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1. 发明公开

EP3968033A1 MAGNETIC CURRENT SENSOR INTEGRATION INTO HIGH CURRENT CONNECTOR DEVICE 审中-公开
公开(公告)号：EP3968033A1
公开(公告)日：2022-03-16
申请号：EP21196521.5
申请日：2021-09-14
申请人： Infineon Technologies AG
发明人： AICHRIEDLER, Leo , FORMATO, Gaetano , SPITZER, Dietmar , UGALE, Ramdas
IPC分类号： G01R15/20 , G01R19/165
摘要： A power connector is provided that is configured to conduct a current. The power connector includes a conductive frame including a base structure, an extension structure, and a cap structure that define a connector volume. The base structure is coupled to an output node of a primary conductor and receives the current from the primary conductor. The cap structure is configured to mechanically couple the power connector to a load and outputs the current from the power connector to the load. The extension structure is coupled to and extends between the base structure and the cap structure. The extension structure includes a current constriction region configured to cause a defined magnetic field of the current flowing through the current constriction region at a position of a magnetic current sensor that generates a sensor signal based on the defined magnetic field produced by the current flowing through the current constriction region.

2. 发明公开

EP4280277A1 POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE ARRANGEMENT 审中-公开
公开(公告)号：EP4280277A1
公开(公告)日：2023-11-22
申请号：EP22173416.3
申请日：2022-05-16
申请人： Infineon Technologies AG
发明人： ARENS, Andre , DE BOCK, Jens , SPITZER, Dietmar , ZHANG, Xi
IPC分类号： H01L25/16 , G01R15/18 , G01R15/20 , H01L23/62 , H01L25/07
摘要： A power semiconductor module arrangement comprises a housing (7), a substrate (10) comprising a substrate layer (11) and a first metallization layer (111) deposited on a first side of the substrate layer (11), and arranged inside the housing (7) or forming a bottom of the housing (7); a printed circuit board (81) arranged inside the housing (7), vertically above and in parallel to the substrate (10); a plurality of electrically conducting components arranged on the printed circuit board (81) and on the substrate (10), an encapsulant (5) at least partly filling the interior of the housing (7), thereby covering the substrate (10), and a magnetic field sensor (900) configured to detect the strength of a magnetic field; wherein either the magnetic field sensor (900) is arranged on the substrate (10) within the range of a magnetic field caused by a current flowing through one of the electrically conducting components (950) arranged on the printed circuit board (81), or the magnetic field sensor (900) is arranged on the printed circuit board (81) within the range of a magnetic field caused by a current flowing through one of the electrically conducting components (950) arranged on the substrate (10), the magnetic field sensor (900) is electrically insulated from the respective electrically conducting component (950), and the power semiconductor module arrangement further comprises evaluation means configured to determine the current flowing through the electrically conducting component (950) based on the strength of the magnetic field detected by the magnetic field sensor (900).

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