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1. 发明公开

EP3229101A1 COMMUNICATION DEVICE AND SINGLE BOARD FOR SAME 有权
标题翻译：通信设备和单板相同
公开(公告)号：EP3229101A1
公开(公告)日：2017-10-11
申请号：EP16734917.4
申请日：2016-01-06
申请人： Huawei Technologies Co. Ltd.
发明人： LIU, Changyi , FEI, Xudong , YAO, Xidong
IPC分类号： G06F1/18
CPC分类号： H04B3/54 , G06F1/18 , G06F1/203 , G06F1/206 , H04L12/40039 , H05K7/1492 , H05K7/20209
摘要： Embodiments of the present invention disclose a communications device and a board used in the communications device. The communications device includes: a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.
摘要翻译：本发明的实施例公开了通信设备和通信设备中使用的板。通信设备包括：容器，至少一个电源模块，至少一个温度调节模块和多个电路板。容器被配置为容纳至少一个温度调节模块和多个板，并且容器进一步被配置为容纳功率总线层。功率总线层连接到至少一个功率模块，至少一个温度调节模块和多个板。所述至少一个功率模块被配置为通过使用所述功率总线层向所述至少一个温度调节模块和所述多个板提供功率。多个板，至少一个功率模块和至少一个温度调节模块之间的至少部分通信通过使用功率总线层以电力线通信方式执行。

2. 发明公开

EP4040772A1 IMAGE CAPTURE DEVICE AND COMMUNICATION DEVICE 审中-公开
公开(公告)号：EP4040772A1
公开(公告)日：2022-08-10
申请号：EP20880060.7
申请日：2020-10-22
申请人： Huawei Technologies Co., Ltd.
发明人： YAO, Xidong , WANG, Yeren , TONG, Bingbing
IPC分类号： H04N5/225 , G03B17/55
摘要： This application provides a photographing device and a communication device. The photographing device includes a housing, configured to carry an electronic component of the photographing device, such as a lens module and an expansion module. A lens cavity and an expansion cavity isolated from each other are disposed in the housing. The lens module is disposed in the lens cavity, a heat dissipation apparatus is disposed in the expansion cavity, and the expansion module is disposed on the heat dissipation apparatus and is thermally connected to the heat dissipation apparatus. In addition, the disposed heat dissipation apparatus is further thermally connected to the lens module. A heat dissipation channel isolated from the expansion cavity is disposed in the heat dissipation apparatus. Therefore, an effect of dissipating heat from the expansion module and the lens module may be improved through air flowing in the heat dissipation channel. It can be learned from the foregoing description that in the photographing device provided in embodiments of this application, a structure of the photographing device is divided into different functional modules, and both the lens module and the expansion module can be assembled in the housing by using the disposed heat dissipation apparatus, thereby improving security and a heat dissipation effect of the electronic component.

3. 发明公开

EP3927126A1 HEAT DISSIPATION METHOD, HEAT DISSIPATION APPARATUS, AND SERVER CABINET 审中-实审
公开(公告)号：EP3927126A1
公开(公告)日：2021-12-22
申请号：EP20768884.7
申请日：2020-02-14
申请人： Huawei Technologies Co., Ltd.
发明人： YAO, Xidong , SUN, Xiaoguang , LU, Dongming
IPC分类号： H05K7/20
摘要： This application relates to the field of server technologies, and in particular, to a heat dissipation method, a heat dissipation apparatus, and a cabinet, to reduce a size limitation on the cabinet while heat dissipation requirements of servers are met. The cabinet includes a body and a heat dissipation apparatus. A plurality of installation slots for servers to enter along a preset installation direction are disposed on the body. The heat dissipation apparatus is configured to perform heat dissipation on devices of the servers, the heat dissipation apparatus is disposed on at least one side of the body along the installation direction, and the heat dissipation apparatus is connected to the devices of the servers. In this way, heat dissipation is performed on each server in the body, and space reserved between two adjacent rows of cabinets can be effectively used to reduce occupation of space in a left-right direction or an up-down direction in the body, thereby reducing limitation on a size of the cabinet and a size of a device in the cabinet.

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