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1. 发明公开

EP1083578A1 CONDUCTIVE PASTE, CERAMIC MULTILAYER SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC MULTILAYER SUBSTRATE 审中-公开
标题翻译：导电膏，陶瓷多层基板和制造陶瓷多层基板的方法
公开(公告)号：EP1083578A1
公开(公告)日：2001-03-14
申请号：EP00911434.9
申请日：2000-03-28
申请人： Matsushita Electric Industrial Co., Ltd. , Kyoto Elex Co., Ltd.
发明人： OCHI, Hiroshi , SEGAWA, Shigetoshi , BABA, Yasuyuki , SUEHIRO, Masatoshi, Kyoto Elex Co., Ltd. , OGURA, Shinichi, Kyoto Elex Co., ltd.
IPC分类号： H01B1/22 , H05K3/46 , H05K3/40 , H05K1/11
CPC分类号： H05K3/4061 , H01B1/22 , H01L21/486 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , H05K3/4629 , H05K2201/0272 , H01L2924/00
摘要： The present invention pertains to the art of ceramic multilayer substrates, and provides: a conductor paste to give a via conductor which has a low electric resistance value, and involves none of defects such as voids and cracks, and is excellent in quality properties; and a production process by which a ceramic multilayer substrate having excellent quality properties is produced using the above conductor paste.
A conductor paste 20 is plugged into a via hole 12 of a green sheet 10, and a thermal-shrinkage-inhibiting sheet 30 is laminated onto both faces of a green sheet laminate S, and the resultant product is sintered to obtain a ceramic multilayer substrate, with the result that the gap between sintering behaviors of the green sheet 10 and the conductor paste 20 becomes difficult to occur, wherein the conductor paste 20 comprises a conductor powder and an organic vehicle, but is free of glass frit, wherein not less than 95 weight % of the entire conductor powder is composed of an Ag powder having an average particle diameter of 3∼10 µm.
摘要翻译：本发明涉及陶瓷多层基板领域，提供一种导体膏，其制造电阻值低，且不存在空隙，裂纹等缺陷，品质特性优异的过孔导体，以及使用上述导体膏制作品质特性优异的陶瓷多层基板的制造方法。将导体膏20插入到生片10的通孔12中，并且将热收缩抑制片30层压到生片层叠体S的两个面上，并且将所得产物烧结以获得陶瓷多层基底其结果是生片10和导体膏20的烧结行为之间的间隙变得难以发生，其中导体膏20包括导体粉末和有机载体，但不含玻璃料，其中不小于全部导体粉末的95重量％由平均粒径为3〜10μm的Ag粉末构成。

2. 发明授权

EP1120214B1 SHEET RETAINER FOR PUNCHING CERAMIC GREEN SHEET AND PUNCHING DEVICE 有权
标题翻译：表约束装置用于穿透陶瓷生膜和穿孔机
公开(公告)号：EP1120214B1
公开(公告)日：2006-10-04
申请号：EP00915450.1
申请日：2000-04-10
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： OCHI, Hiroshi , SEGAWA, Shigetoshi
IPC分类号： B28B11/12 , B26F1/00 , H05K3/00 , B26F1/02 , B26D7/02
CPC分类号： B26D7/025 , B26F1/02 , B26F2210/08 , B28B11/12 , H05K1/0306 , H05K3/005 , H05K2201/0133 , H05K2203/0165 , H05K2203/0195 , Y10T83/2157 , Y10T83/2172
摘要： A sheet retainer (40) which assuredly prevents a green sheet from being moved, deformed, or damaged in punching by improving the material and shape of the sheet retainer (40) that is installed on a punching tool (30) having a punching blade part (32) for punching through-holes in a ceramic green sheet (20), and which is made of an elastic material having a hardness of 50 to 60°, comprising a supporting part (46) which is disposed on one end side in axial direction, relatively larger in outside diameter and thicker in radial direction, and lockingly fitted to the punching tool (30), a contact part (42) which is disposed on the other side in axial direction, relatively smaller in outside diameter, thinner in radial direction, and in contact with the green sheet (20), and a storing hole (48) which extends from the contact part (42) in axial direction and in which the punching blade part (32) is stored.

