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1. 发明公开

EP1038419A1 MANUFACTURING METHOD OF CIRCUIT BOARD, MANUFACTURING APPARATUS FOR IT, AND POROUS SHEET USED IN IT 有权
标题翻译：一种用于生产电路板装置并ITS中使用多孔膜
公开(公告)号：EP1038419A1
公开(公告)日：2000-09-27
申请号：EP99970264.0
申请日：1999-10-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： SEGAWA, Shigetoshi , BABA, Yasuyuki , ISHIKAWA, Katsuyoshi , IHARA, Kazuhiko
IPC分类号： H05K3/40 , B41F15/20
CPC分类号： H05K3/4061 , B41F15/20 , B41P2215/134 , H05K3/1216 , H05K3/4053 , H05K2201/0116 , H05K2201/0284 , H05K2203/0152 , H05K2203/0156 , H05K2203/082 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： The manufacturing method comprises: (a) a process of feeding a printing stage having a porous member (2) permeable in the direction of thickness; (b) a process of placing a plate (1) for circuit board having pierced holes (6) above said porous member (2); and (c) a process of filling a conductive material (5) in said pierced holes (6) from the upper side of said plate (1) for circuit board by sucking said porous member (2) at prescribed vacuum pressure from the back side of said porous member (2). Said porous member (2) has a porous plate (8) permeable in the direction of thickness and a porous sheet (9) permeable in the direction of thickness placed on said porous plate (8), and said plate (1) is placed on the upper side of said porous sheet (9). Said porous sheet (9) is replaceable and, moreover, a process of replacing said porous sheet is provided. Said porous sheet (9) contains cellulose in the range of approximately 90 wt.% to approximately 98 wt.%, and said cellulose contains softwood kraft pulp in the range of approximately 20 wt.% to approximately 40 wt.% and hardwood kraft pulp in the range of approximately 60 wt.% to approximately 80 wt.%.

2. 发明公开

EP0993242A1 METHOD OF PRODUCING CERAMIC MULTILAYER SUBSTRATE 有权
标题翻译： VERFAHREN ZUR HERSTELLUNG EINES KERAMISCHEN MEHRSCHICHTIGEN SUBSTRATS
公开(公告)号：EP0993242A1
公开(公告)日：2000-04-12
申请号：EP99913716.9
申请日：1999-04-19
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： SEGAWA, Shigetoshi , OCHI, Hiroshi , BABA, Yasuyuki , SHIRAISHI, Osamu , KONISHI, Masao
IPC分类号： H05K3/46
CPC分类号： H05K3/0044 , H01L21/481 , H01L21/4857 , H01L21/4864 , H05K1/0306 , H05K2203/025 , H05K2203/0746
摘要： A method for manufacturing a multi-layered ceramic substrate which enables to remove a shrinkage suppression sheet without damaging the multi-layered substrate. The shrinkage suppression sheets are formed on both faces of unfired laminated green sheets, and then the laminated green sheets are fired. For removing the shrinkage suppression sheets on both faces of the multi-layered ceramic substrate 2 after sintering, water, ceramic powder, or water and ceramic powder mixture is sprayed together with compressed air.
摘要翻译：一种多层陶瓷基板的制造方法，其能够在不损害多层基板的情况下除去收缩抑制片。在未烧结的层叠生片的两面上形成收缩抑制片，然后烧结层叠的生片。为了在烧结之后除去多层陶瓷基板2的两面的收缩抑制片，将水，陶瓷粉末或水和陶瓷粉末混合物与压缩空气一起喷雾。

3. 发明授权

EP0993242B1 METHOD OF PRODUCING CERAMIC MULTILAYER SUBSTRATE 有权
标题翻译：法生产陶瓷多层基板的
公开(公告)号：EP0993242B1
公开(公告)日：2007-06-20
申请号：EP99913716.9
申请日：1999-04-19
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： SEGAWA, Shigetoshi , OCHI, Hiroshi , BABA, Yasuyuki , SHIRAISHI, Osamu , KONISHI, Masao
IPC分类号： H05K3/46 , H01L21/48
CPC分类号： H05K3/0044 , H01L21/481 , H01L21/4857 , H01L21/4864 , H05K1/0306 , H05K2203/025 , H05K2203/0746
摘要： A method of producing a ceramic multilayer substrate, comprising providing both sides of a stack of unfired green sheets with shrinkage-suppressing sheets, firing the stack to produce a multilayer body, compressed air and water, or a ceramic powder, or a mixture of water and a ceramic powder is sprayed against the multilayer body to remove the shrinkage-suppressing sheets from both sides without damaging the multilayer substrate.

4. 发明公开

EP1024022A1 PLATE FOR SCREEN PRINTING AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：西班牙广播电台DAFÜR
公开(公告)号：EP1024022A1
公开(公告)日：2000-08-02
申请号：EP99925281.0
申请日：1999-05-27
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： OCHI, Hiroshi , BABA, Yasuyuki , SEGAWA, Shigetoshi , SHIGEMI, Jun , MURAKAMI, Taizo , NAGAO, Fumitaka
IPC分类号： B41N1/24 , B41C1/14
CPC分类号： H05K3/1225 , B41C1/141 , B41N1/247
摘要： The present invention provides:

