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1. 发明公开

EP2684007A1 THREE DIMENSIONAL TRANSDUCER 有权
标题翻译：维度转换器
公开(公告)号：EP2684007A1
公开(公告)日：2014-01-15
申请号：EP12755144.8
申请日：2012-03-09
申请人： Hysitron, Inc.
发明人： WARREN, Oden Lee , ASIF, Syed Amanulla Syed , OH, Yunje , FENG, Yuxin , CYRANKOWSKI, Edward , MAJOR, Ryan
IPC分类号： G01B7/16
CPC分类号： G01B7/16 , G01D5/2417 , G01L5/165 , G01N3/42 , G01N2203/0286 , G01Q60/366
摘要： A testing instrument for mechanical testing at nano or micron scale includes a transducer body, and a coupling shaft coupled with a probe tip. A transducer body houses a capacitor. The capacitor includes first and second counter electrodes and a center electrode assembly interposed therebetween. The center electrode assembly is movable with the coupling shaft relative to the first and second counter electrodes, for instance in one or more of dimensions including laterally and normally. The center electrode assembly includes a center plate coupled with the coupling shaft and one or more springs extending from the center plate. Upper and lower plates are coupled with the center plate and cover the center plate and the one or more springs. A shaft support assembly includes one or more support elements coupled along the coupling shaft. The shaft support assembly provides lateral support to the coupling shaft.

2. 发明公开

EP2786116A1 HIGH TEMPERATURE HEATING SYSTEM 有权转让
标题翻译：高温加热系统
公开(公告)号：EP2786116A1
公开(公告)日：2014-10-08
申请号：EP12853965.7
申请日：2012-11-28
申请人： Hysitron, Inc.
发明人： OH, Yunje , ASIF, Syed Amanulla Syed , CYRANKOWSKI, Edward , KERANEN, Lucas Paul , MAJOR, Ryan , MISIAK, Maciej W. , WARREN, Oden Lee
IPC分类号： G01N3/54
摘要： A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.
摘要翻译：用于微米或更小尺度的机械测试的加热系统包括舞台加热器。舞台加热器具有舞台平面，舞台加热元件分布在舞台平面上。两个或两个以上的支架安装在舞台平面的相对两侧。第一桥从平台平面延伸到两个或更多支撑安装座中的第一安装座，并且第二桥从平台平面延伸到两个或更多个支撑安装座中的第二安装座。第一桥和第二桥在台平面与两个或更多个支撑座之间提供多个支撑件以相应地支撑台平面。在另一个示例中，加热系统包括配置成加热探针作为机械测试的一部分的探针加热器。

3. 发明公开

EP2673901A2 NANOMECHANICAL TESTING SYSTEM 有权转让
标题翻译：纳米力学测试系统
公开(公告)号：EP2673901A2
公开(公告)日：2013-12-18
申请号：EP12745280.3
申请日：2012-02-10
申请人： Hysitron, Inc.
发明人： VODNICK, David J. , DWIVEDI, Arpit , KERANEN, Lucas Paul , OKERLUND, Michael David , SCHMITZ, Roger , WARREN, Oden Lee , YOUNG, Christopher David
IPC分类号： H04B15/00
CPC分类号： G01P21/00 , G01B11/27 , G01B21/047 , G01N3/02 , G01N3/42 , G01N19/00 , G01N2203/0082 , G01N2203/0286 , G01Q40/00 , G01Q60/366 , Y10T29/49826
摘要： An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.

4. 发明授权

EP2684007B1 THREE DIMENSIONAL TRANSDUCER 有权
标题翻译：维度转换器
公开(公告)号：EP2684007B1
公开(公告)日：2016-03-09
申请号：EP12755144.8
申请日：2012-03-09
申请人： Hysitron, Inc.
发明人： WARREN, Oden Lee , ASIF, Syed Amanulla Syed , OH, Yunje , FENG, Yuxin , CYRANKOWSKI, Edward , MAJOR, Ryan
IPC分类号： G01Q60/36
CPC分类号： G01B7/16 , G01D5/2417 , G01L5/165 , G01N3/42 , G01N2203/0286 , G01Q60/366

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