3. 发明公开

EP1094694A1 METHOD OF MANUFACTURING METHOD OF CERAMIC MULTILAYER BOARD 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLUNG EINER KERAMISCHEN MEHRSCHICHTIGEN PLATTE
公开(公告)号：EP1094694A1
公开(公告)日：2001-04-25
申请号：EP00911314.3
申请日：2000-03-23
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： SEGAWA, Shigetoshi , OCHI, Hiroshi
IPC分类号： H05K3/46
CPC分类号： H05K3/4611 , H01L21/4807
摘要： As a result of the disclosure made in the present invention, a multi-layer ceramic substrate with a provision to prevent delaminating and bulging in lamination from occurring is allowed to be realized. The present invention discloses a manufacturing method of multilayer ceramic substrates comprising the steps of applying a pressing force to a ceramic green sheet laminate with a through hole formed therein and an exterior sheet disposed on both surfaces of the laminate, respectively, and firing the resulting pressed laminate. The exterior sheet has a connecting channel leading to the through hole. When a pressing force is applied to the laminate, air existing in the through hole is let out to outside via the connecting channel.
摘要翻译：作为本发明的公开内容的结果，允许实现防止层叠中的分层和凸起发生的多层陶瓷基板。本发明公开了一种多层陶瓷基板的制造方法，其特征在于，具有以下步骤：向形成有通孔的陶瓷生片层合体施加按压力，分别设置在层叠体的两面上的外板，层压板。外部片材具有通向通孔的连接通道。当对层叠体施加按压力时，存在于通孔中的空气经由连接通道排出到外部。

4. 发明公开

EP0993242A1 METHOD OF PRODUCING CERAMIC MULTILAYER SUBSTRATE 有权
标题翻译： VERFAHREN ZUR HERSTELLUNG EINES KERAMISCHEN MEHRSCHICHTIGEN SUBSTRATS
公开(公告)号：EP0993242A1
公开(公告)日：2000-04-12
申请号：EP99913716.9
申请日：1999-04-19
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： SEGAWA, Shigetoshi , OCHI, Hiroshi , BABA, Yasuyuki , SHIRAISHI, Osamu , KONISHI, Masao
IPC分类号： H05K3/46
CPC分类号： H05K3/0044 , H01L21/481 , H01L21/4857 , H01L21/4864 , H05K1/0306 , H05K2203/025 , H05K2203/0746
摘要： A method for manufacturing a multi-layered ceramic substrate which enables to remove a shrinkage suppression sheet without damaging the multi-layered substrate. The shrinkage suppression sheets are formed on both faces of unfired laminated green sheets, and then the laminated green sheets are fired. For removing the shrinkage suppression sheets on both faces of the multi-layered ceramic substrate 2 after sintering, water, ceramic powder, or water and ceramic powder mixture is sprayed together with compressed air.
摘要翻译：一种多层陶瓷基板的制造方法，其能够在不损害多层基板的情况下除去收缩抑制片。在未烧结的层叠生片的两面上形成收缩抑制片，然后烧结层叠的生片。为了在烧结之后除去多层陶瓷基板2的两面的收缩抑制片，将水，陶瓷粉末或水和陶瓷粉末混合物与压缩空气一起喷雾。

5. 发明公开

EP1232677A2 FLIP CHIP PACKAGE, CIRCUIT BOARD THEREOF AND PACKAGING METHOD THEREOF 有权
标题翻译： FLIP-CHIP住房，SCHALTPLATTE及其包装方法
公开(公告)号：EP1232677A2
公开(公告)日：2002-08-21
申请号：EP01951916.4
申请日：2001-07-18
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： MORIMOTO, Kenji , OCHI, Hiroshi
IPC分类号： H05K1/11 , H05K3/32 , H05K3/06 , H05K1/09 , H01L21/48 , H01L21/60
CPC分类号： H01L24/16 , H01L24/29 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13016 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/45144 , H01L2224/81903 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/3025 , H05K1/092 , H05K1/111 , H05K3/02 , H05K3/321 , H05K2201/0367 , H05K2201/098 , H05K2201/10674 , H05K2203/0514 , H01L2924/00015 , H01L2924/00 , H01L2224/05599
摘要： According to the present invention, when a semiconductor element (7) having protruding electrodes (5) formed thereon is connected to a circuit board (1) via conductive resin (6), stable connection is made even when an electrode pitch is small on the semiconductor element (7). On semiconductor element package regions on the circuit board (1), a paste electrode material (2) containing photopolymerizable materials is printed to form a film having a prescribed thickness, and this electrode material film (2) is baked after exposure and development thereof so as to obtain circuit electrodes (4) having edges warped in a direction of going apart from the circuit board (1) surface. Then, the protruding electrodes (5) and the concave surfaces of the circuit electrodes (4) are brought in abutment with each other and connected via the conductive resin (6) which surrounds the abutments between the respective electrodes and is held on the concave surfaces of the circuit electrodes (4). With this arrangement, the concave surfaces of the circuit electrodes (4) act as saucers and prevent the conductive resin (6) from being squeezed out, thereby eliminating possible occurrence of short circuits.

