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1. 发明公开

EP3979409A1 HIGH GAIN AND FAN BEAM ANTENNA STRUCTURES AND ASSOCIATED ANTENNA-IN-PACKAGE 审中-实审
公开(公告)号：EP3979409A1
公开(公告)日：2022-04-06
申请号：EP21193939.2
申请日：2021-08-31
申请人： MEDIATEK Inc.
发明人： DHARA, Debapratim , CHIU, Shih-Chia , LU, Yen-Ju , LIN, Sheng-Mou
IPC分类号： H01Q1/22 , H01Q13/10 , H01Q21/08 , H01Q1/32
摘要： An antenna structure (100) includes a radiative antenna element (110) disposed in a first conductive layer and a reference ground plane (120), disposed in a second conductive layer under the first conductive layer. The radiative antenna element (110) is loaded with a plurality of slots (SL-1 ∼ SL-6) and is electrically connected to the reference ground plane (120) through a plurality of vias (33), and the vias (33) are placed along a first line of the radiative antenna element (110) and the slots (SL-1 ∼ SL-6) are placed along a second line perpendicular to the first line.

2. 发明公开

EP3477767A1 ANTENNA-IN-PACKAGE WITH BETTER ANTENNA PERFORMANCE 有权
公开(公告)号：EP3477767A1
公开(公告)日：2019-05-01
申请号：EP18200638.7
申请日：2018-10-16
申请人： MEDIATEK INC.
发明人： LU, Yen-Ju , WU, Wen-Chou
IPC分类号： H01Q1/22 , H01Q1/48 , H01Q1/52 , H01Q9/26 , H01Q21/06 , H01Q21/12
摘要： An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer. The interface layer includes an antenna layer, and an insulating layer between the antenna layer and the ground reflector layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge.

3. 发明公开

EP3885773A1 TEST KIT FOR TESTING A DEVICE UNDER TEST 有权转让
公开(公告)号：EP3885773A1
公开(公告)日：2021-09-29
申请号：EP21164990.0
申请日：2021-03-25
申请人： MediaTek Inc.
发明人： LEI, Sheng-Wei , WEI, Chang-Lin , SHIH, Ying-Chou , KAO, Yeh-Chun , LU, Yen-Ju , TSENG, Po-Sen
IPC分类号： G01R1/04 , G01R31/28
摘要： A test kit for testing a device under test, DUT, (130) includes a socket structure for containing the DUT (130). The DUT includes an antenna (AT) and radiates a RF signal. The test kit further includes a reflector (230) having a lower surface (230b). The RF signal emitted from the antenna (AT) of the DUT (130) is reflected by the reflector (230) and a reflected RF signal is received by the antenna (AT) of the DUT (130).

4. 发明公开

EP3553535A1 WIRELESS TEST SYSTEM FOR TESTING MICROELECTRONIC DEVICES INTEGRATED WITH ANTENNA 有权转让
公开(公告)号：EP3553535A1
公开(公告)日：2019-10-16
申请号：EP19168120.4
申请日：2019-04-09
申请人： MediaTek Inc.
发明人： LIU, Chih-Yang , SHIH, Ying-Chou , LU, Yen-Ju , HUNG, Chih-Ming , HSU, Jui-Lin
IPC分类号： G01R1/04 , G01R31/28 , G01R31/302
摘要： A wireless test system (1a) includes a load board (10) having an upper surface (10a) and a lower surface (10b). The load board (10) has a testing antenna (121) disposed on the load board (10). A socket (30) for receiving a device under test, DUT, (100) having an antenna structure (101) therein is disposed on the upper surface (10a) of the load board (10). The antenna structure (101) is aligned with the testing antenna (121) . The wireless test system (1a) further includes a handler (50) for picking up and delivering the DUT (100) to the socket (30). The handler (50) has a clamp (502) for holding and pressing the DUT (100). The clamp (502) is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT (100) from an upward direction to a downward direction toward the testing antenna (121).

5. 发明公开

EP3486943A1 SEMICONDUCTOR PACKAGE 审中-公开
公开(公告)号：EP3486943A1
公开(公告)日：2019-05-22
申请号：EP18205196.1
申请日：2018-11-08
申请人： MediaTek Inc
发明人： HSU, Wen-Sung , CHENG, Tao , CHEN, Nan-Cheng , CHOU, Che-Ya , WU, Wen-Chou , LU, Yen-Ju , HUNG, Chih-Ming , HSU, Wei-Hsiu
IPC分类号： H01L23/538 , H01L25/10
摘要： A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.

