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1. 发明公开

EP0167033A2 Apparatus for conduction cooling 失效
标题翻译： Vorrichtung zurWärmeableitung。
公开(公告)号：EP0167033A2
公开(公告)日：1986-01-08
申请号：EP85107251.2
申请日：1985-06-14
申请人： International Business Machines Corporation
发明人： Ostergren, Carl David , Paivanas, John Angelo
IPC分类号： H01L23/40 , H01L23/36
CPC分类号： H01L23/4006 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019
摘要： Disclosed is a device to thermally couple a heat dissipating intergrated circuit chip to the heat sink in a thermal conduction module for effective cooling of the chip by minimizing the thermal resistance path from the chip to the sink. The device is a combination of a heat conducting flat based, truncated solid conical disc (23) which is spring (26) loaded on the back of the chip (20) and a heat conductive hat member (27) having an opening with a continuous tapered wall (28) to conformally fit over the truncated conical disc (23). The gap between the disc (23) and the hat (27) is packed with a thin layer of a high thermal conductivity grease (33) to provide a low interfacial thermal resistance and mechanical flexibility between the disc (23) and the hat (27). For additional cooling enhancement of the chip (20), at the interface between the chip back surface and the base of the disc (23) a self-healing alloy (34) having a high thermal conductivity and low melting point is provided.
摘要翻译：公开了一种用于将散热集成电路芯片热耦合到热传导模块中的散热器的装置，用于通过最小化从芯片到水槽的热阻路径来有效地冷却芯片。该装置是一个传导平面的，截头圆锥形盘片（23）的组合，该圆锥形盘片（23）是装在芯片（20）背面的弹簧（26）和一个具有连续开口的开口的导热帽子（27）锥形壁（28）以保形装配在截头锥形盘（23）上。盘（23）和帽（27）之间的间隙填充有高导热性油脂（33）的薄层，以在盘（23）和帽（27）之间提供低界面热阻和机械柔性）。为了进一步提高芯片（20）的冷却效果，在芯片背面与盘基体（23）的界面处，提供了具有高导热性和低熔点的自愈合金（34）。

2. 发明公开

EP0026336A3 Contactless lifting device 失效
标题翻译：无连接提升装置
公开(公告)号：EP0026336A3
公开(公告)日：1981-04-22
申请号：EP80105151
申请日：1980-08-29
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran , Paivanas, John Angelo
IPC分类号： B66C01/02 , B65G47/91
CPC分类号： B66C1/0218 , B66C1/0268
摘要： A contactless air film pick-up device utilizes the Bernoulli pressure-velocity relationship to provide a pick-up action, and, at the same time, generates a lateral restraining force centering the picked-up object. An air outlet opening (22) in the center of a flow boundary surface is surrounded by intake means (25) ahd, in a radially wider distance, by outlet means (27, 29). The lifting force is provided by air flow through the outlet opening (22), the centering force is generated by air flowfrom the outlet means (27,29) to the intake means (25).

3. 发明公开

EP0026337A2 Verfahren zum Ätzen von Werkstücken in einer Vakuumkammer 失效
标题翻译：工件的蚀刻在真空室中的方法。
公开(公告)号：EP0026337A2
公开(公告)日：1981-04-08
申请号：EP80105152.5
申请日：1980-08-29
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran, , Paivanas, John Angelo
IPC分类号： H01J37/32 , C23F1/00 , H01L21/302
CPC分类号： H01J37/3244 , C23C14/34 , C23F4/00
摘要： Zur verbesserten Verwirbelung des Gases in der Reaktionszone (21) einer Vakuumkammer werden der Zuführdruck des Gases und die Düsen zurZufuhr des Gases so bemessen, daß das Gas mit Schallgeschwindigkeit aus den Düsen austritt. Hierzu wird bei Einhaltung eines Druckbereiches von 0,07 bis 0,7 bar bei der Gaszufuhr in die Düsenleitung ein Verhältnis zwischen Länge und Querschnitt der die Düsen bildenden Leitungen (Nuten 51) im Bereich von 0,2 bis 0,4 x 10 4 mm -1 gewählt.
摘要翻译：为了改善气体的供给压力和供给气体的喷嘴的一个真空室的反应区（21）中的气体的湍流是使得气体出口与喷嘴声速。为此，同时保持压力范围从0.07到在气体供给管到喷嘴0.7巴，长度和喷嘴形成线的横截面之间的比在0.2至0.4×10 <4的范围（槽51） >毫米< - >¹选择。

4. 发明授权

EP0026337B2 Verfahren zum Ätzen von Werkstücken in einer Vakuumkammer 失效
标题翻译：用于处理真空室中工作原理的工艺和装置
公开(公告)号：EP0026337B2
公开(公告)日：1988-06-15
申请号：EP80105152.5
申请日：1980-08-29
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran, , Paivanas, John Angelo
IPC分类号： H01J37/32 , C23F1/00 , H01L21/302
CPC分类号： H01J37/3244 , C23C14/34 , C23F4/00

5. 发明授权

EP0043457B1 Air film transportation device 失效
标题翻译： AIR FILM运输设备
公开(公告)号：EP0043457B1
公开(公告)日：1986-04-23
申请号：EP81104436.1
申请日：1981-06-10
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran , Paivanas, John Angelo
IPC分类号： B65G51/00 , H01L21/68
CPC分类号： B65G51/03 , H01L21/67784