6. 发明公开

EP1100298A1 CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURE THEREOF 审中-公开
标题翻译： VERFAHREN ZU DEREN HERSTELLUNG的KERAMISCHE LEITERPLATTE
公开(公告)号：EP1100298A1
公开(公告)日：2001-05-16
申请号：EP00917296.6
申请日：2000-04-12
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： SEGAWA, Shigetoshi , OCHI, Hiroshi
IPC分类号： H05K3/40 , H05K1/11 , H05K1/09 , H05K3/12 , H05K3/24
CPC分类号： H01L21/486 , H05K1/0306 , H05K3/248 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/035
摘要： A method of manufacturing a ceramic board includes two process steps; applying a first conductor paste in a recess occurred in each via-hole of the ceramic substrate after conductor materials are filled in the via-holes and fired, and forming a surface circuit by printing a second conductor paste for forming the surface circuit. A viscosity of the first conductor paste is lower than that of the second conductor paste. With the prevent invention, there is good conduction between the surface circuit and the conductor in each via-hole, and further a printing pattern of the surface circuit around each via-hole has high accuracy. As a result, the highly reliable ceramic circuit board, which is adequate to a high-density circuit, can be provided.
摘要翻译：制造陶瓷板的方法包括两个工艺步骤：在将导体材料填充到通孔中之后，在陶瓷基板的每个通孔中施加第一导体膏在凹部中发生烧结，并通过印刷用于形成表面电路的第二导体糊形成表面电路。第一导体糊的粘度低于第二导体糊的粘度。通过防止发明，每个通孔中的表面电路和导体之间具有良好的导通性，并且每个通孔周围的表面电路的印刷图案也具有高精度。结果，可以提供足够高密度电路的高度可靠的陶瓷电路板。

7. 发明公开

EP1120214A1 SHEET RETAINER FOR PUNCHING CERAMIC GREEN SHEET AND PUNCHING DEVICE 有权
标题翻译：印度尼西亚印度尼西亚印度尼西亚印度尼西亚印度尼西亚印度尼西亚印度尼西亚印度尼西亚印度尼西亚印度尼西亚
公开(公告)号：EP1120214A1
公开(公告)日：2001-08-01
申请号：EP00915450.1
申请日：2000-04-10
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： OCHI, Hiroshi , SEGAWA, Shigetoshi
IPC分类号： B28B11/12 , B26F1/00 , H05K3/00
CPC分类号： B26D7/025 , B26F1/02 , B26F2210/08 , B28B11/12 , H05K1/0306 , H05K3/005 , H05K2201/0133 , H05K2203/0165 , H05K2203/0195 , Y10T83/2157 , Y10T83/2172
摘要： Move, deformation, or damages of a green sheet can be securely prevented by improvement of the material and shape of a green sheet presser 40 affixed to a punching tool 30 provided with a cutter section 32 for punching a via hole on a ceramic green sheet 20. The sheet presser 40 of the present invention is composed of an elastic material with hardness between 50 to 60 degrees, and comprises: a support portion 46 disposed on one end in the axial direction with a relatively large outer diameter, thick-walled in the radial direction, and engageable in the punching tool 30; a contact portion 42 disposed on the other end in the axial direction with a relatively small outer diameter, thin-walled in the radial direction, and comes in contact with the green sheet 20; and a housing hole 48 axially extending from the contact portion 42 for housing the cutter section 32.
摘要翻译：通过改进固定在冲压工具30上的生坯压板40的材料和形状，可以可靠地防止生坯的移动，变形或损坏，该切割工具30具有用于冲压陶瓷生坯片20上的通孔的切割部32 本发明的压纸机40由硬度在50〜60度之间的弹性材料构成，其特征在于，包括：支撑部46，其在轴向一端具有较大的外径，厚壁的径向，并且可接合在冲压工具30中; 接触部分42，其沿轴向另一端设置有相对较小的外径，在径向方向上薄壁，并与生片20接触; 以及从接触部分42轴向延伸以容纳切割器部分32的容纳孔48

