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    • 1. 发明公开
    • An inpsb channel hemt on inp for rf applications
    • HEMT mit InPSb-Kanal auf InPfürRF-Anwendungen
    • EP1069622A1
    • 2001-01-17
    • EP00114586.1
    • 2000-07-07
    • Hughes Electronics Corporation
    • Matloubian, MehranDocter, DanielMicovic, Miroslav
    • H01L29/778
    • H01L29/201H01L29/7787
    • A high electron mobility transistor (HEMT) (10) includes a substrate (11) comprising indium phosphide and an optional buffer layer (12) immediately adjacent the substrate (11). A channel layer (13) immediately is adjacent the buffer layer (12), with the channel layer (13) comprising indium phosphide antimonide and characterized by a formula of InP x Sb (1-x) , wherein x is about 0.85. The channel layer (13) has a thickness of about 120 Angstroms. A Schottky layer (14) is immediately adjacent the channel layer (13) and a contact layer (15) is immediately adjacent the Schottky layer (14). The transistor (10) is characterized by a breakdown field of about 400kV/cm and a saturated velocity of about 8.2 x 10 6 cm/s.
    • 高电子迁移率晶体管(HEMT)(10)包括包含磷化铟的衬底(11)和紧邻衬底(11)的任选的缓冲层(12)。 沟道层(13)立即与缓冲层(12)相邻,沟道层(13)包含磷化铟锑化物,并以InPxSb(1-x)的方式表征,其中x为约0.85。 沟道层(13)具有约120埃的厚度。 肖特基层(14)紧邻沟道层(13),接触层(15)紧邻肖特基层(14)。 晶体管(10)的特征在于约400kV / cm的击穿场和约8.2×10 6 cm / s的饱和速度。