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    • 4. 发明公开
    • Resin composition
    • 树脂组合物
    • EP0369598A2
    • 1990-05-23
    • EP89310462.0
    • 1989-10-12
    • MITSUBISHI CHEMICAL CORPORATIONTOYOTA JIDOSHA KABUSHIKI KAISHA
    • Shibuya, NobuhiroNishio, Takeyoshi
    • C08L23/02C08L71/12C08L53/02
    • C08L23/02C08L71/123Y10S525/905C08L2666/24C08L2666/22C08L2666/04
    • A resin compostion comprises from 20 to 77 wt.% of polyolefin (A); from 20 to 77 wt.% of polyphenylene ether resin (B); from 2 to 50 wt.% of polymer (C) having an alkenyl aromatic compound polymer chain (C1) and an aliphatic hydrocarbon chain (C2) in the same molecule, and also having a dynamic shearing modulus of elasticity G′ of at least 3 x 10⁸ dyn/cm²; and from 1 to 25 wt.% of an ester group containing ethylene copolymer (D) being a copolymer olefin comprising ethylene as principal component together with 8 to 43 wt.% of an unsaturated ester of the formula:
      in which R¹ is a saturated C₁-C₅₀ hydrocarbon group containing or not containing an oxygen atom, an alicyclic hydrocarbon group or an aromatic hydrocarbon group; R2 is a hydrogen atom or a methyl group; and X and Y together are such that one of them is a direct bond and the other is an oxygen atom.
    • 树脂组合物包含20至77重量%的聚烯烃(A); 20〜77重量%的聚苯醚树脂(B); 2至50重量%的在同一分子中具有链烯基芳族化合物聚合物链(C1)和脂肪族烃链(C2)的聚合物(C),并且还具有至少3的弹性动态剪切模量G' ×10 6 dyn / cm 2; 和1至25重量%的含酯基的乙烯共聚物(D),它是一种包含乙烯作为主要组分的共聚物烯烃以及8至43%(重量)的下式不饱和酯:其中R 1是饱和的C 1 含有或不含有氧原子,脂环族烃基或芳香族烃基的-C 50烃基; R2是氢原子或甲基; 并且X和Y一起是其中一个是直接键而另一个是氧原子。