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1. 发明公开

EP0430623A2 Non-cyanide electrode cleaning process 有权
标题翻译： ReinigungsverfahrenfürElektroden ohne Zyanid。
公开(公告)号：EP0430623A2
公开(公告)日：1991-06-05
申请号：EP90312836.1
申请日：1990-11-26
申请人： MOTOROLA, INC.
发明人： Asher, Reginald K. , Lim, Beng Lian , Endicott, Duane W.
IPC分类号： H01L21/48 , C25F5/00
CPC分类号： C25F1/00 , C25F5/00 , H01L21/4835 , H01L2224/48247 , H01L2224/85011
摘要： An electrolytic process (70) employing a water solution of metal lactates or lactic acid and metal hydroxides, rapidly and safely removes metal plating bleed (42), residual oxides , stains or the like (39), plastic flash (36), resin bleed (36) and deflashing media (38), from electrodes (16) of electronic devices. Anodic etching (72) or a combination of cathodic (82) and anodic (72) etching (72) is preferred. Noble metals are selectively removed without cyanide compounds. For example, excess silver from spot plating on copper leadframes is etched away 2-3 times faster than the underlying copper. After cleaning the device leads (16) are bright, polished, stain-free and without scale, residual plating bleed (42), deflashing media (38), plastic flash or resin bleed (36). The process is effective, less hazardous, easy to use and economical.
摘要翻译：使用金属乳酸盐或乳酸和金属氢氧化物的水溶液的电解方法（70）快速且安全地除去金属电镀液（42），残余氧化物，污渍等（39），塑料闪光（36），树脂渗色（36）和去屑介质（38），从电子设备的电极（16）。阳极蚀刻（72）或阴极（82）和阳极（72）蚀刻（72）的组合是优选的。有选择地去除贵金属，没有氰化物。例如，铜引线框上的电镀过量的银被蚀刻掉比底层铜快2-3倍。清洁后，设备引线（16）光亮，抛光，无污染，无刻度，残留电镀放电（42），除屑介质（38），塑料闪光或树脂渗出（36）。该过程有效，危害小，易于使用和经济。

2. 发明授权

EP0430623B1 Non-cyanide electrode cleaning process 有权
标题翻译：清洗程序没有氰化物电极
公开(公告)号：EP0430623B1
公开(公告)日：1997-08-06
申请号：EP90312836.1
申请日：1990-11-26
申请人： MOTOROLA, INC.
发明人： Asher, Reginald K. , Lim, Beng Lian , Endicott, Duane W.
IPC分类号： H01L21/48 , C25F5/00
CPC分类号： C25F1/00 , C25F5/00 , H01L21/4835 , H01L2224/48247 , H01L2224/85011

3. 发明公开

EP0430623A3 Non-cyanide electrode cleaning process 有权
标题翻译：非氰化物电极清洗工艺
公开(公告)号：EP0430623A3
公开(公告)日：1991-09-25
申请号：EP90312836.1
申请日：1990-11-26
申请人： MOTOROLA, INC.
发明人： Asher, Reginald K. , Lim, Beng Lian , Endicott, Duane W.
IPC分类号： H01L21/48 , C25F5/00
CPC分类号： C25F1/00 , C25F5/00 , H01L21/4835 , H01L2224/48247 , H01L2224/85011
摘要： An electrolytic process (70) employing a water solution of metal lactates or lactic acid and metal hydroxides, rapidly and safely removes metal plating bleed (42), residual oxides , stains or the like (39), plastic flash (36), resin bleed (36) and deflashing media (38), from electrodes (16) of electronic devices. Anodic etching (72) or a combination of cathodic (82) and anodic (72) etching (72) is preferred. Noble metals are selectively removed without cyanide compounds. For example, excess silver from spot plating on copper leadframes is etched away 2-3 times faster than the underlying copper. After cleaning the device leads (16) are bright, polished, stain-free and without scale, residual plating bleed (42), deflashing media (38), plastic flash or resin bleed (36). The process is effective, less hazardous, easy to use and economical.

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