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1. 发明公开

EP4113596A1 HEAT DISSIPATION MEMBER 审中-实审
公开(公告)号：EP4113596A1
公开(公告)日：2023-01-04
申请号：EP21760143.4
申请日：2021-02-25
申请人： Kyocera Corporation
发明人： ABE, Yuichi
IPC分类号： H01L23/427 , F28D15/02 , F28D15/04 , H05K7/20
摘要： A heat dissipation member (1, 1A to 1G) according to the present disclosure includes an intermediate member (30, 30A, 30B), a first member (10, 10F) and a second member (20), each with a plate shape and made of a ceramic. The intermediate member (30, 30A, 30B) includes a plurality of through holes (37) each penetrating through a first surface (301) and a second surface (302), of the intermediate member, located opposite to each other. The first member (10, 10F) includes a first groove portion (11) on a third surface of the first member, facing the first surface (301) of the intermediate member (30, 30A, 30B). The second member (20) includes a plurality of second grooves (21) on a fourth surface facing the second surface (302) of the intermediate member (30, 30A, 30B), and a heat source is arranged on a fifth surface located opposite to the fourth surface.

2. 发明授权

EP2109138B1 HEAT DISSIPATING SUBSTRATE AND ELECTRONIC DEVICE USING THE SAME 有权
标题翻译：散热基板及电子设备
公开(公告)号：EP2109138B1
公开(公告)日：2015-12-23
申请号：EP07860238.0
申请日：2007-12-26
申请人： Kyocera Corporation
发明人： ABE, Yuichi , NAKAMURA, Kiyotaka
IPC分类号： H01L23/36 , H01L23/12 , H01L23/373 , H01L23/498 , H01L23/538 , H01L25/07 , H01L23/367
CPC分类号： H01L23/3735 , H01L23/36 , H01L23/367 , H01L23/49838 , H01L23/5386 , H01L25/072 , H01L2924/0002 , H01L2924/00

3. 发明公开

EP4299509A1 HYDROGEN PRODUCTION DEVICE 审中-实审
公开(公告)号：EP4299509A1
公开(公告)日：2024-01-03
申请号：EP22759835.6
申请日：2022-02-25
申请人： Kyocera Corporation
发明人： ABE, Yuichi , OHKUMA, Takeshi
IPC分类号： C01B13/02 , C01B3/02 , C01B3/06
摘要： A hydrogen production device includes a reaction medium, a container, a heating unit, a water vapor supply unit, and a cooling unit. The container accommodates the reaction medium. The heating unit heats the reaction medium. The water vapor supply unit supplies water vapor to the reaction medium. The cooling unit cools the reaction medium.

4. 发明公开

EP2833402A1 FLOW PATH MEMBER, AND HEAT EXCHANGER AND SEMICONDUCTOR DEVICE USING SAME 审中-公开
标题翻译： ÖUN IT LE MENT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT
公开(公告)号：EP2833402A1
公开(公告)日：2015-02-04
申请号：EP13767597.1
申请日：2013-03-29
申请人： Kyocera Corporation , Kabushiki Kaisha Toyota Jidoshokki
发明人： ABE, Yuichi , NABESHIMA, Yutaka , IWATA, Yoshitaka , MORI, Shogo , KAMIYAMA, Daizo
IPC分类号： H01L23/473
CPC分类号： H01L23/3675 , F28F3/12 , H01L23/145 , H01L23/4334 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Provided are a flow path member that suppresses flow path breakage, a heat exchanger and a semiconductor device using the same. This flow path member (1) has a flow path (5) in which a fluid flows and which is constituted by a lid portion (2), a partition wall portion (3b), a side wall portion (3) and a bottom plate portion (4). At least one of the partition wall portion and the sidewall portion is partly embedded in at least one of the lid portion (2) and the bottom plate portion (4) for direct connection. Therefore, even if a thermal stress is repeatedly developed in the flow path member (1), breakage of junctures (8) of the lid portion (2), the partition wall portion (3b), the side wall portion (3) and the bottom plate portion (4) that constitute the flow path is suppressed, and sealing performance of the flow path (5) is increased. Further, breakage of the flow path (5) can be suppressed even if a high-pressure fluid is passed through the flow path (5), breakage of the flow path due to the thermal stress can be suppressed in a heat exchanger and a semiconductor device using the flow path member (1), heat exchange efficiency can be improved, and reliability can be improved.
摘要翻译：提供抑制流路破裂的流路构件，使用其的热交换器和半导体装置。该流路构件（1）具有流体流动的流路（5），其由盖部（2），分隔壁部（3b），侧壁部（3）和底板部分（4）。分隔壁部分和侧壁部分中的至少一个部分地嵌入到盖部分（2）和底板部分（4）中的至少一个中用于直接连接。因此，即使在流路构件（1）中重复显示热应力，盖部（2），分隔壁部（3b），侧壁部（3）和接头（8）的接合部（8）构成流路的底板部（4）被抑制，并且流路（5）的密封性能提高。此外，即使高压流体通过流路（5）也能够抑制流路（5）的破损，能够抑制热交换器和半导体中的热应力引起的流路的破裂使用流路构件（1）的装置，可以提高热交换效率，并且可以提高可靠性。

