacitance forming part comprising a first pillar conductor (6a) and a first capacitance forming conductor pattern (5a), both formed in an interior of the dielectric substrate (1), is formed at a branch point (13) of said transmission line.
摘要翻译：在通过使用多层基板构成功率分配器的情况下，获得尺寸更小且反射性好的功率分配器。根据本发明的功率分配器设置有多层电介质基板（1），形成在多层电介质基板（1）的一个表面上的带状导体图案（2a至2c）和形成在多层电介质基板多层电介质基片（1）的另一个表面，其中传输线由电介质基片（1），带状导体图案（2a至2c）和接地导体图案（3）组成，传输线具有一端分支形成多条分支线（12a，12b），在分支线之间形成隔离电阻（4）。形成在电介质基板（1）的内部的形成有第一柱状导体（6a）和第一电容形成用导体图案（5a）的第一电容形成部形成在所述传输线的分支点（13）。

5. 发明公开

EP3125282A1 SURFACE-MOUNT HIGH-FREQUENCY CIRCUIT 有权
标题翻译： OBERFLÄCHENMONTIERTEHOCHFREQUENZSCHALTUNG
公开(公告)号：EP3125282A1
公开(公告)日：2017-02-01
申请号：EP14886877.1
申请日：2014-03-26
申请人： Mitsubishi Electric Corporation
发明人： YUASA, Takeshi , ISHIDA, Kiyoshi , TSUKAHARA, Yoshihiro , NISHIGUCHI, Kohei
IPC分类号： H01L21/60
CPC分类号： H01L23/66 , H01L23/481 , H01L23/49838 , H01L23/50 , H01L23/5283 , H01L24/02 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L2223/6683 , H01L2224/02331 , H01L2224/02371 , H01L2224/02372 , H01L2224/02375 , H01L2224/02377 , H01L2224/02379 , H01L2224/02381 , H01L2224/0401 , H01L2224/05569 , H01L2224/13024 , H01L2224/14131 , H01L2224/14133 , H01L2224/14135 , H01L2224/14136 , H01L2224/14156 , H01L2224/14177 , H01L2224/14515 , H01L2224/16227 , H05K1/0243 , H05K2201/10674 , H01L2924/00012
摘要： A surface mount high-frequency circuit is configured such that a plurality of ground pads 41 and a plurality of external connection ground conductors 51 are discretely disposed to surround a signal line pad 42 and an external connection signal line conductor 52, and a plurality of interlayer connection ground conductors 31 and that a plurality of columnar ground conductors 12 are discretely disposed to surround an interlayer connection signal line conductor 32. Thus, it is possible to suppress radiation of an unnecessary signal to the outside using a simple production process that is completed by only a wafer process without separately preparing a component such as a shield cover case.
摘要翻译：表面安装高频电路被配置为使得多个接地焊盘41和多个外部连接接地导体51离散地设置成围绕信号线焊盘42和外部连接信号线导体52，以及多个中间层连接接地导体31和多个柱状接地导体12离散地设置成围绕层间连接信号线导体32.因此，可以使用简单的制造过程来抑制对外部的不必要的信号的辐射，该简单的生产过程由仅仅是晶片工艺，而不需要单独地制备诸如屏蔽罩壳的部件。

6. 发明授权

EP2278657B1 POWER DIVIDER 有权
标题翻译：功分器
公开(公告)号：EP2278657B1
公开(公告)日：2013-08-14
申请号：EP08740274.9
申请日：2008-04-11
申请人： Mitsubishi Electric Corporation
发明人： TAHARA, Yukihiro , YUASA, Takeshi , YONEDA, Naofumi
IPC分类号： H01P5/19 , H01P3/08 , H01P5/16
CPC分类号： H01P5/16

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