a screen printing plate that is produced through an easy punching process at low costs in a short period, and that makes it possible to easily carry out a printing process even on a base member such as a semiconductor wafer that is susceptible to scratches;
a screen printing plate characterized in that a sheet made of at least one kind of resin selected from the group consisting of polyimide resins, polyetherimide resins and polyphenylenesulfide resins is subjected to a punching process by a numerically controlled punching machine, and is set on or over, or in a screen frame; and
a manufacturing method of a screen printing plate characterized in that, after a sheet made from at least one kind of resin selected from the group consisting of polyimide resins, polyetherimide resins and polyphenylenesulfide resins is set on or over, or in a screen frame, the resin sheet is subjected to a punching process by a numerically controlled punching machine, or after the sheet is clamped along its peripheral portion with a tension being applied thereto, the resin sheet is subjected to a punching process by a numerically controlled punching machine, and then set on or over, or in a screen frame.
摘要翻译：本发明提供：一种丝网印刷板，其通过在短时间内以低成本进行的易冲压加工而制造，并且能够容易地进行印刷工序，即使在易受影响的半导体晶片等基材划伤丝网印刷板，其特征在于，由选自聚酰亚胺树脂，聚醚酰亚胺树脂和聚苯硫醚树脂中的至少一种树脂制成的片材通过数控冲孔机进行冲压加工，并设置在或超过，或在屏幕框架中; 以及丝网印刷板的制造方法，其特征在于，在从由聚酰亚胺树脂，聚醚酰亚胺树脂和聚苯硫醚树脂组成的组中选择的至少一种树脂制成的片材设置在上面或上面，或者在筛网框架中，树脂片材通过数控冲压机进行冲压加工，或者在施加张力的情况下沿着其周边部夹持片材之后，通过数控冲压机进行冲压加工，然后设置在或超过，或在屏幕框架中。

5. 发明授权

EP1038419B1 MANUFACTURING METHOD OF CIRCUIT BOARD, MANUFACTURING APPARATUS FOR IT, AND POROUS SHEET USED IN IT 有权
标题翻译：一种用于生产电路板装置并ITS中使用多孔膜
公开(公告)号：EP1038419B1
公开(公告)日：2006-04-05
申请号：EP99970264.0
申请日：1999-10-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： SEGAWA, Shigetoshi , BABA, Yasuyuki , ISHIKAWA, Katsuyoshi , IHARA, Kazuhiko
IPC分类号： H05K3/40 , B41F15/20
CPC分类号： H05K3/4061 , B41F15/20 , B41P2215/134 , H05K3/1216 , H05K3/4053 , H05K2201/0116 , H05K2201/0284 , H05K2203/0152 , H05K2203/0156 , H05K2203/082 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： The manufacturing method comprises: (a) a process of feeding a printing stage having a porous member (2) permeable in the direction of thickness; (b) a process of placing a plate (1) for circuit board having pierced holes (6) above said porous member (2); and (c) a process of filling a conductive material (5) in said pierced holes (6) from the upper side of said plate (1) for circuit board by sucking said porous member (2) at prescribed vacuum pressure from the back side of said porous member (2). Said porous member (2) has a porous plate (8) permeable in the direction of thickness and a porous sheet (9) permeable in the direction of thickness placed on said porous plate (8), and said plate (1) is placed on the upper side of said porous sheet (9). Said porous sheet (9) is replaceable and, moreover, a process of replacing said porous sheet is provided. Said porous sheet (9) contains cellulose in the range of approximately 90 wt.% to approximately 98 wt.%, and said cellulose contains softwood kraft pulp in the range of approximately 20 wt.% to approximately 40 wt.% and hardwood kraft pulp in the range of approximately 60 wt.% to approximately 80 wt.%.

6. 发明公开

EP1083578A1 CONDUCTIVE PASTE, CERAMIC MULTILAYER SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC MULTILAYER SUBSTRATE 审中-公开
标题翻译：导电膏，陶瓷多层基板和制造陶瓷多层基板的方法
公开(公告)号：EP1083578A1
公开(公告)日：2001-03-14
申请号：EP00911434.9
申请日：2000-03-28
申请人： Matsushita Electric Industrial Co., Ltd. , Kyoto Elex Co., Ltd.
发明人： OCHI, Hiroshi , SEGAWA, Shigetoshi , BABA, Yasuyuki , SUEHIRO, Masatoshi, Kyoto Elex Co., Ltd. , OGURA, Shinichi, Kyoto Elex Co., ltd.
IPC分类号： H01B1/22 , H05K3/46 , H05K3/40 , H05K1/11
CPC分类号： H05K3/4061 , H01B1/22 , H01L21/486 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , H05K3/4629 , H05K2201/0272 , H01L2924/00
摘要： The present invention pertains to the art of ceramic multilayer substrates, and provides: a conductor paste to give a via conductor which has a low electric resistance value, and involves none of defects such as voids and cracks, and is excellent in quality properties; and a production process by which a ceramic multilayer substrate having excellent quality properties is produced using the above conductor paste.
A conductor paste 20 is plugged into a via hole 12 of a green sheet 10, and a thermal-shrinkage-inhibiting sheet 30 is laminated onto both faces of a green sheet laminate S, and the resultant product is sintered to obtain a ceramic multilayer substrate, with the result that the gap between sintering behaviors of the green sheet 10 and the conductor paste 20 becomes difficult to occur, wherein the conductor paste 20 comprises a conductor powder and an organic vehicle, but is free of glass frit, wherein not less than 95 weight % of the entire conductor powder is composed of an Ag powder having an average particle diameter of 3∼10 µm.
摘要翻译：本发明涉及陶瓷多层基板领域，提供一种导体膏，其制造电阻值低，且不存在空隙，裂纹等缺陷，品质特性优异的过孔导体，以及使用上述导体膏制作品质特性优异的陶瓷多层基板的制造方法。将导体膏20插入到生片10的通孔12中，并且将热收缩抑制片30层压到生片层叠体S的两个面上，并且将所得产物烧结以获得陶瓷多层基底其结果是生片10和导体膏20的烧结行为之间的间隙变得难以发生，其中导体膏20包括导体粉末和有机载体，但不含玻璃料，其中不小于全部导体粉末的95重量％由平均粒径为3〜10μm的Ag粉末构成。

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