8. 发明公开

EP1038418A1 MANUFACTURING METHOD OF WIRING CIRCUIT BOARD, AND WIRING CIRCUIT BOARD 审中-公开
标题翻译：一种用于生产电路板和维持BOARD
公开(公告)号：EP1038418A1
公开(公告)日：2000-09-27
申请号：EP99970262.4
申请日：1999-10-07
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： OCHI, Hiroshi , SEGAWA, Shigetoshi
IPC分类号： H05K3/02 , H01L21/48
CPC分类号： H05K3/02 , H01L21/4846
摘要： Fine lines of line width of 40 νm or less are obtained stably without defect on a ceramic substrate, and hence a circuit board of high density and high precision is obtained. The method comprises the steps of: (a) fabricating a ceramic substrate (2), (b) polishing the surface (28) of the ceramic substrate (2) to surface roughness Ra of 0.5 νm or less, (c) forming a photosensitive conductor layer (3a) on the surface of the ceramic substrate (2a), and (d) processing the photosensitive conductor layer (3a) by photolithography, and forming a specified wiring pattern (38). Herein, supposing the roughness curve to be Y = f (x), the extracting length of the roughness curve in the center line direction to be L, the central axis of the extracting portion to be X-axis, and the direction vertical to the X-axis to be Y-axis, Ra is the value calculated in the formula (I).

9. 发明授权

EP0993242B1 METHOD OF PRODUCING CERAMIC MULTILAYER SUBSTRATE 有权
标题翻译：法生产陶瓷多层基板的
公开(公告)号：EP0993242B1
公开(公告)日：2007-06-20
申请号：EP99913716.9
申请日：1999-04-19
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： SEGAWA, Shigetoshi , OCHI, Hiroshi , BABA, Yasuyuki , SHIRAISHI, Osamu , KONISHI, Masao
IPC分类号： H05K3/46 , H01L21/48
CPC分类号： H05K3/0044 , H01L21/481 , H01L21/4857 , H01L21/4864 , H05K1/0306 , H05K2203/025 , H05K2203/0746
摘要： A method of producing a ceramic multilayer substrate, comprising providing both sides of a stack of unfired green sheets with shrinkage-suppressing sheets, firing the stack to produce a multilayer body, compressed air and water, or a ceramic powder, or a mixture of water and a ceramic powder is sprayed against the multilayer body to remove the shrinkage-suppressing sheets from both sides without damaging the multilayer substrate.

10. 发明公开

EP1024022A1 PLATE FOR SCREEN PRINTING AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：西班牙广播电台DAFÜR
公开(公告)号：EP1024022A1
公开(公告)日：2000-08-02
申请号：EP99925281.0
申请日：1999-05-27
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： OCHI, Hiroshi , BABA, Yasuyuki , SEGAWA, Shigetoshi , SHIGEMI, Jun , MURAKAMI, Taizo , NAGAO, Fumitaka
IPC分类号： B41N1/24 , B41C1/14
CPC分类号： H05K3/1225 , B41C1/141 , B41N1/247
摘要： The present invention provides:

a screen printing plate that is produced through an easy punching process at low costs in a short period, and that makes it possible to easily carry out a printing process even on a base member such as a semiconductor wafer that is susceptible to scratches;
a screen printing plate characterized in that a sheet made of at least one kind of resin selected from the group consisting of polyimide resins, polyetherimide resins and polyphenylenesulfide resins is subjected to a punching process by a numerically controlled punching machine, and is set on or over, or in a screen frame; and
a manufacturing method of a screen printing plate characterized in that, after a sheet made from at least one kind of resin selected from the group consisting of polyimide resins, polyetherimide resins and polyphenylenesulfide resins is set on or over, or in a screen frame, the resin sheet is subjected to a punching process by a numerically controlled punching machine, or after the sheet is clamped along its peripheral portion with a tension being applied thereto, the resin sheet is subjected to a punching process by a numerically controlled punching machine, and then set on or over, or in a screen frame.
摘要翻译：本发明提供：一种丝网印刷板，其通过在短时间内以低成本进行的易冲压加工而制造，并且能够容易地进行印刷工序，即使在易受影响的半导体晶片等基材划伤丝网印刷板，其特征在于，由选自聚酰亚胺树脂，聚醚酰亚胺树脂和聚苯硫醚树脂中的至少一种树脂制成的片材通过数控冲孔机进行冲压加工，并设置在或超过，或在屏幕框架中; 以及丝网印刷板的制造方法，其特征在于，在从由聚酰亚胺树脂，聚醚酰亚胺树脂和聚苯硫醚树脂组成的组中选择的至少一种树脂制成的片材设置在上面或上面，或者在筛网框架中，树脂片材通过数控冲压机进行冲压加工，或者在施加张力的情况下沿着其周边部夹持片材之后，通过数控冲压机进行冲压加工，然后设置在或超过，或在屏幕框架中。

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