6. 发明授权

EP0054899B1 Air film conveyor for transporting semiconductor chips 失效
标题翻译：用于运输半导体灯的空气膜输送机
公开(公告)号：EP0054899B1
公开(公告)日：1984-10-24
申请号：EP81110482.7
申请日：1981-12-16
申请人： International Business Machines Corporation
发明人： DeRobertis, Ignatius Joseph , Hassan, Javathu Kutikaran , Judge, Robert Lewis , Paivanas, John Angelo
IPC分类号： B65G51/02
CPC分类号： H01L21/67784 , B65G51/03

7. 发明公开

EP0109080A1 Pick-up head for moving a sheet of material 失效
标题翻译：拾取头用于移动片材。
公开(公告)号：EP0109080A1
公开(公告)日：1984-05-23
申请号：EP83111346.9
申请日：1983-11-14
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kuttikaran , Paivanas, John Angelo
IPC分类号： H01L21/68 , B65H3/14 , H01L21/00 , B65G47/91 , B66C1/02
CPC分类号： H01L21/6838
摘要： An aspirator jet suction pick-up device for handling and moving green sheets or other flexible materials employs a source of gas under positive pressure into the head with exhaust via a network of slots (32) disposed along the pick-up surface (12) of the head. As the gas exhausts through the ends of the slots via a manifold or plenum (22), an open groove (34) on the pick-up surface (12) entrains aspirated air causing a localized suction force. The suction force due to aspiration uniformly and stably holds a flexible sheet on the pick-up surface (12).

8. 发明公开

EP0039079A1 Air track system 失效
标题翻译： Luftkissen-Transportsystem。
公开(公告)号：EP0039079A1
公开(公告)日：1981-11-04
申请号：EP81103160.8
申请日：1981-04-28
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kutikaran , Paivanas, John Angelo
IPC分类号： B65G51/02 , H05K13/02 , H01L21/68
CPC分类号： B65G51/03 , H01L21/67784
摘要： An air track system, preferably of axi-radial air tracks (22,23) with novel sections rotatable about a transverse axis in the plane of the track and normal to the travel of the objects, hereafter referred to as swivelators (30). Certain of the swivelators are formed with axial movable portions capable of moving beyond the plane of the air track surface and returning to the plane, so that these swivelators can pick up and set down objects (14) in predetermined positions in the manufacturing processing station (20,21) with an air force so as to not make physical contact with the objects. A novel gas lock device is positioned in the air track between those processing stations, in which the gas pressure must be separated so asto essentially eliminate the possibility of gas contaminant passing from one station to the next. The gas lock comprises an air track compartment having closable sides or panels in the path of the travel of the object being transported alongthe airtrack.
摘要翻译：空气轨道系统，优选地具有轴向径向空气轨道（22,23），其具有可围绕轨道的平面中的横向轴线旋转并且垂直于物体的行进的新颖部分（22,33），此后称为旋转器（30）。某些旋转器形成有能够移动超过空气轨道表面的平面并返回到平面的轴向可移动部分，使得这些旋转器可以在制造处理站中的预定位置拾取和放下物体（14） 20,21）与空军，以不与物体接触。一种新型的气体锁定装置位于这些处理站之间的空气轨道中，其中必须分离气体压力，以便基本上消除气体污染物从一个站到下一个站的可能性。气锁包括在沿着空气轨道运输的物体的行进路径中的可封闭的侧面或面板的空气轨道舱。

9. 发明授权

EP0109080B1 Pick-up head for moving a sheet of material 失效
标题翻译：用于移动材料的拾取头
公开(公告)号：EP0109080B1
公开(公告)日：1987-07-22
申请号：EP83111346.9
申请日：1983-11-14
申请人： International Business Machines Corporation
发明人： Hassan, Javathu Kuttikaran , Paivanas, John Angelo
IPC分类号： H01L21/68 , B65H3/14 , H01L21/00 , B65G47/91 , B66C1/02
CPC分类号： H01L21/6838

10. 发明公开

EP0167033A3 Apparatus for conduction cooling 失效
标题翻译：导电冷却装置
公开(公告)号：EP0167033A3
公开(公告)日：1987-03-25
申请号：EP85107251
申请日：1985-06-14
申请人： International Business Machines Corporation
发明人： Ostergren, Carl David , Paivanas, John Angelo
IPC分类号： H01L23/40 , H01L23/36
CPC分类号： H01L23/4006 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019
摘要： Disclosed is a device to thermally couple a heat dissipating intergrated circuit chip to the heat sink in a thermal conduction module for effective cooling of the chip by minimizing the thermal resistance path from the chip to the sink. The device is a combination of a heat conducting flat based, truncated solid conical disc (23) which is spring (26) loaded on the back of the chip (20) and a heat conductive hat member (27) having an opening with a continuous tapered wall (28) to conformally fit over the truncated conical disc (23). The gap between the disc (23) and the hat (27) is packed with a thin layer of a high thermal conductivity grease (33) to provide a low interfacial thermal resistance and mechanical flexibility between the disc (23) and the hat (27). For additional cooling enhancement of the chip (20), at the interface between the chip back surface and the base of the disc (23) a self-healing alloy (34) having a high thermal conductivity and low melting point is provided.

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