5. 发明公开

EP2393110A1 HEAT DISSIPATING BASE BODY AND ELECTRONIC DEVICE USING SAME 审中-公开
标题翻译：可口可乐公司GRUNDKÖRPERUND ELEKTRONISCHESGERÄTDAMIT
公开(公告)号：EP2393110A1
公开(公告)日：2011-12-07
申请号：EP10735894.7
申请日：2010-01-29
申请人： Okutec Co., Ltd. , Kyocera Corporation
发明人： OKUMURA, Katsuya , ABE, Yuichi , NAKAMURA, Kiyotaka , TANIGUCHI, Youhei
IPC分类号： H01L23/36 , H01L23/13 , H05K7/20
CPC分类号： H01L23/373 , H01L23/3735 , H01L23/3736 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K7/20481 , H05K7/20509 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Provided is a heat radiation base body having excellent heat radiation characteristics, in which, first metal layers 31 and 32 containing at least one metal element selected from titanium, zirconium, hafnium, and niobium; heat conductive layers 41 and 42 containing carbon as main components; and second metal layers 51 and 52 are sequentially laminated on at least one major surface of a support substrate 21 made of a ceramics from the support substrate side 21. There is also provided an electronic device in which an electronic part is mounted on the second metal layer 51 arranged on a first major surface side in the heat radiation base body 1.
摘要翻译：提供一种具有优异的散热特性的散热基体，其中包含至少一种选自钛，锆，铪和铌的金属元素的第一金属层31和32; 以碳为主要成分的导热层41和42; 并且第二金属层51和52依次层压在从支撑基板侧21由陶瓷制成的支撑基板21的至少一个主表面上。还提供了一种电子器件，其中电子部件安装在第二金属布置在散热基体1的第一主表面侧的层51。

6. 发明公开

EP4187587A1 CIRCUIT BOARD, AND METHOD FOR PRODUCING CIRCUIT BOARD 审中-实审
公开(公告)号：EP4187587A1
公开(公告)日：2023-05-31
申请号：EP21845635.8
申请日：2021-07-16
申请人： Kyocera Corporation
发明人： ABE, Yuichi
IPC分类号： H01L23/13 , H01L23/12 , H01L23/36 , H01L25/07 , H01L25/18 , H05K1/02 , H05K1/03 , H05K3/10
摘要： A circuit board (1) includes a ceramic substrate (2) having a flat plate shape and a metal plate (3) bonded to one main surface of the ceramic substrate (2) and including a predetermined circuit pattern. An outer peripheral surface (3c) of the metal plate (3) includes a protruding portion (11) protruding outward and a pair of recessed surfaces (12) provided at both sides of the protruding portion (11).

7. 发明公开

EP4300573A1 THERMAL DEVICE 审中-实审
公开(公告)号：EP4300573A1
公开(公告)日：2024-01-03
申请号：EP22759602.0
申请日：2022-02-21
申请人： Kyocera Corporation
发明人： FUJITA, Naoya , HIRANO, Yoshinori , ABE, Yuichi , NABESHIMA, Yutaka
IPC分类号： H01L23/427 , F28D15/02 , H05K7/20
摘要： A thermal device according to the present disclosure includes a ceramic container, a fluid, and a sealing portion. The container includes an internal space, an opening portion connected to the internal space, and a communication path configured to connect the internal space and the opening portion. The fluid is located in the internal space. The sealing portion blocks the opening portion. The sealing portion includes a core portion and a flange connected to the core portion. The flange is bonded to the container around the opening portion. The core portion is located inside the opening portion. A portion of the core portion is in contact with the wall surface of the opening portion.