6. 发明公开

EP3474370A1 ANTENNA-IN-PACKAGE WITH FREQUENCY-SELECTIVE SURFACE STRUCTURE 有权转让
公开(公告)号：EP3474370A1
公开(公告)日：2019-04-24
申请号：EP18198837.9
申请日：2018-10-05
申请人： MEDIATEK INC.
发明人： CHIU, Shih-Chia , LU, Yen-Ju , WU, Wen-Chou , CHEN, Nan-Cheng
IPC分类号： H01Q1/22 , H01Q15/00 , H01Q15/10 , H01Q19/06
摘要： A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

7. 发明公开

EP3477770A1 RADAR MODULE INCORPORATED WITH A PATTERN-SHAPING DEVICE 有权
公开(公告)号：EP3477770A1
公开(公告)日：2019-05-01
申请号：EP18199164.7
申请日：2018-10-08
申请人： MEDIATEK INC.
发明人： LU, Yen-Ju , HUNG, Chih-Ming , WU, Wen-Chou
IPC分类号： H01Q1/38 , H01Q1/22 , H01Q1/40 , H01Q1/48 , H01Q1/52 , H01Q19/00 , H01Q17/00 , H01Q15/14 , G01S7/03 , G01S13/93 , G01S7/02
摘要： A radar module includes a printed circuit board, PCB (100); and a semiconductor package (1) mounted on the PCB. The semiconductor package comprises an integrated circuit die (20) and a substrate (10) for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer (110) integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device (2) is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

8. 发明公开

EP3451001A1 OVER THE AIR WIRELESS TEST SYSTEM FOR TESTING MICROELECTRONIC DEVICES INTEGRATED WITH ANTENNA 有权转让
公开(公告)号：EP3451001A1
公开(公告)日：2019-03-06
申请号：EP18189727.3
申请日：2018-08-20
申请人： MediaTek Inc.
发明人： LU, Yen-Ju , HUNG, Chih-Ming , WU, Wen-Chou , CHEN, Nan-Cheng
IPC分类号： G01R31/28 , G01R31/302 , G01R1/04 , G01R1/24 , G01R29/08
摘要： An over-the-air, OTA, wireless test system includes a container (10), a machine plate (20) disposed on the container (10), a supporter (30) disposed on the machine plate (20), a load board (40) disposed on the supporter (30), a socket (50) disposed on the load board (40), a device under test (60), DUT, installed in the socket (50), and a wave-guiding feature (510, 520, 410, 420) in the socket (50) and the load board (40) configured to pass and guide electromagnetic waves to and/or from an antenna structure (610, 620) of the DUT (60). The wave-guiding feature (510, 520, 410, 420) comprises a wave-guiding channel (510, 520) in the socket defined by a plurality of pogo pins (502) surrounding the antenna structure (610, 620) of the DUT (60). The wave-guiding feature may further comprise a radiation passage (410, 420) in the load board (40) defined by rows of via fence extending through an entire thickness of the load board (40).

9. 发明公开

EP3171376A1 INDUCTOR AND INDUCTOR MODULE 审中-公开
标题翻译：电感和电感模块
公开(公告)号：EP3171376A1
公开(公告)日：2017-05-24
申请号：EP16172858.9
申请日：2016-06-03
申请人： MediaTek Inc.
发明人： CHEN, Huan-Sheng , LU, Yen-Ju , LIN, Chung-Shi , WU, Chien-Hua , LUO, Yan-Bin
IPC分类号： H01F38/14 , H01F27/28
CPC分类号： H01F27/28 , H01F27/2804 , H01F27/29 , H01F38/14
摘要： An inductor module characterized by: a first inductor (L_1), comprising a first inductor area (IA_1); and a second inductor (L_2), comprising a second inductor area (IA_2). A first overlapped area of the first inductor area and a second overlapped area of the second inductor area are overlapped. The second overlapped area comprises at least one first magnetic direction area (MA_1) and at least one second magnetic direction area (MA_2). A ratio between a size of the first magnetic direction area (MA_1) and a size of the second magnetic direction area (MA_2) is a predetermined ratio such that a coupling effect between the first inductor (L_1) and the second inductor (L_2) is lower or equals to a predetermined value.
摘要翻译：一种电感器模块，其特征在于：第一电感器（L_1），其包括第一电感器区域（IA_1）; 和第二电感器（L_2），其包括第二电感器区域（IA_2）。第一电感器区域的第一重叠区域与第二电感器区域的第二重叠区域重叠。第二重叠区域包括至少一个第一磁性方向区域（MA_1）和至少一个第二磁性方向区域（MA_2）。第一磁方向区域（MA_1）的大小与第二磁方向区域（MA_2）的大小之间的比率是预定比率，使得第一电感器（L_1）和第二电感器（L_2）之间的耦合效应是降低或等于预定值。

10. 发明公开

EP4325563A2 SEMICONDUCTOR DEVICES WITH A STRUCTURE CAPABLE OF SUPPRESSING COUPLING NOISE SUPPRESSION 审中-公开
公开(公告)号：EP4325563A2
公开(公告)日：2024-02-21
申请号：EP23185275.7
申请日：2023-07-13
申请人： MediaTek Inc.
发明人： LI, Po-Jui , SUN, Ruey-Bo , LU, Yen-Ju , YEH, Chun-Yuan , LIN, Sheng-Mou
IPC分类号： H01L23/522
摘要： A semiconductor device (100) includes an electronic device (110), a guard trace (120) and a first trace (T1). The guard trace (120) is connecting to a ground layer through a first ground via (G_Via_11). The first trace (T1) is disposed adjacent to the electronic device (110) and the guard trace (120) and includes a first segment. A phase or a direction of a first current signal conducted on the first trace (T1) is changed in the first segment. The electronic device (110) and the first trace (T1) are disposed at different sides of the guard trace (120) and the first ground via (G_Via_11) is beside the first segment.

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