8. 发明公开

EP4300572A1 THERMAL DEVICE 审中-实审
公开(公告)号：EP4300572A1
公开(公告)日：2024-01-03
申请号：EP22759489.2
申请日：2022-02-17
申请人： Kyocera Corporation
发明人： ABE, Yuichi
IPC分类号： H01L23/427 , F28D15/02 , H05K7/20
摘要： A thermal device according to the present disclosure is a thermal device that utilizes latent heat of a phase transformation substance. The thermal device according to the present disclosure includes a ceramic container and a sealing portion. The ceramic container includes a phase transformation region in which the phase transformation substance is sealed, a frame region surrounding the phase transformation region, and a communication path configured to connect the phase transformation region with the outside. The sealing portion blocks the communication paths. The communication path is located in the frame region.

9. 发明公开

EP2284883A1 HEAT DISSIPATING BASE BODY AND ELECTRONIC DEVICE USING THE SAME 审中-公开
标题翻译：散热基体和那些用于电子设备
公开(公告)号：EP2284883A1
公开(公告)日：2011-02-16
申请号：EP09736074.7
申请日：2009-04-24
申请人： Kyocera Corporation
发明人： ABE, Yuichi , ISHIMINE, Yuusaku , NAKAO, Yuuya , NAKAMURA, Kiyotaka , MORIYAMA, Masayuki
IPC分类号： H01L23/36 , H01L23/12
CPC分类号： H01L23/3735 , H01L23/5386 , H01L2924/0002 , H01L2924/00
摘要： In a conventional heat dissipating base body, when a supporting substrate and a circuit member are joined, the supporting substrate is greatly warped. In order to solve this problem, there is provided a heat dissipating base body (1) including a supporting substrate (2) having a first main surface and a second main surface facing the first main surface, a first intermediate layer located on the first main surface, a second intermediate layer located on the second main surface, a circuit member (22) located on the first intermediate layer, and a heat dissipating member (23) located on the second intermediate layer, at least one of the first intermediate layer and the second intermediate layer having an inner layer (31, 32) and an outer layer (41, 42) located away from the inner layer (31, 32) to the supporting substrate (2), and the inner layer (31, 32) having a melting point lower than that of the outer layer (41, 42).

10. 发明公开

EP2157607A1 LAMINATED HEAT DISSIPATING BASE BODY, AND HEAT DISSIPATING UNIT AND ELECTRONIC DEVICE USING THE LAMINATED HEAT DISSIPATING BASE BODY 审中-公开
标题翻译：叠层式散热基体和除热单元和电子设备层压与散热基体
公开(公告)号：EP2157607A1
公开(公告)日：2010-02-24
申请号：EP08777066.5
申请日：2008-05-30
申请人： Kyocera Corporation
发明人： ABE, Yuichi , NAKAMURA, Kiyotaka
IPC分类号： H01L23/36 , H01L23/12 , H05K1/02
CPC分类号： H05K1/0203 , C04B37/006 , C04B2237/124 , C04B2237/368 , H01L23/3735 , H01L24/48 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/00015 , H01L2924/01012 , H01L2924/01019 , H01L2924/01068 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K1/0306 , H05K1/144 , H05K3/0061 , H05K3/388 , H05K2201/0338 , H05K2201/042 , H05K2201/066 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/01033
摘要： A laminated heat dissipating base body (1) includes first and second bases (21, 22) having insulation properties arranged one above the other to face each other; a heat dissipating member (42) sandwiched between the first and second bases (21, 22); and circuit members (41) disposed on a top surface of the first base (21) arranged above and a bottom surface of the second base (22) arranged below, respectively. A bonding member is interposed at least either between the first base (21) and the heat dissipating member (42) or between the second base (22) and the circuit member (41), and includes an active metal layer (31, 32) containing an active metal disposed on the first and/or second base (21, 22) side thereof, and a bonding layer (51, 52) containing a metal disposed at least either on the heat dissipating member (42) side thereof or on the circuit member (41) side thereof.

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